nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A designer’s guide to built-in self-test; Charles E. Stround. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp. 319, plus XVI, $ 125, ISBN 1-4020-7050-0
|
Stojcev, Mile |
|
2003 |
43 |
3 |
p. 514-515 2 p. |
artikel |
2 |
Advantages and new development of direct bonded copper substrates
|
Schulz-Harder, Jürgen |
|
2003 |
43 |
3 |
p. 359-365 7 p. |
artikel |
3 |
An algorithm for calculating the lower confidence bounds of C PU and C PL with application to low-drop-out linear regulators
|
Pearn, W.L. |
|
2003 |
43 |
3 |
p. 495-502 8 p. |
artikel |
4 |
A simple and fundamental design rule for resisting delamination in bimaterial structures
|
Moore, Thomas D. |
|
2003 |
43 |
3 |
p. 487-494 8 p. |
artikel |
5 |
Behaviour of anisotropic conductive joints under mechanical loading
|
Tan, C.W. |
|
2003 |
43 |
3 |
p. 481-486 6 p. |
artikel |
6 |
Calendar of forthcoming events
|
|
|
2003 |
43 |
3 |
p. I-IX nvt p. |
artikel |
7 |
Channel-carrier mobility parameters for 4H SiC MOSFETs
|
Linewih, Handoko |
|
2003 |
43 |
3 |
p. 405-411 7 p. |
artikel |
8 |
Comparison of different flex materials in high density flip chip on flex applications
|
Palm, Petteri |
|
2003 |
43 |
3 |
p. 445-451 7 p. |
artikel |
9 |
Design of multi-finger HBTs with a thermal–electrical model
|
Chang, Yang-Hua |
|
2003 |
43 |
3 |
p. 421-426 6 p. |
artikel |
10 |
Design optimization of an eddy current sensor using the finite-elements method
|
Wilde, Jürgen |
|
2003 |
43 |
3 |
p. 345-349 5 p. |
artikel |
11 |
Fodel microresistors––processing and basic electrical properties
|
Dziedzic, A |
|
2003 |
43 |
3 |
p. 377-383 7 p. |
artikel |
12 |
In-process verification of MLC substrates
|
Müller, J |
|
2003 |
43 |
3 |
p. 371-375 5 p. |
artikel |
13 |
Integrated thin film heater-thermocouple systems
|
Golan, G. |
|
2003 |
43 |
3 |
p. 509-512 4 p. |
artikel |
14 |
Integration technology for ferroelectric memory devices
|
Kim, Kinam |
|
2003 |
43 |
3 |
p. 385-398 14 p. |
artikel |
15 |
Memory Design Techniques for Low Energy Embedded Systems; Alberto Macii, Luca Benini, Massimo Poncino. Kluwer Academic Publishers, Boston, USA, 2002. Hard cover, pp. 144 plus XI, $105. ISBN 0-7923-7690-0
|
Stojcev, Mile |
|
2003 |
43 |
3 |
p. 513- 1 p. |
artikel |
16 |
Passivation and packaging of positive bevelled edge termination and related electrical stability
|
Hidalgo, S |
|
2003 |
43 |
3 |
p. 413-420 8 p. |
artikel |
17 |
Polymer film deposition with fine pitch openings by stencil printing
|
Ezawa, Hirokazu |
|
2003 |
43 |
3 |
p. 473-479 7 p. |
artikel |
18 |
Practical compact modeling approaches and options for sub-0.1 μm CMOS technologies
|
Chan, Mansun |
|
2003 |
43 |
3 |
p. 399-404 6 p. |
artikel |
19 |
Quasi-3D simulation approach for comparative evaluation of triggering ESD protection structures
|
Vashchenko, V.A. |
|
2003 |
43 |
3 |
p. 427-437 11 p. |
artikel |
20 |
RF inductors and capacitors integrated on silicon chip by CMOS compatible Cu interconnect technology
|
Lihui, Guo |
|
2003 |
43 |
3 |
p. 367-370 4 p. |
artikel |
21 |
Semiconductor Memories: Technologies, Testing and Reliability; Ashok K. Sharma. IEEE Press and Wiley Interscience, New York, 1997. Hardcover, pp. 462, plus XII, ISBN 0-7803-1000-4
|
Stojcev, Mile |
|
2003 |
43 |
3 |
p. 515- 1 p. |
artikel |
22 |
Special Section on IMAPS-Europe 2002
|
Dziedzic, Andrzej |
|
2003 |
43 |
3 |
p. 343- 1 p. |
artikel |
23 |
Study of package warp behavior for high-performance flip-chip BGA
|
Sawada, Yuko |
|
2003 |
43 |
3 |
p. 465-471 7 p. |
artikel |
24 |
The influence of packaging materials on RF performance
|
Chandrasekhar, Arun |
|
2003 |
43 |
3 |
p. 351-357 7 p. |
artikel |
25 |
The reliability study of selected Sn–Zn based lead-free solders on Au/Ni–P/Cu substrate
|
Shiue, R.K. |
|
2003 |
43 |
3 |
p. 453-463 11 p. |
artikel |
26 |
Thermal laser stimulation and NB-OBIC techniques applied to ESD defect localization
|
Beauchêne, T. |
|
2003 |
43 |
3 |
p. 439-444 6 p. |
artikel |
27 |
The stability of the CuInSe2 solar mini-module I–V characteristics under continuous and light/dark irradiation cycle tests
|
Yanagisawa, Takeshi |
|
2003 |
43 |
3 |
p. 503-507 5 p. |
artikel |