nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film
|
Uddin, M.A. |
|
2004 |
44 |
3 |
p. 505-514 10 p. |
artikel |
2 |
A relation model of gate oxide yield and reliability
|
Kim, Kyungmee O. |
|
2004 |
44 |
3 |
p. 425-434 10 p. |
artikel |
3 |
A three-parameter Weibull-like fitting function for flip-chip die strength data
|
Zhao, Jie-Hua |
|
2004 |
44 |
3 |
p. 459-470 12 p. |
artikel |
4 |
High-performance FCBGA based on multi-layer thin-substrate packaging technology
|
Shimoto, Tadanori |
|
2004 |
44 |
3 |
p. 515-520 6 p. |
artikel |
5 |
Improving reliability of poly-Si TFTs with channel layer and gate oxide passivated by NH3/N2O plasma
|
Zeng, Xiangbin |
|
2004 |
44 |
3 |
p. 435-442 8 p. |
artikel |
6 |
Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages
|
Gu, Yu |
|
2004 |
44 |
3 |
p. 471-483 13 p. |
artikel |
7 |
Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages
|
Zhang, Li |
|
2004 |
44 |
3 |
p. 533-541 9 p. |
artikel |
8 |
Power-Constrained Testing of VLSI Circuits. Nikola Nikolici, Bashir M. Al-Hashimi. Kluwer Academic Publishers, Boston, 2003. Hardcover, pp. 178, plus XI, ISBN 1-4020-7235-X, €107
|
Stojcev, Mile |
|
2004 |
44 |
3 |
p. 547-548 2 p. |
artikel |
9 |
Prediction of dielectric reliability from I–V characteristics: Poole–Frenkel conduction mechanism leading to √E model for silicon nitride MIM capacitor
|
Allers, K.-H. |
|
2004 |
44 |
3 |
p. 411-423 13 p. |
artikel |
10 |
Reliability and performance scaling of very high speed SiGe HBTs
|
Freeman, Greg |
|
2004 |
44 |
3 |
p. 397-410 14 p. |
artikel |
11 |
Reliability challenges for copper interconnects
|
Li, Baozhen |
|
2004 |
44 |
3 |
p. 365-380 16 p. |
artikel |
12 |
Sample preparation techniques for physical analysis of VLSIs
|
Nakajima, S. |
|
2004 |
44 |
3 |
p. 449-458 10 p. |
artikel |
13 |
Soft breakdown of MOS tunnel diodes with a spatially non-uniform oxide thickness
|
Khlil, R. |
|
2004 |
44 |
3 |
p. 543-546 4 p. |
artikel |
14 |
Steady-state and dynamic thermal models for heat flow analysis of silicon-on-insulator MOSFETs
|
Cheng, Ming-C. |
|
2004 |
44 |
3 |
p. 381-396 16 p. |
artikel |
15 |
Study of front-side connected chemical field effect transistor for water analysis
|
Temple-Boyer, Pierre |
|
2004 |
44 |
3 |
p. 443-447 5 p. |
artikel |
16 |
The effect of solder paste composition on the reliability of SnAgCu joints
|
Nurmi, S. |
|
2004 |
44 |
3 |
p. 485-494 10 p. |
artikel |
17 |
Thermal stability performance of anisotropic conductive film at different bonding temperatures
|
Tan, S.C. |
|
2004 |
44 |
3 |
p. 495-503 9 p. |
artikel |
18 |
WL-CSP reliability with various solder alloys and die thicknesses
|
Keser, Beth |
|
2004 |
44 |
3 |
p. 521-531 11 p. |
artikel |