| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Accelerated life test calculations using the method of maximum likelihood: an improvement over least squares
|
Whitman, Charles S.
|
|
2003
|
43 |
6 |
p. 859-864
6 p.
|
article
|
| 2 |
Calendar of forthcoming events
|
|
|
2003
|
43 |
6 |
p. I-VIII
nvt p.
|
article
|
| 3 |
Degradation of InGaN blue light-emitting diodes under continuous and low-speed pulse operations
|
Yanagisawa, Takeshi
|
|
2003
|
43 |
6 |
p. 977-980
4 p.
|
article
|
| 4 |
Direct gold and copper wires bonding on copper
|
Ho, Hong Meng
|
|
2003
|
43 |
6 |
p. 913-923
11 p.
|
article
|
| 5 |
High reliability in PHEMT MMICs with dual-etch-stop AlAs layers for high-speed RF switch applications
|
Gao, Frank
|
|
2003
|
43 |
6 |
p. 829-837
9 p.
|
article
|
| 6 |
High-voltage pulse stressing of thick-film resistors and noise
|
Stanimirović, I.
|
|
2003
|
43 |
6 |
p. 905-911
7 p.
|
article
|
| 7 |
Hot electron induced degradation of undoped AlGaN/GaN HFETs
|
Kim, Hyungtak
|
|
2003
|
43 |
6 |
p. 823-827
5 p.
|
article
|
| 8 |
Improvement of integrated circuit testing reliability by using the defect based approach
|
Kasprowicz, Dominik
|
|
2003
|
43 |
6 |
p. 945-953
9 p.
|
article
|
| 9 |
Investigation of short-term current gain stability of GaInP/GaAs-HBTs grown by MOVPE
|
Brunner, F.
|
|
2003
|
43 |
6 |
p. 839-844
6 p.
|
article
|
| 10 |
Manufacturing capability control for multiple power-distribution switch processes based on modified C pk MPPAC
|
Pearn, W.L.
|
|
2003
|
43 |
6 |
p. 963-975
13 p.
|
article
|
| 11 |
[No title]
|
Anderson, Wallace T.
|
|
2003
|
43 |
6 |
p. 821-
1 p.
|
article
|
| 12 |
Novel high performance CMOS current conveyor
|
Calvo, Belén
|
|
2003
|
43 |
6 |
p. 955-961
7 p.
|
article
|
| 13 |
Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability
|
Liu, D.S.
|
|
2003
|
43 |
6 |
p. 935-943
9 p.
|
article
|
| 14 |
Reliability of 100 nm silicon nitride capacitors in an InP HEMT MMIC process
|
Rowe, William J.
|
|
2003
|
43 |
6 |
p. 845-851
7 p.
|
article
|
| 15 |
Room temperature plasma oxidation mechanism to obtain ultrathin silicon oxide and titanium oxide layers
|
Tinoco, J.C.
|
|
2003
|
43 |
6 |
p. 895-903
9 p.
|
article
|
| 16 |
Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls
|
Zheng, Po-Jen
|
|
2003
|
43 |
6 |
p. 925-934
10 p.
|
article
|
| 17 |
The effects of ternary alloys on thermal resistances of HBTs, HEMTs, and laser diodes
|
Paine, Bruce M.
|
|
2003
|
43 |
6 |
p. 853-858
6 p.
|
article
|
| 18 |
The radiation sensitivity mapping of ICs using an IR pulsed laser system
|
Alpat, B.
|
|
2003
|
43 |
6 |
p. 981-984
4 p.
|
article
|
| 19 |
Thin dielectric reliability assessment for DRAM technology with deep trench storage node
|
Vollertsen, R.-P.
|
|
2003
|
43 |
6 |
p. 865-878
14 p.
|
article
|
| 20 |
Wafer level packaging having bump-on-polymer structure
|
Reche, John J.H.
|
|
2003
|
43 |
6 |
p. 879-894
16 p.
|
article
|
Journal description