| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A class of tests for testing an increasing failure-rate-average distribution with randomly right-censored data
|
|
|
1992
|
32 |
4 |
p. 589-
1 p.
|
artikel
|
| 2 |
A comparison of classical and Bayes risks when the quality varies randomly
|
Sharma, K.K.
|
|
1992
|
32 |
4 |
p. 493-495
3 p.
|
artikel
|
| 3 |
A comparison of metal-in-elastomer connectors: the influence of structure on mechanical and electrical performance
|
|
|
1992
|
32 |
4 |
p. 583-
1 p.
|
artikel
|
| 4 |
A generalized reduction method for the connectedness probability of stochastic networks
|
|
|
1992
|
32 |
4 |
p. 589-
1 p.
|
artikel
|
| 5 |
A low damage, low contaminant plasma processing system utilizing energy clean technology
|
|
|
1992
|
32 |
4 |
p. 594-595
2 p.
|
artikel
|
| 6 |
A maintenance policy for repairable systems based on opportunistic failure-rate tolerance
|
|
|
1992
|
32 |
4 |
p. 587-
1 p.
|
artikel
|
| 7 |
A method for comparison of pseudo-random number generators
|
Brkić, D.M.
|
|
1992
|
32 |
4 |
p. 453-455
3 p.
|
artikel
|
| 8 |
A model for sheet resistivity of RuO2 thick film resistors
|
|
|
1992
|
32 |
4 |
p. 597-
1 p.
|
artikel
|
| 9 |
Analysis of a two-unit cold standby system with imperfect assistant repairman and perfect master repairman
|
Rander, M.C.
|
|
1992
|
32 |
4 |
p. 497-501
5 p.
|
artikel
|
| 10 |
Analysis of contaminated field failure data for repairable systems
|
|
|
1992
|
32 |
4 |
p. 590-
1 p.
|
artikel
|
| 11 |
Analysis of reliability data for mechanical systems
|
|
|
1992
|
32 |
4 |
p. 589-
1 p.
|
artikel
|
| 12 |
Analysis of the determination of the dimensional offset of conducting layers and MOS transistors
|
|
|
1992
|
32 |
4 |
p. 596-
1 p.
|
artikel
|
| 13 |
Analysis of two-stage transfer-line production system subject to inter-stage inspection and arbitrary arrival and processing time distributions
|
Gopalan, M.N.
|
|
1992
|
32 |
4 |
p. 479-482
4 p.
|
artikel
|
| 14 |
An enhanced integer simplical optimization method for minimum cost spares for k-out-of-n systems
|
|
|
1992
|
32 |
4 |
p. 591-
1 p.
|
artikel
|
| 15 |
An evaluation of energy transport models for silicon device simulation
|
|
|
1992
|
32 |
4 |
p. 596-597
2 p.
|
artikel
|
| 16 |
A new failure mechanism related to grain growth in drams
|
|
|
1992
|
32 |
4 |
p. 589-
1 p.
|
artikel
|
| 17 |
An improved algorithm for symbolic reliability analysis
|
|
|
1992
|
32 |
4 |
p. 592-593
2 p.
|
artikel
|
| 18 |
An interconnect scheme for reducing the number of contact pads on process control chips
|
|
|
1992
|
32 |
4 |
p. 596-
1 p.
|
artikel
|
| 19 |
A nonparametric approach to progressive stress accelerated life testing
|
|
|
1992
|
32 |
4 |
p. 588-
1 p.
|
artikel
|
| 20 |
A nonparametric software-reliability growth model
|
|
|
1992
|
32 |
4 |
p. 593-
1 p.
|
artikel
|
| 21 |
A note on determining optimum shape parameter for gamma distribution based on the number of system shocks
|
Ntuen, Celestine A.
|
|
1992
|
32 |
4 |
p. 577-579
3 p.
|
artikel
|
| 22 |
A parallel algorithm for allocation of spare cells on memory chips
|
|
|
1992
|
32 |
4 |
p. 593-
1 p.
|
artikel
|
| 23 |
Application of the atomic force microscope to integrated circuit reliability and failure analysis
|
|
|
1992
|
32 |
4 |
p. 589-
1 p.
