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                             18 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film Uddin, M.A.
2004
44 3 p. 505-514
10 p.
artikel
2 A relation model of gate oxide yield and reliability Kim, Kyungmee O.
2004
44 3 p. 425-434
10 p.
artikel
3 A three-parameter Weibull-like fitting function for flip-chip die strength data Zhao, Jie-Hua
2004
44 3 p. 459-470
12 p.
artikel
4 High-performance FCBGA based on multi-layer thin-substrate packaging technology Shimoto, Tadanori
2004
44 3 p. 515-520
6 p.
artikel
5 Improving reliability of poly-Si TFTs with channel layer and gate oxide passivated by NH3/N2O plasma Zeng, Xiangbin
2004
44 3 p. 435-442
8 p.
artikel
6 Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages Gu, Yu
2004
44 3 p. 471-483
13 p.
artikel
7 Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages Zhang, Li
2004
44 3 p. 533-541
9 p.
artikel
8 Power-Constrained Testing of VLSI Circuits. Nikola Nikolici, Bashir M. Al-Hashimi. Kluwer Academic Publishers, Boston, 2003. Hardcover, pp. 178, plus XI, ISBN 1-4020-7235-X, €107 Stojcev, Mile
2004
44 3 p. 547-548
2 p.
artikel
9 Prediction of dielectric reliability from I–V characteristics: Poole–Frenkel conduction mechanism leading to √E model for silicon nitride MIM capacitor Allers, K.-H.
2004
44 3 p. 411-423
13 p.
artikel
10 Reliability and performance scaling of very high speed SiGe HBTs Freeman, Greg
2004
44 3 p. 397-410
14 p.
artikel
11 Reliability challenges for copper interconnects Li, Baozhen
2004
44 3 p. 365-380
16 p.
artikel
12 Sample preparation techniques for physical analysis of VLSIs Nakajima, S.
2004
44 3 p. 449-458
10 p.
artikel
13 Soft breakdown of MOS tunnel diodes with a spatially non-uniform oxide thickness Khlil, R.
2004
44 3 p. 543-546
4 p.
artikel
14 Steady-state and dynamic thermal models for heat flow analysis of silicon-on-insulator MOSFETs Cheng, Ming-C.
2004
44 3 p. 381-396
16 p.
artikel
15 Study of front-side connected chemical field effect transistor for water analysis Temple-Boyer, Pierre
2004
44 3 p. 443-447
5 p.
artikel
16 The effect of solder paste composition on the reliability of SnAgCu joints Nurmi, S.
2004
44 3 p. 485-494
10 p.
artikel
17 Thermal stability performance of anisotropic conductive film at different bonding temperatures Tan, S.C.
2004
44 3 p. 495-503
9 p.
artikel
18 WL-CSP reliability with various solder alloys and die thicknesses Keser, Beth
2004
44 3 p. 521-531
11 p.
artikel
                             18 gevonden resultaten
 
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