nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Accurate negative bias temperature instability lifetime prediction based on hole injection
|
Teramoto, Akinobu |
|
2008 |
48 |
10 |
p. 1649-1654 6 p. |
artikel |
2 |
An explanation of the dependence of the effective saturation velocity on gate voltage in sub-0.1μm metal–oxide–semiconductor transistors by quasi-ballistic transport theory
|
Lau, W.S. |
|
2008 |
48 |
10 |
p. 1641-1648 8 p. |
artikel |
3 |
A note on “using intuitionistic fuzzy sets for fault-tree analysis on printed circuit board assembly”
|
Li, Deng-Feng |
|
2008 |
48 |
10 |
p. 1741- 1 p. |
artikel |
4 |
Calendar
|
|
|
2008 |
48 |
10 |
p. I-II nvt p. |
artikel |
5 |
Characterization of defects in flexible circuits with ultrasonic atomic force microscopy
|
Nalladega, Vijayaraghava |
|
2008 |
48 |
10 |
p. 1683-1688 6 p. |
artikel |
6 |
Dynamic study of the thermal laser stimulation response on advanced technology structures
|
Reverdy, A. |
|
2008 |
48 |
10 |
p. 1689-1695 7 p. |
artikel |
7 |
Effect of crystallographic defects on the reverse performance of 4H–SiC JBS diodes
|
Grekov, A. |
|
2008 |
48 |
10 |
p. 1664-1668 5 p. |
artikel |
8 |
Effects of continuously applied stress on tin whisker growth
|
Lin, Chih-Kuang |
|
2008 |
48 |
10 |
p. 1737-1740 4 p. |
artikel |
9 |
Electrothermal compact macromodel of monolithic switching voltage regulator MC34063A
|
Zarębski, Janusz |
|
2008 |
48 |
10 |
p. 1703-1710 8 p. |
artikel |
10 |
FPGA-based switch-level fault emulation using module-based dynamic partial reconfiguration
|
Lee, Peter Ming-Han |
|
2008 |
48 |
10 |
p. 1724-1733 10 p. |
artikel |
11 |
Fractal description of dendrite growth during electrochemical migration
|
Dominkovics, Csaba |
|
2008 |
48 |
10 |
p. 1628-1634 7 p. |
artikel |
12 |
Heat dissipation effect of Al plate embedded substrate in network system
|
Cho, Seung Hyun |
|
2008 |
48 |
10 |
p. 1696-1702 7 p. |
artikel |
13 |
High-temperature performance of AlGaN/GaN HFETs and MOSHFETs
|
Donoval, D. |
|
2008 |
48 |
10 |
p. 1669-1672 4 p. |
artikel |
14 |
High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization
|
Johannessen, Rolf |
|
2008 |
48 |
10 |
p. 1711-1719 9 p. |
artikel |
15 |
Inside front cover - Editorial board
|
|
|
2008 |
48 |
10 |
p. IFC- 1 p. |
artikel |
16 |
Investigation of diode geometry and metal line pattern for robust ESD protection applications
|
Li, You |
|
2008 |
48 |
10 |
p. 1660-1663 4 p. |
artikel |
17 |
Key reliability concerns with lead-free connectors
|
Shibutani, Tadahiro |
|
2008 |
48 |
10 |
p. 1613-1627 15 p. |
artikel |
18 |
Leakage currents and dielectric breakdown of Si1−x−y Ge x C y thermal oxides
|
Cuadras, A. |
|
2008 |
48 |
10 |
p. 1635-1640 6 p. |
artikel |
19 |
Negative bias temperature instability (NBTI) recovery with bake
|
Katsetos, Anastasios A. |
|
2008 |
48 |
10 |
p. 1655-1659 5 p. |
artikel |
20 |
[No title]
|
Stojcev, Mile |
|
2008 |
48 |
10 |
p. 1744-1745 2 p. |
artikel |
21 |
[No title]
|
Stojcev, Mile |
|
2008 |
48 |
10 |
p. 1742-1743 2 p. |
artikel |
22 |
Saline soak tests to determine the short-term reliability of an in situ thin film resistance temperature detector
|
Post, Julian W. |
|
2008 |
48 |
10 |
p. 1673-1682 10 p. |
artikel |
23 |
Tensile tests of micro anchors anodically bonded between Pyrex glass and aluminum thin film coated on silicon wafer
|
Hu, Yu-Qun |
|
2008 |
48 |
10 |
p. 1720-1723 4 p. |
artikel |
24 |
Two-dimensional dopant profiling in semiconductor devices by electron holography and chemical etching delineation techniques with the same specimen
|
Shaislamov, Ulugbek |
|
2008 |
48 |
10 |
p. 1734-1736 3 p. |
artikel |