| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A 6-bit monolithic video flash converter
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 2 |
Accelerated life testing and reliability of high K multilayer ceramic capacitors
|
|
|
1983
|
23 |
3 |
p. 589-590
2 p.
|
artikel
|
| 3 |
Accelerated stress testing of terrestrial solar cells
|
|
|
1983
|
23 |
3 |
p. 588-
1 p.
|
artikel
|
| 4 |
A combined digital and linear custom designed array optimised for large volume consumer applications
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 5 |
Activation and process characteristics of infrared rapid isothermal and furnace annealing techniques
|
|
|
1983
|
23 |
3 |
p. 597-
1 p.
|
artikel
|
| 6 |
Advances in contamination control of processing chemicals in VLSI
|
|
|
1983
|
23 |
3 |
p. 601-
1 p.
|
artikel
|
| 7 |
Advances in VLSI circuit technology require new equipment for microlithography
|
|
|
1983
|
23 |
3 |
p. 597-
1 p.
|
artikel
|
| 8 |
A high-performance 16-bit bipolar microprocessor—The Am 29116
|
|
|
1983
|
23 |
3 |
p. 600-
1 p.
|
artikel
|
| 9 |
Alteration of diffusion profiles in semiconductors due to p-n junctions
|
|
|
1983
|
23 |
3 |
p. 600-
1 p.
|
artikel
|
| 10 |
A method of computer-aided test generation
|
|
|
1983
|
23 |
3 |
p. 593-
1 p.
|
artikel
|
| 11 |
A methodology for photovoltaic system reliability and economic analysis
|
|
|
1983
|
23 |
3 |
p. 592-
1 p.
|
artikel
|
| 12 |
An algorithm for fault-tree construction
|
|
|
1983
|
23 |
3 |
p. 590-
1 p.
|
artikel
|
| 13 |
An all thick-film stripline construction
|
|
|
1983
|
23 |
3 |
p. 602-
1 p.
|
artikel
|
| 14 |
Analysis of an important class of non-Markov systems
|
|
|
1983
|
23 |
3 |
p. 593-
1 p.
|
artikel
|
| 15 |
Analysis of a two-unit repairable system with random inspection subject to two types of failure
|
Subramanyam Naidu, R.
|
|
1983
|
23 |
3 |
p. 449-451
3 p.
|
artikel
|
| 16 |
Analysis of 1-out-of-n: G adjustable operating system
|
Sarmah, P.
|
|
1983
|
23 |
3 |
p. 477-480
4 p.
|
artikel
|
| 17 |
Analysis of reliability block diagrams by Boolean techniques
|
|
|
1983
|
23 |
3 |
p. 592-
1 p.
|
artikel
|
| 18 |
A new accelerated test method for moisture resistance of plastic encapsulated LSIs
|
|
|
1983
|
23 |
3 |
p. 589-
1 p.
|
artikel
|
| 19 |
A new failure mechanism in thin gold films at elevated temperatures
|
|
|
1983
|
23 |
3 |
p. 603-
1 p.
|
artikel
|
| 20 |
An improved moment-matching algorithm for evaluating topevent probability bounds
|
|
|
1983
|
23 |
3 |
p. 595-
1 p.
|
artikel
|
| 21 |
An initial planning model of computer networks using availability criteria
|
Drinkwater, Robert
|
|
1983
|
23 |
3 |
p. 415-419
5 p.
|
artikel
|
| 22 |
Anodic gold corrosion in plastic encapsulated devices
|
Brambilla, E.
|
|
1983
|
23 |
3 |
p. 577-585
9 p.
|
artikel
|
| 23 |
A paste manufacturer's view of the hybrid industry
|
|
|
1983
|
23 |
3 |
p. 603-
1 p.
|
artikel
|
| 24 |
Applicabilities of one-chip microcomputers in electronic measuring and test devices
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 25 |
Application and use of acceleration factors in microelectronics testing
|
|
|
1983
|
23 |
3 |
p. 592-
1 p.