|
artikel
|
| 24 |
Approximate MLEs for the location and scale parameters of the extreme value distribution with censoring
|
|
|
1992
|
32 |
4 |
p. 588-589
2 p.
|
artikel
|
| 25 |
Approximate MLEs for the location and scale parameters of the half-logistic distribution with type-II right-censoring
|
|
|
1992
|
32 |
4 |
p. 588-
1 p.
|
artikel
|
| 26 |
A recurrence relation for calculating a reliability increment in a series-parallel system
|
|
|
1992
|
32 |
4 |
p. 593-
1 p.
|
artikel
|
| 27 |
A reliability model for interlayer dielectric cracking during temperature cycling
|
|
|
1992
|
32 |
4 |
p. 584-
1 p.
|
artikel
|
| 28 |
A reliability simulation approach for use in the design process
|
|
|
1992
|
32 |
4 |
p. 587-
1 p.
|
artikel
|
| 29 |
A simple, analytical model for hot-carrier induced degradation in n-channel MOSFETs
|
Giebel, T.
|
|
1992
|
32 |
4 |
p. 545-555
11 p.
|
artikel
|
| 30 |
A successful program for missile reliability
|
|
|
1992
|
32 |
4 |
p. 588-
1 p.
|
artikel
|
| 31 |
A two-unit cold standby system with allowed down-time and correlated failures and repairs
|
Goel, L.R.
|
|
1992
|
32 |
4 |
p. 503-507
5 p.
|
artikel
|
| 32 |
Broadening of the Si doping layer in planar-doped GaAs in the limit of high concentrations
|
|
|
1992
|
32 |
4 |
p. 597-
1 p.
|
artikel
|
| 33 |
Building-in reliability: making it work
|
|
|
1992
|
32 |
4 |
p. 589-
1 p.
|
artikel
|
| 34 |
Burn-in effectiveness—theory and measurement
|
|
|
1992
|
32 |
4 |
p. 590-
1 p.
|
artikel
|
| 35 |
Can burn-in screen wear out mechanisms?: Reliability modelling of defective subpopulations—a case study
|
|
|
1992
|
32 |
4 |
p. 591-
1 p.
|
artikel
|
| 36 |
Characterization of beta, binomial, and Poisson distributions
|
|
|
1992
|
32 |
4 |
p. 592-
1 p.
|
artikel
|
| 37 |
Characterization of high-dose implants of Co and Cr in Si by RBS
|
|
|
1992
|
32 |
4 |
p. 598-
1 p.
|
artikel
|
| 38 |
Characterization of silicon wafers by transient microwave photo-conductivity measurements
|
|
|
1992
|
32 |
4 |
p. 594-
1 p.
|
artikel
|
| 39 |
Characterization of the thermal behaviour in ICs
|
|
|
1992
|
32 |
4 |
p. 583-
1 p.
|
artikel
|
| 40 |
Comparison of MTBF in the parallel string configuration and the quad configuration systems
|
Yamashiro, Mitsuo
|
|
1992
|
32 |
4 |
p. 557-559
3 p.
|
artikel
|
| 41 |
Component relevancy in multistate reliability models
|
|
|
1992
|
32 |
4 |
p. 592-
1 p.
|
artikel
|
| 42 |
Corrigendum
|
|
|
1992
|
32 |
4 |
p. 599-
1 p.
|
artikel
|
| 43 |
Development of a burn-in time reduction algorithm using the principles of acceleration factors
|
|
|
1992
|
32 |
4 |
p. 591-
1 p.
|
artikel
|
| 44 |
Dynamic batching heuristic for simultaneous processing
|
|
|
1992
|
32 |
4 |
p. 589-
1 p.
|
artikel
|
| 45 |
Dynamic reliability prediction: how to adjust modelling and reliability growth?
|
|
|
1992
|
32 |
4 |
p. 591-
1 p.
|
artikel
|
| 46 |
Effect of artificial-intelligence planning-procedures on system reliability
|
|
|
1992
|
32 |
4 |
p. 592-
1 p.
