nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Accelerated life test calculations using the method of maximum likelihood: an improvement over least squares
|
Whitman, Charles S. |
|
2003 |
43 |
6 |
p. 859-864 6 p. |
artikel |
2 |
Calendar of forthcoming events
|
|
|
2003 |
43 |
6 |
p. I-VIII nvt p. |
artikel |
3 |
Degradation of InGaN blue light-emitting diodes under continuous and low-speed pulse operations
|
Yanagisawa, Takeshi |
|
2003 |
43 |
6 |
p. 977-980 4 p. |
artikel |
4 |
Direct gold and copper wires bonding on copper
|
Ho, Hong Meng |
|
2003 |
43 |
6 |
p. 913-923 11 p. |
artikel |
5 |
High reliability in PHEMT MMICs with dual-etch-stop AlAs layers for high-speed RF switch applications
|
Gao, Frank |
|
2003 |
43 |
6 |
p. 829-837 9 p. |
artikel |
6 |
High-voltage pulse stressing of thick-film resistors and noise
|
Stanimirović, I. |
|
2003 |
43 |
6 |
p. 905-911 7 p. |
artikel |
7 |
Hot electron induced degradation of undoped AlGaN/GaN HFETs
|
Kim, Hyungtak |
|
2003 |
43 |
6 |
p. 823-827 5 p. |
artikel |
8 |
Improvement of integrated circuit testing reliability by using the defect based approach
|
Kasprowicz, Dominik |
|
2003 |
43 |
6 |
p. 945-953 9 p. |
artikel |
9 |
Investigation of short-term current gain stability of GaInP/GaAs-HBTs grown by MOVPE
|
Brunner, F. |
|
2003 |
43 |
6 |
p. 839-844 6 p. |
artikel |
10 |
Manufacturing capability control for multiple power-distribution switch processes based on modified C pk MPPAC
|
Pearn, W.L. |
|
2003 |
43 |
6 |
p. 963-975 13 p. |
artikel |
11 |
[No title]
|
Anderson, Wallace T. |
|
2003 |
43 |
6 |
p. 821- 1 p. |
artikel |
12 |
Novel high performance CMOS current conveyor
|
Calvo, Belén |
|
2003 |
43 |
6 |
p. 955-961 7 p. |
artikel |
13 |
Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability
|
Liu, D.S. |
|
2003 |
43 |
6 |
p. 935-943 9 p. |
artikel |
14 |
Reliability of 100 nm silicon nitride capacitors in an InP HEMT MMIC process
|
Rowe, William J. |
|
2003 |
43 |
6 |
p. 845-851 7 p. |
artikel |
15 |
Room temperature plasma oxidation mechanism to obtain ultrathin silicon oxide and titanium oxide layers
|
Tinoco, J.C. |
|
2003 |
43 |
6 |
p. 895-903 9 p. |
artikel |
16 |
Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls
|
Zheng, Po-Jen |
|
2003 |
43 |
6 |
p. 925-934 10 p. |
artikel |
17 |
The effects of ternary alloys on thermal resistances of HBTs, HEMTs, and laser diodes
|
Paine, Bruce M. |
|
2003 |
43 |
6 |
p. 853-858 6 p. |
artikel |
18 |
The radiation sensitivity mapping of ICs using an IR pulsed laser system
|
Alpat, B. |
|
2003 |
43 |
6 |
p. 981-984 4 p. |
artikel |
19 |
Thin dielectric reliability assessment for DRAM technology with deep trench storage node
|
Vollertsen, R.-P. |
|
2003 |
43 |
6 |
p. 865-878 14 p. |
artikel |
20 |
Wafer level packaging having bump-on-polymer structure
|
Reche, John J.H. |
|
2003 |
43 |
6 |
p. 879-894 16 p. |
artikel |