nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A reliable procedure for testing linear regulators with one-sided specification limits based on multiple samples
|
Pearn, W.L |
|
2003 |
43 |
4 |
p. 651-664 14 p. |
artikel |
2 |
A simple four-terminal small-signal model of RF MOSFETs and its parameter extraction
|
Je, Minkyu |
|
2003 |
43 |
4 |
p. 601-609 9 p. |
artikel |
3 |
Calendar of forthcoming events
|
|
|
2003 |
43 |
4 |
p. I-IX nvt p. |
artikel |
4 |
Characterisation of series resistance degradation through charge pumping technique
|
Manhas, S.K |
|
2003 |
43 |
4 |
p. 617-624 8 p. |
artikel |
5 |
Copper metallization influence on power MOS reliability
|
Feybesse, Adeline |
|
2003 |
43 |
4 |
p. 571-576 6 p. |
artikel |
6 |
Diffusion and absorption of corrosive gases in electronic encapsulants
|
Hillman, C |
|
2003 |
43 |
4 |
p. 635-643 9 p. |
artikel |
7 |
Dynamic avalanche and reliability of high voltage diodes
|
Lutz, Josef |
|
2003 |
43 |
4 |
p. 529-536 8 p. |
artikel |
8 |
Effects of hydrogenation on the performance and stability of p-channel polycrystalline silicon thin-film transistors
|
Hastas, N.A. |
|
2003 |
43 |
4 |
p. 671-674 4 p. |
artikel |
9 |
Electron transport in implant isolation GaAs layers
|
Synowiec, Z. |
|
2003 |
43 |
4 |
p. 675-679 5 p. |
artikel |
10 |
Experimental study of charge generation mechanisms in power MOSFETs due to energetic particle impact
|
Velardi, F. |
|
2003 |
43 |
4 |
p. 549-555 7 p. |
artikel |
11 |
Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp., Number of figures and tables 200, EURO 187.00/USD 185.00/GBP 120.00, ISBN 0-7923-7676-5
|
Liu, Johan |
|
2003 |
43 |
4 |
p. 681-683 3 p. |
artikel |
12 |
Impact of the electron, proton and helium irradiation on the forward I–V characteristics of high-power P–i–N diode
|
Vobecký, J |
|
2003 |
43 |
4 |
p. 537-544 8 p. |
artikel |
13 |
Low-frequency noise study in electron devices: review and update
|
Wong, Hei |
|
2003 |
43 |
4 |
p. 585-599 15 p. |
artikel |
14 |
MAGFET based current sensing for power integrated circuit
|
Busatto, Giovanni |
|
2003 |
43 |
4 |
p. 577-583 7 p. |
artikel |
15 |
Onefold coordinated oxygen atom: an electron trap in the silicon oxide
|
Gritsenko, V.A. |
|
2003 |
43 |
4 |
p. 665-669 5 p. |
artikel |
16 |
Oxynitride gate dielectric prepared by thermal oxidation of low-pressure chemical vapor deposition silicon-rich silicon nitride
|
Chan, Jackie |
|
2003 |
43 |
4 |
p. 611-616 6 p. |
artikel |
17 |
Present problems of power module packaging technology
|
Shammas, N.Y.A |
|
2003 |
43 |
4 |
p. 519-527 9 p. |
artikel |
18 |
Strength of Ta–Si interfaces by molecular dynamics
|
Heino, P. |
|
2003 |
43 |
4 |
p. 645-650 6 p. |
artikel |
19 |
Study of aluminum thermomigration as a low thermal budget technique for innovative power devices
|
Morillon, B |
|
2003 |
43 |
4 |
p. 565-569 5 p. |
artikel |
20 |
Study of internal behavior in a vertical DMOS transistor under short high current stress by an interferometric mapping method
|
Blaho, M. |
|
2003 |
43 |
4 |
p. 545-548 4 p. |
artikel |
21 |
System Design with System C; Thorsten Grotker, Stan Liao, Grant Martin, Stuart Swan. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp. 217, plus X, $110, ISBN 1-4020-7027-1
|
Stojcev, Mile |
|
2003 |
43 |
4 |
p. 683-684 2 p. |
artikel |
22 |
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications
|
Yin, C.Y |
|
2003 |
43 |
4 |
p. 625-633 9 p. |
artikel |
23 |
The quest for optimum technology of power semiconductor devices
|
Benda, Vitezslav |
|
2003 |
43 |
4 |
p. 517- 1 p. |
artikel |
24 |
Transient effects on high voltage diode stack under reverse bias
|
Papež, V. |
|
2003 |
43 |
4 |
p. 557-564 8 p. |
artikel |