|
artikel
|
| 47 |
Effects of rework on the reliability of pin grid array interconnects
|
|
|
1992
|
32 |
4 |
p. 584-
1 p.
|
artikel
|
| 48 |
Electromigration-induced compressive stress in encapsulated thin-film conductors
|
|
|
1992
|
32 |
4 |
p. 597-
1 p.
|
artikel
|
| 49 |
Electronic packaging in the 1990s—a perspective from America
|
|
|
1992
|
32 |
4 |
p. 595-
1 p.
|
artikel
|
| 50 |
Electronic packaging in the 1990s—a perspective from Asia
|
|
|
1992
|
32 |
4 |
p. 594-
1 p.
|
artikel
|
| 51 |
Electronic packaging in the 1990s: the perspective from Europe
|
|
|
1992
|
32 |
4 |
p. 594-
1 p.
|
artikel
|
| 52 |
ESD-related latent failures of InGaAsP/InP laser diodes for telecommunication equipments
|
|
|
1992
|
32 |
4 |
p. 584-
1 p.
|
artikel
|
| 53 |
Estimation of environmental factors for the normal distribution
|
Wang, Hong-zhou
|
|
1992
|
32 |
4 |
p. 457-463
7 p.
|
artikel
|
| 54 |
Evaluation technology of VLSI reliability using hot carrier luminescence
|
|
|
1992
|
32 |
4 |
p. 596-
1 p.
|
artikel
|
| 55 |
β-Expectation tolerance intervals and sample-size determination for the Rayleigh distribution
|
|
|
1992
|
32 |
4 |
p. 591-592
2 p.
|
artikel
|
| 56 |
Factoring and reductions for networks with imperfect vertices
|
|
|
1992
|
32 |
4 |
p. 588-
1 p.
|
artikel
|
| 57 |
Failure rate model for thin film cracking in plastic ICs
|
|
|
1992
|
32 |
4 |
p. 584-
1 p.
|
artikel
|
| 58 |
Field reliability vs predicted reliability: an analysis of root causes for the difference
|
|
|
1992
|
32 |
4 |
p. 586-
1 p.
|
artikel
|
| 59 |
Four decades of reliability experience
|
|
|
1992
|
32 |
4 |
p. 585-
1 p.
|
artikel
|
| 60 |
Four decades of reliability progress—Annual reliability and maintainability symposium
|
|
|
1992
|
32 |
4 |
p. 586-
1 p.
|
artikel
|
| 61 |
Fracture mechanics life prediction for microscale components—with application to wire bonding
|
|
|
1992
|
32 |
4 |
p. 584-
1 p.
|
artikel
|
| 62 |
How to use terms and characteristic values of process capability and machine capability properly
|
|
|
1992
|
32 |
4 |
p. 595-
1 p.
|
artikel
|
| 63 |
How we put reliability tools into the hands of designers
|
|
|
1992
|
32 |
4 |
p. 590-
1 p.
|
artikel
|
| 64 |
Implementing total quality management into reliability and maintainability
|
|
|
1992
|
32 |
4 |
p. 587-
1 p.
|
artikel
|
| 65 |
Improved performance and reliability of MOSFETs with thin gate oxides grown at high temperature
|
|
|
1992
|
32 |
4 |
p. 583-
1 p.
|
artikel
|
| 66 |
Improved reliability predictions for commerical computers
|
|
|
1992
|
32 |
4 |
p. 586-
1 p.
|
artikel
|
| 67 |
Improved techniques for cost effective electronics
|
|
|
1992
|
32 |
4 |
p. 593-
1 p.
|
artikel
|
| 68 |
Improving hot-electron reliability through circuit analysis and design
|
|
|
1992
|
32 |
4 |
p. 591-
1 p.
|
artikel
|
| 69 |
Incorporating the effects of time estimation into human-reliability analysis for high-risk situations
|
|
|
1992
|
32 |
4 |
p. 585-
1 p.
|
artikel
|
| 70 |
Integrating of materials testing systems into user-specific software structures
|
|
|
1992
|
32 |
4 |
p. 595-
1 p.