|
artikel
|
| 26 |
Application of microelectronics in textile engineering
|
|
|
1983
|
23 |
3 |
p. 595-
1 p.
|
artikel
|
| 27 |
Application of microelectronics in the fields of preparation of production
|
|
|
1983
|
23 |
3 |
p. 596-
1 p.
|
artikel
|
| 28 |
A simple optimisation procedure for bipolar subnanosecond ICs with low power dissipation
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 29 |
A simple technique for analysis of ESD failures of dynamic RAMs using liquid crystals
|
|
|
1983
|
23 |
3 |
p. 593-594
2 p.
|
artikel
|
| 30 |
A simple technique for computing network reliability
|
|
|
1983
|
23 |
3 |
p. 592-593
2 p.
|
artikel
|
| 31 |
A structured approach to the design of microprocessor applications software
|
|
|
1983
|
23 |
3 |
p. 600-
1 p.
|
artikel
|
| 32 |
A unified formula for analysis of some network reliability problems
|
|
|
1983
|
23 |
3 |
p. 593-
1 p.
|
artikel
|
| 33 |
Australia builds VLSI skills
|
|
|
1983
|
23 |
3 |
p. 595-
1 p.
|
artikel
|
| 34 |
Automated contactless SEM testing for VLSI development and failure analysis
|
|
|
1983
|
23 |
3 |
p. 594-
1 p.
|
artikel
|
| 35 |
Automated measurement system for the investigation of surface state distribution
|
Price, T.E.
|
|
1983
|
23 |
3 |
p. 555-563
9 p.
|
artikel
|
| 36 |
Average mobilities of carriers in subdoped silicon layers
|
|
|
1983
|
23 |
3 |
p. 601-
1 p.
|
artikel
|
| 37 |
A VLSI-ATE selection matrix
|
|
|
1983
|
23 |
3 |
p. 591-
1 p.
|
artikel
|
| 38 |
A VLSI bipolar metallization design with three-level wiring and area array solder connections
|
|
|
1983
|
23 |
3 |
p. 597-
1 p.
|
artikel
|
| 39 |
Basic problems for electromigration in VLSI applications
|
|
|
1983
|
23 |
3 |
p. 593-
1 p.
|
artikel
|
| 40 |
Bayesian estimation of constant failure rate and unavailability
|
|
|
1983
|
23 |
3 |
p. 594-
1 p.
|
artikel
|
| 41 |
Behind the “bathtub”-curve A new model and its consequences
|
Møltoft, Jørgen
|
|
1983
|
23 |
3 |
p. 489-500
12 p.
|
artikel
|
| 42 |
Bias humidity performance and failure mechanisms of non-hermetic aluminum SICs in an environment contaminated with Cl2
|
|
|
1983
|
23 |
3 |
p. 588-
1 p.
|
artikel
|
| 43 |
Bipolar chip design for a VLSI microprocessor
|
|
|
1983
|
23 |
3 |
p. 596-
1 p.
|
artikel
|
| 44 |
Busy-period analysis of a one-server two-unit system subject to non-negligible inspection time
|
Gopalan, M.N.
|
|
1983
|
23 |
3 |
p. 453-465
13 p.
|
artikel
|
| 45 |
CAD program evaluates circuits, generates tests automatically
|
|
|
1983
|
23 |
3 |
p. 591-
1 p.
|
artikel
|
| 46 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1983
|
23 |
3 |
p. 407-410
4 p.
|
artikel
|
| 47 |
Capacity consideration in reliability analysis of communication systems
|
|
|
1983
|
23 |
3 |
p. 590-
1 p.
|
artikel
|
| 48 |
Care in packaging off-the-shelf LSI keeps 32-bit mini-computer compact
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 49 |
Characterization of horizontal Bridgman-grown semi-insulating GaAs for ion implantation
|
|
|
1983
|
23 |
3 |
p. 604-
1 p.
|
artikel
|
| 50 |
Chip implantation—alternative in the group technology
|
|
|
1983
|
23 |
3 |
p. 595-
1 p.
