| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Advanced X-ray analysis techniques to investigate aging of micromachined silicon actuators for space application
|
Dommann, A.
|
|
2003
|
43 |
7 |
p. 1099-1103
5 p.
|
artikel
|
| 2 |
A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages
|
Shi, X.Q.
|
|
2003
|
43 |
7 |
p. 1105-1115
11 p.
|
artikel
|
| 3 |
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications
|
Tee, Tong Yan
|
|
2003
|
43 |
7 |
p. 1117-1123
7 p.
|
artikel
|
| 4 |
Calendar of forthcoming events
|
|
|
2003
|
43 |
7 |
p. I-VII
nvt p.
|
artikel
|
| 5 |
Decreasing variation in paste printing using statistical process control
|
Liukkonen, Timo
|
|
2003
|
43 |
7 |
p. 1157-1161
5 p.
|
artikel
|
| 6 |
2D-simulation and analysis of lateral SiC N-emitter SiGe P-base Schottky metal-collector (NPM) HBT on SOI
|
Jagadesh Kumar, M.
|
|
2003
|
43 |
7 |
p. 1145-1149
5 p.
|
artikel
|
| 7 |
Effects of electron and gamma-ray irradiation on CMOS analog image sensors
|
Meng, Xiang-Ti
|
|
2003
|
43 |
7 |
p. 1151-1155
5 p.
|
artikel
|
| 8 |
Erratum to “A simple and fundamental design rule for resisting delamination in bimaterial structures” [Microelectronics Reliability 2003;43:487–494]
|
Moore, Thomas D.
|
|
2003
|
43 |
7 |
p. 1169-
1 p.
|
artikel
|
| 9 |
Harnessing the base-pushout effect for ESD protection in bipolar and BiCMOS technologies
|
Streibl, M.
|
|
2003
|
43 |
7 |
p. 1001-1010
10 p.
|
artikel
|
| 10 |
High frequency characterization and modelling of the parasitic RC performance of two terminal ESD CMOS protection devices
|
Vassilev, V.
|
|
2003
|
43 |
7 |
p. 1011-1020
10 p.
|
artikel
|
| 11 |
High holding current SCRs (HHI-SCR) for ESD protection and latch-up immune IC operation
|
Mergens, Markus P.J.
|
|
2003
|
43 |
7 |
p. 993-1000
8 p.
|
artikel
|
| 12 |
ILP method for memory mapping in high-level synthesis
|
Zhou, Haifeng
|
|
2003
|
43 |
7 |
p. 1163-1167
5 p.
|
artikel
|
| 13 |
MEMS reliability
|
De Wolf, Ingrid
|
|
2003
|
43 |
7 |
p. 1047-1048
2 p.
|
artikel
|
| 14 |
MEMS reliability from a failure mechanisms perspective
|
Merlijn van Spengen, W
|
|
2003
|
43 |
7 |
p. 1049-1060
12 p.
|
artikel
|
| 15 |
Microanalysis and electromigration reliability performance of high current transmission line pulse (TLP) stressed copper interconnects
|
Suat Cheng Khoo, Sherry
|
|
2003
|
43 |
7 |
p. 1039-1045
7 p.
|
artikel
|
| 16 |
New considerations for MOSFET power clamps
|
Poon, Steven S.
|
|
2003
|
43 |
7 |
p. 987-991
5 p.
|
artikel
|
| 17 |
On-chip electrostatic discharge ESD
|
Gieser, Horst A.
|
|
2003
|
43 |
7 |
p. 985-986
2 p.
|
artikel
|
| 18 |
Process influence on product CDM ESD performance
|
Lisenker, Boris
|
|
2003
|
43 |
7 |
p. 1029-1037
9 p.
|
artikel
|
| 19 |
Reliability aspects of microsensors and micromechatronic actuators for automotive applications
|
Müller-Fiedler, Roland
|
|
2003
|
43 |
7 |
p. 1085-1097
13 p.
|
artikel
|
| 20 |
Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations
|
Delétage, J.-Y.
|
|
2003
|
43 |
7 |
p. 1137-1144
8 p.
|
artikel
|
| 21 |
Rohit Kapur, CTL for Test Information of Digital ICs Hardcover. Kluwer Academic Publisher, Boston, 2003. pp. 173, plus XI, 164 Euro ISBN 1-4020-7293-7
|
Stojcev, Mile
|
|
2003
|
43 |
7 |
p. 1171-1172
2 p.
|
artikel
|
| 22 |
Simulator-independent compact modeling of vertical npn transistors for ESD and RF circuit simulation
|
Joshi, Sopan
|
|
2003
|
43 |
7 |
p. 1021-1027
7 p.
|
artikel
|
| 23 |
The advent of MEMS in space
|
Lafontan, X.
|
|
2003
|
43 |
7 |
p. 1061-1083
23 p.
|
artikel
|
| 24 |
Three-dimensional FEM simulations of thermomechanical stresses in 1.55 μm Laser modules
|
Deshayes, Y.
|
|
2003
|
43 |
7 |
p. 1125-1136
12 p.
|
artikel
|
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