|
artikel
|
| 71 |
Integrating of materials testing systems into user-specific software structures
|
|
|
1992
|
32 |
4 |
p. 586-587
2 p.
|
artikel
|
| 72 |
Interdependence between safety-control policy and multiplesensor schemes via Dempster-Shafer theory
|
|
|
1992
|
32 |
4 |
p. 586-
1 p.
|
artikel
|
| 73 |
Interface reactions in LPE grown InGaAsP/InP ridge waveguide laser diodes during aging
|
|
|
1992
|
32 |
4 |
p. 584-
1 p.
|
artikel
|
| 74 |
In the chips: component makers discover smaller is better
|
|
|
1992
|
32 |
4 |
p. 593-
1 p.
|
artikel
|
| 75 |
Investing in product assurance to ensure that: better is not the enemy of good
|
|
|
1992
|
32 |
4 |
p. 589-
1 p.
|
artikel
|
| 76 |
k-out-of-n:G systems: some cost considerations
|
|
|
1992
|
32 |
4 |
p. 592-
1 p.
|
artikel
|
| 77 |
K-terminal reliability of hierarchical networks
|
|
|
1992
|
32 |
4 |
p. 587-
1 p.
|
artikel
|
| 78 |
Lower bound on reliability for Weibull distribution when shape parameter is not estimated accurately
|
|
|
1992
|
32 |
4 |
p. 590-
1 p.
|
artikel
|
| 79 |
Low-temperature Si and Si: Ge epitaxy by ultrahigh-vacuum/chemical vapor deposition: process fundamentals
|
|
|
1992
|
32 |
4 |
p. 595-
1 p.
|
artikel
|
| 80 |
Mean time-to-failure for a linear consecutive-k-out-of-n:F system
|
|
|
1992
|
32 |
4 |
p. 592-
1 p.
|
artikel
|
| 81 |
Mechanism of misalignment failure of liquid-crystal display devices
|
|
|
1992
|
32 |
4 |
p. 586-
1 p.
|
artikel
|
| 82 |
Modeling a shared-load k-out-of-n:G system
|
|
|
1992
|
32 |
4 |
p. 587-
1 p.
|
artikel
|
| 83 |
Modeling optical equipment for wafer alignment and line-width measurement
|
|
|
1992
|
32 |
4 |
p. 595-
1 p.
|
artikel
|
| 84 |
Modelling and monitoring the decay of equipment reliability
|
|
|
1992
|
32 |
4 |
p. 590-591
2 p.
|
artikel
|
| 85 |
Molecular beam epitaxy of silicon based electronic structures
|
|
|
1992
|
32 |
4 |
p. 598-
1 p.
|
artikel
|
| 86 |
Moments of order statistics using the orthogonal inverse expansion method and its application in reliability
|
Soman, K.P.
|
|
1992
|
32 |
4 |
p. 469-473
5 p.
|
artikel
|
| 87 |
Nanoelectronics
|
|
|
1992
|
32 |
4 |
p. 593-
1 p.
|
artikel
|
| 88 |
New international standards on reliability growth
|
|
|
1992
|
32 |
4 |
p. 585-
1 p.
|
artikel
|
| 89 |
New techniques enhance inspection equipment for densely mounted printed circuit boards
|
|
|
1992
|
32 |
4 |
p. 595-
1 p.
|
artikel
|
| 90 |
Novel test structure for the measurement of electrostatic discharge pulses
|
|
|
1992
|
32 |
4 |
p. 594-
1 p.
|
artikel
|
| 91 |
On-chip wiring for VLSI: status and directions
|
|
|
1992
|
32 |
4 |
p. 593-594
2 p.
|
artikel
|
| 92 |
One-dimensional modeling of high concentration boron diffusion in polysilicon-silicon structures
|
|
|
1992
|
32 |
4 |
p. 597-
1 p.
|
artikel
|
| 93 |
Optimal accelerated life-time plans that minimize the maximum test-stress
|
|
|
1992
|
32 |
4 |
p. 587-
1 p.
|
artikel
|
| 94 |
Optimal-arrangement and importance of the components in a consecutive k-out-of-r-from n:F system
|
|
|
1992
|
32 |
4 |
p. 592-
1 p.
