| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film
|
Uddin, M.A.
|
|
2004
|
44 |
3 |
p. 505-514
10 p.
|
artikel
|
| 2 |
A relation model of gate oxide yield and reliability
|
Kim, Kyungmee O.
|
|
2004
|
44 |
3 |
p. 425-434
10 p.
|
artikel
|
| 3 |
A three-parameter Weibull-like fitting function for flip-chip die strength data
|
Zhao, Jie-Hua
|
|
2004
|
44 |
3 |
p. 459-470
12 p.
|
artikel
|
| 4 |
High-performance FCBGA based on multi-layer thin-substrate packaging technology
|
Shimoto, Tadanori
|
|
2004
|
44 |
3 |
p. 515-520
6 p.
|
artikel
|
| 5 |
Improving reliability of poly-Si TFTs with channel layer and gate oxide passivated by NH3/N2O plasma
|
Zeng, Xiangbin
|
|
2004
|
44 |
3 |
p. 435-442
8 p.
|
artikel
|
| 6 |
Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages
|
Gu, Yu
|
|
2004
|
44 |
3 |
p. 471-483
13 p.
|
artikel
|
| 7 |
Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages
|
Zhang, Li
|
|
2004
|
44 |
3 |
p. 533-541
9 p.
|
artikel
|
| 8 |
Power-Constrained Testing of VLSI Circuits. Nikola Nikolici, Bashir M. Al-Hashimi. Kluwer Academic Publishers, Boston, 2003. Hardcover, pp. 178, plus XI, ISBN 1-4020-7235-X, €107
|
Stojcev, Mile
|
|
2004
|
44 |
3 |
p. 547-548
2 p.
|
artikel
|
| 9 |
Prediction of dielectric reliability from I–V characteristics: Poole–Frenkel conduction mechanism leading to √E model for silicon nitride MIM capacitor
|
Allers, K.-H.
|
|
2004
|
44 |
3 |
p. 411-423
13 p.
|
artikel
|
| 10 |
Reliability and performance scaling of very high speed SiGe HBTs
|
Freeman, Greg
|
|
2004
|
44 |
3 |
p. 397-410
14 p.
|
artikel
|
| 11 |
Reliability challenges for copper interconnects
|
Li, Baozhen
|
|
2004
|
44 |
3 |
p. 365-380
16 p.
|
artikel
|
| 12 |
Sample preparation techniques for physical analysis of VLSIs
|
Nakajima, S.
|
|
2004
|
44 |
3 |
p. 449-458
10 p.
|
artikel
|
| 13 |
Soft breakdown of MOS tunnel diodes with a spatially non-uniform oxide thickness
|
Khlil, R.
|
|
2004
|
44 |
3 |
p. 543-546
4 p.
|
artikel
|
| 14 |
Steady-state and dynamic thermal models for heat flow analysis of silicon-on-insulator MOSFETs
|
Cheng, Ming-C.
|
|
2004
|
44 |
3 |
p. 381-396
16 p.
|
artikel
|
| 15 |
Study of front-side connected chemical field effect transistor for water analysis
|
Temple-Boyer, Pierre
|
|
2004
|
44 |
3 |
p. 443-447
5 p.
|
artikel
|
| 16 |
The effect of solder paste composition on the reliability of SnAgCu joints
|
Nurmi, S.
|
|
2004
|
44 |
3 |
p. 485-494
10 p.
|
artikel
|
| 17 |
Thermal stability performance of anisotropic conductive film at different bonding temperatures
|
Tan, S.C.
|
|
2004
|
44 |
3 |
p. 495-503
9 p.
|
artikel
|
| 18 |
WL-CSP reliability with various solder alloys and die thicknesses
|
Keser, Beth
|
|
2004
|
44 |
3 |
p. 521-531
11 p.
|
artikel
|
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