| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Application of three-parameter lognormal distribution in EM data analysis
|
Li, Baozhen
|
|
2006
|
46 |
12 |
p. 2049-2055
7 p.
|
artikel
|
| 2 |
A review of gate tunneling current in MOS devices
|
Ranuárez, Juan C.
|
|
2006
|
46 |
12 |
p. 1939-1956
18 p.
|
artikel
|
| 3 |
Assessing the performance of crack detection tests for solder joints
|
Ridout, Stephen
|
|
2006
|
46 |
12 |
p. 2122-2130
9 p.
|
artikel
|
| 4 |
Author Index for Volume 46
|
|
|
2006
|
46 |
12 |
p. XVII-XXII
nvt p.
|
artikel
|
| 5 |
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA
|
Tee, Tong Yan
|
|
2006
|
46 |
12 |
p. 2131-2138
8 p.
|
artikel
|
| 6 |
CCGA packages for space applications
|
Ghaffarian, Reza
|
|
2006
|
46 |
12 |
p. 2006-2024
19 p.
|
artikel
|
| 7 |
Contents of volume 46
|
|
|
2006
|
46 |
12 |
p. III-XVI
nvt p.
|
artikel
|
| 8 |
Current-dependent hot-electron stresses on InGaP-gated and AlGaAs-gated low noise PHEMTs
|
Huang, Hou-Kuei
|
|
2006
|
46 |
12 |
p. 2038-2043
6 p.
|
artikel
|
| 9 |
Determination of thermal resistance using Gummel measurement for InGaP/GaAs HBTs
|
Chang, Yang-Hua
|
|
2006
|
46 |
12 |
p. 2074-2078
5 p.
|
artikel
|
| 10 |
Dynamic hot-carrier induced degradation in n-channel polysilicon thin-film transistors
|
Tassis, D.H.
|
|
2006
|
46 |
12 |
p. 2032-2037
6 p.
|
artikel
|
| 11 |
Effect of annealing on the properties of low-k nanoporous SiO2 films prepared by sol–gel method with catalyst HF
|
He, Z.W.
|
|
2006
|
46 |
12 |
p. 2062-2066
5 p.
|
artikel
|
| 12 |
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration
|
Chen, Kuo-Ming
|
|
2006
|
46 |
12 |
p. 2104-2111
8 p.
|
artikel
|
| 13 |
Electronic circuit reliability modeling
|
Bernstein, Joseph B.
|
|
2006
|
46 |
12 |
p. 1957-1979
23 p.
|
artikel
|
| 14 |
Erratum to “Determining factors affecting ESD failure voltage using DOE” [Microelectron. Reliab. 46 (2006) 1228–1237]
|
Whitman, Charles
|
|
2006
|
46 |
12 |
p. 2160-
1 p.
|
artikel
|
| 15 |
Erratum to “Reliability results of HBTs with an InGaP emitter” [Microelectron. Reliab. 46 (2006) 1261–1271]
|
Whitman, Charles S.
|
|
2006
|
46 |
12 |
p. 2159-
1 p.
|
artikel
|
| 16 |
ESD robustness of thin-film devices with different layout structures in LTPS technology
|
Deng, Chih-Kang
|
|
2006
|
46 |
12 |
p. 2067-2073
7 p.
|
artikel
|
| 17 |
Failure mechanisms of pure silver, pure aluminum and silver–aluminum alloy under high current stress
|
Misra, E.
|
|
2006
|
46 |
12 |
p. 2096-2103
8 p.
|
artikel
|
| 18 |
Hot-electron effects on AlGaAs/InGaAs/GaAs PHEMTs under accelerated DC stresses
|
Huang, Hou-Kuei
|
|
2006
|
46 |
12 |
p. 2025-2031
7 p.
|
artikel
|
| 19 |
Influence of TCE concentration in thermal oxidation on reliability of SiC MOS capacitors under Fowler–Nordheim electron injection
|
Yang, B.L.
|
|
2006
|
46 |
12 |
p. 2044-2048
5 p.
|
artikel
|
| 20 |
Investigations of transient thermal properties of conductively cooled diode laser arrays operating under quasicontinuous-wave conditions
|
Kozlowska, Anna
|
|
2006
|
46 |
12 |
p. 2079-2084
6 p.
|
artikel
|
| 21 |
Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride
|
Wong, C.K.
|
|
2006
|
46 |
12 |
p. 2056-2061
6 p.
|
artikel
|
| 22 |
Novel charge neutralization techniques applicable to wide current range of FIB processing in FIB-SEM combined system
|
Komoda, Hirotaka
|
|
2006
|
46 |
12 |
p. 2085-2095
11 p.
|
artikel
|
| 23 |
Oxidation of Au4Al in un-moulded gold ballbonds after high temperature storage (HTS) in air at 175°C
|
Breach, C.D.
|
|
2006
|
46 |
12 |
p. 2112-2121
10 p.
|
artikel
|
| 24 |
Technologies and reliability of modern embedded flash cells
|
Sikora, Axel
|
|
2006
|
46 |
12 |
p. 1980-2005
26 p.
|
artikel
|
| 25 |
Transistor-level to gate-level comprehensive fault synthesis for n-input primitive gates
|
Sedaghat, Reza
|
|
2006
|
46 |
12 |
p. 2149-2158
10 p.
|
artikel
|
| 26 |
Using intuitionistic fuzzy sets for fault-tree analysis on printed circuit board assembly
|
Shu, Ming-Hung
|
|
2006
|
46 |
12 |
p. 2139-2148
10 p.
|
artikel
|
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