|
artikel
|
| 95 |
Optimal periodic replacement with inspection and minimal repair for a system which is inoperable during inspection periods
|
Mohandas, K.
|
|
1992
|
32 |
4 |
p. 509-513
5 p.
|
artikel
|
| 96 |
Performance study of n-MOS natural transistor fabricated by low thermal budget process
|
Srivastava, A.
|
|
1992
|
32 |
4 |
p. 515-523
9 p.
|
artikel
|
| 97 |
Piecewise exponential estimator of the survivor function
|
|
|
1992
|
32 |
4 |
p. 588-
1 p.
|
artikel
|
| 98 |
Predicting the reliability of new products at IBM
|
|
|
1992
|
32 |
4 |
p. 590-
1 p.
|
artikel
|
| 99 |
Preservation of partial orderings under the formation of k-out-of-n:G systems of i.i.d. components
|
|
|
1992
|
32 |
4 |
p. 593-
1 p.
|
artikel
|
| 100 |
Process control system for VLSI fabrication
|
|
|
1992
|
32 |
4 |
p. 594-
1 p.
|
artikel
|
| 101 |
Progress in international standardization of verification and evaluation procedures
|
|
|
1992
|
32 |
4 |
p. 585-
1 p.
|
artikel
|
| 102 |
Properties of the fluorine-implanted Si-SiO2 system
|
|
|
1992
|
32 |
4 |
p. 598-
1 p.
|
artikel
|
| 103 |
Publications, notices, calls for papers, etc.
|
|
|
1992
|
32 |
4 |
p. 581-
1 p.
|
artikel
|
| 104 |
PWB solder joint life calculations under thermal and vibrational loading
|
|
|
1992
|
32 |
4 |
p. 584-585
2 p.
|
artikel
|
| 105 |
Quality assurance, just-in-time with the worldwide EDIFACT standard
|
|
|
1992
|
32 |
4 |
p. 587-
1 p.
|
artikel
|
| 106 |
Rainbow net analysis of VAXcluster sytem availability
|
|
|
1992
|
32 |
4 |
p. 587-
1 p.
|
artikel
|
| 107 |
Realistic statistical worst-case simulations of VLSI circuits
|
|
|
1992
|
32 |
4 |
p. 596-
1 p.
|
artikel
|
| 108 |
Reliability analysis of artificial neural networks
|
|
|
1992
|
32 |
4 |
p. 591-
1 p.
|
artikel
|
| 109 |
Reliability and availability analysis of warm standby systems with common-cause failures and human errors
|
Dhillon, B.S.
|
|
1992
|
32 |
4 |
p. 561-575
15 p.
|
artikel
|
| 110 |
Reliability and cost of fault tolerant multiprocessing networks with heterogeneous nodes
|
Leung, Yiu-Wing
|
|
1992
|
32 |
4 |
p. 525-538
14 p.
|
artikel
|
| 111 |
Reliability prediction, in the conceptual phase, of a processor system with its embedded software
|
|
|
1992
|
32 |
4 |
p. 589-590
2 p.
|
artikel
|
| 112 |
Reliability testing of semiconductor devices in a humid environment
|
|
|
1992
|
32 |
4 |
p. 583-
1 p.
|
artikel
|
| 113 |
Representation of thermal behaviour of electronic components for the creation of a databank
|
|
|
1992
|
32 |
4 |
p. 583-
1 p.
|
artikel
|
| 114 |
Robustness of a semi-parametric proportional intensity model
|
|
|
1992
|
32 |
4 |
p. 589-
1 p.
|
artikel
|
| 115 |
Rough sets in reliability engineering
|
Dohnal, M.
|
|
1992
|
32 |
4 |
p. 539-543
5 p.
|
artikel
|
| 116 |
Scalability analysis in gracefully-degradable large systems
|
|
|
1992
|
32 |
4 |
p. 587-588
2 p.
|
artikel
|
| 117 |
Selective epitazial growth of silicon and some potential applications
|
|
|
1992
|
32 |
4 |
p. 595-
1 p.
