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                             27 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A designer’s guide to built-in self-test; Charles E. Stround. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp. 319, plus XVI, $ 125, ISBN 1-4020-7050-0 Stojcev, Mile
2003
43 3 p. 514-515
2 p.
artikel
2 Advantages and new development of direct bonded copper substrates Schulz-Harder, Jürgen
2003
43 3 p. 359-365
7 p.
artikel
3 An algorithm for calculating the lower confidence bounds of C PU and C PL with application to low-drop-out linear regulators Pearn, W.L.
2003
43 3 p. 495-502
8 p.
artikel
4 A simple and fundamental design rule for resisting delamination in bimaterial structures Moore, Thomas D.
2003
43 3 p. 487-494
8 p.
artikel
5 Behaviour of anisotropic conductive joints under mechanical loading Tan, C.W.
2003
43 3 p. 481-486
6 p.
artikel
6 Calendar of forthcoming events 2003
43 3 p. I-IX
nvt p.
artikel
7 Channel-carrier mobility parameters for 4H SiC MOSFETs Linewih, Handoko
2003
43 3 p. 405-411
7 p.
artikel
8 Comparison of different flex materials in high density flip chip on flex applications Palm, Petteri
2003
43 3 p. 445-451
7 p.
artikel
9 Design of multi-finger HBTs with a thermal–electrical model Chang, Yang-Hua
2003
43 3 p. 421-426
6 p.
artikel
10 Design optimization of an eddy current sensor using the finite-elements method Wilde, Jürgen
2003
43 3 p. 345-349
5 p.
artikel
11 Fodel microresistors––processing and basic electrical properties Dziedzic, A
2003
43 3 p. 377-383
7 p.
artikel
12 In-process verification of MLC substrates Müller, J
2003
43 3 p. 371-375
5 p.
artikel
13 Integrated thin film heater-thermocouple systems Golan, G.
2003
43 3 p. 509-512
4 p.
artikel
14 Integration technology for ferroelectric memory devices Kim, Kinam
2003
43 3 p. 385-398
14 p.
artikel
15 Memory Design Techniques for Low Energy Embedded Systems; Alberto Macii, Luca Benini, Massimo Poncino. Kluwer Academic Publishers, Boston, USA, 2002. Hard cover, pp. 144 plus XI, $105. ISBN 0-7923-7690-0 Stojcev, Mile
2003
43 3 p. 513-
1 p.
artikel
16 Passivation and packaging of positive bevelled edge termination and related electrical stability Hidalgo, S
2003
43 3 p. 413-420
8 p.
artikel
17 Polymer film deposition with fine pitch openings by stencil printing Ezawa, Hirokazu
2003
43 3 p. 473-479
7 p.
artikel
18 Practical compact modeling approaches and options for sub-0.1 μm CMOS technologies Chan, Mansun
2003
43 3 p. 399-404
6 p.
artikel
19 Quasi-3D simulation approach for comparative evaluation of triggering ESD protection structures Vashchenko, V.A.
2003
43 3 p. 427-437
11 p.
artikel
20 RF inductors and capacitors integrated on silicon chip by CMOS compatible Cu interconnect technology Lihui, Guo
2003
43 3 p. 367-370
4 p.
artikel
21 Semiconductor Memories: Technologies, Testing and Reliability; Ashok K. Sharma. IEEE Press and Wiley Interscience, New York, 1997. Hardcover, pp. 462, plus XII, ISBN 0-7803-1000-4 Stojcev, Mile
2003
43 3 p. 515-
1 p.
artikel
22 Special Section on IMAPS-Europe 2002 Dziedzic, Andrzej
2003
43 3 p. 343-
1 p.
artikel
23 Study of package warp behavior for high-performance flip-chip BGA Sawada, Yuko
2003
43 3 p. 465-471
7 p.
artikel
24 The influence of packaging materials on RF performance Chandrasekhar, Arun
2003
43 3 p. 351-357
7 p.
artikel
25 The reliability study of selected Sn–Zn based lead-free solders on Au/Ni–P/Cu substrate Shiue, R.K.
2003
43 3 p. 453-463
11 p.
artikel
26 Thermal laser stimulation and NB-OBIC techniques applied to ESD defect localization Beauchêne, T.
2003
43 3 p. 439-444
6 p.
artikel
27 The stability of the CuInSe2 solar mini-module I–V characteristics under continuous and light/dark irradiation cycle tests Yanagisawa, Takeshi
2003
43 3 p. 503-507
5 p.
artikel
                             27 gevonden resultaten
 
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