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Journal description
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Details for article 22 of 24 found articles
| Title: |
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications |
| Author: |
Yin, C.Y Alam, M.O Chan, Y.C Bailey, C Lu, Hua |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 43 (2003) nr. 4 pages 9 p. |
| Year: |
2003 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 22 of 24 found articles
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