|
artikel
|
| 118 |
Self-multiplexing force-sense test structures for (MOS) IC applications
|
|
|
1992
|
32 |
4 |
p. 592-
1 p.
|
artikel
|
| 119 |
Simulation of reverse breakdown in planar P-N junctions
|
|
|
1992
|
32 |
4 |
p. 597-
1 p.
|
artikel
|
| 120 |
Simultaneous extraction of hole barrier height and interfacial oxide thickness of polysilicon-emitter bipolar transistors
|
|
|
1992
|
32 |
4 |
p. 597-
1 p.
|
artikel
|
| 121 |
Some thought experiments in reliability
|
|
|
1992
|
32 |
4 |
p. 585-
1 p.
|
artikel
|
| 122 |
Spin-dependent Shockley-Read recombination of electrons and holes in indirect-band-gap semiconductor p-n junction diodes
|
|
|
1992
|
32 |
4 |
p. 597-
1 p.
|
artikel
|
| 123 |
Statistical experimental design in plasma etch modelling
|
|
|
1992
|
32 |
4 |
p. 595-
1 p.
|
artikel
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| 124 |
Study of defects in thermal SiO2 grown in the presence of 1,1,1-trichloroethane by Wright etchant
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1992
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32 |
4 |
p. 596-
1 p.
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artikel
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| 125 |
Supplier auditing as a means of quality assurance
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1992
|
32 |
4 |
p. 586-
1 p.
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artikel
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| 126 |
Surface potential transients of ultrathin SiO2-Si structures
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1992
|
32 |
4 |
p. 596-
1 p.
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artikel
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| 127 |
Temperature-dependent standard deviation of log (failure time) distributions
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1992
|
32 |
4 |
p. 588-
1 p.
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artikel
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| 128 |
The characteristics of reactive ion etching of polysilicon using SF6/O2 and their interdependence
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1992
|
32 |
4 |
p. 597-598
2 p.
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artikel
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| 129 |
The effectiveness of silicone gels for corrosion prevention of silicon circuits: the final report of the IEEE Computer Society Computer Packaging Committee Special Task Force
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1992
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32 |
4 |
p. 584-
1 p.
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artikel
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| 130 |
The influence of error occurrence on branched computer network reliability
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Jóźwiak, Ireneusz J.
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1992
|
32 |
4 |
p. 487-492
6 p.
|
artikel
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| 131 |
The influence of the number of users on the reliability of a branched computer network
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Jóźwiak, Ireneusz J.
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1992
|
32 |
4 |
p. 483-486
4 p.
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artikel
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| 132 |
The mixed exponential failure process
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1992
|
32 |
4 |
p. 590-
1 p.
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artikel
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| 133 |
The role of focused ion beams in physical failure analysis
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1992
|
32 |
4 |
p. 598-
1 p.
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artikel
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| 134 |
The shifted-rectangle approximation for simplifying the analysis of ion-implanted MOSFETs and MESFETs
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1992
|
32 |
4 |
p. 598-
1 p.
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artikel
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| 135 |
Transient solutions of a software reliability model with imperfect debugging and error generation
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Kapur, P.K.
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|
1992
|
32 |
4 |
p. 475-478
4 p.
|
artikel
|
| 136 |
Trend analysis of repair times
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1992
|
32 |
4 |
p. 586-
1 p.
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artikel
|
| 137 |
Used scanned electron beams for testing microstructure isolation and continuity
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1992
|
32 |
4 |
p. 598-
1 p.
|
artikel
|
| 138 |
Use of Demorgan's theorem in system reliability studies
|
Chowdhury, Sumandra Ghosh
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|
1992
|
32 |
4 |
p. 465-468
4 p.
|
artikel
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| 139 |
Use of the in-process bond shear test for predicting gold wirebond failure modes in plastic packages
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|
1992
|
32 |
4 |
p. 584-
1 p.
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artikel
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| 140 |
Using spatial information to analyze correlations between test structure data
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1992
|
32 |
4 |
p. 592-
1 p.
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artikel
|
| 141 |
Warranties: what are they? What do they really cost?
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1992
|
32 |
4 |
p. 585-
1 p.
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artikel
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