|
artikel
|
| 51 |
C-MOS chip set gives new life to twisted pairs for local networks
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 52 |
Common-chip for use in disk and diskette controllers
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 53 |
Component availability
|
|
|
1983
|
23 |
3 |
p. 588-
1 p.
|
artikel
|
| 54 |
Conference report 6th International Conference on Pattern Recognition
|
Lang, Manfred
|
|
1983
|
23 |
3 |
p. 413-414
2 p.
|
artikel
|
| 55 |
Controlled anisotropic etching of polysilicon
|
|
|
1983
|
23 |
3 |
p. 601-
1 p.
|
artikel
|
| 56 |
Cost-benefit analysis of a one-server two-unit system subject to two types of failure
|
Subramanyam Naidu, R.
|
|
1983
|
23 |
3 |
p. 441-443
3 p.
|
artikel
|
| 57 |
Cost-benefit analysis of A 1-server n-unit system subject to general repair and inspection
|
Subramanyam Naidu, R.
|
|
1983
|
23 |
3 |
p. 531-540
10 p.
|
artikel
|
| 58 |
Cost/performance single-chip module
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 59 |
Cost versus reliability curve in reliability optimization problems
|
|
|
1983
|
23 |
3 |
p. 591-
1 p.
|
artikel
|
| 60 |
Current limitations of thin film conductors
|
|
|
1983
|
23 |
3 |
p. 603-
1 p.
|
artikel
|
| 61 |
Defect density and electrical properties of vacuum evaporated copper films from annealing studies of electrical resistance
|
|
|
1983
|
23 |
3 |
p. 602-
1 p.
|
artikel
|
| 62 |
Degradation of thin-gate MOSFETs under high electric field stress
|
|
|
1983
|
23 |
3 |
p. 588-589
2 p.
|
artikel
|
| 63 |
Design considerations for a VLSI microprocessor
|
|
|
1983
|
23 |
3 |
p. 597-
1 p.
|
artikel
|
| 64 |
Determination of all minimal cut-sets between a Vertex pair in an undirected graph
|
|
|
1983
|
23 |
3 |
p. 594-
1 p.
|
artikel
|
| 65 |
Development of interconnection technology for large-scale integrated circuits
|
|
|
1983
|
23 |
3 |
p. 596-
1 p.
|
artikel
|
| 66 |
Development of the chip size of integrated store circuits
|
|
|
1983
|
23 |
3 |
p. 596-
1 p.
|
artikel
|
| 67 |
Diffusivity of moisture in thin films
|
|
|
1983
|
23 |
3 |
p. 603-
1 p.
|
artikel
|
| 68 |
DKG 160 photomask inspection equipment localizes defects in IC patterns
|
|
|
1983
|
23 |
3 |
p. 595-596
2 p.
|
artikel
|
| 69 |
Dual-chip sets forge vital link for Ethernet local-network scheme
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 70 |
E-beam lithography: a standard tool?
|
|
|
1983
|
23 |
3 |
p. 604-
1 p.
|
artikel
|
| 71 |
Effect of pad capacitance on the notch frequency of the MOS distributed RC (MOS-RC) notch network
|
Salawu, R.I.
|
|
1983
|
23 |
3 |
p. 565-575
11 p.
|
artikel
|
| 72 |
Effect of reactive sputter etching of SiO2 on the properties of subsequently formed MOS systems
|
|
|
1983
|
23 |
3 |
p. 601-
1 p.
|
artikel
|
| 73 |
Effects of materials and processes on package reliability
|
|
|
1983
|
23 |
3 |
p. 590-
1 p.
|
artikel
|
| 74 |
Effects on VLSI yield of doubly-stochastic impurity distributions
|
|
|
1983
|
23 |
3 |
p. 591-592
2 p.
|
artikel
|
| 75 |
Electromigration-induced failures in VLSI interconnects
|
|
|
1983
|
23 |
3 |
p. 591-
1 p.
|
artikel
|
| 76 |
Electron-beam proximity printing—a new high-speed lithography method for submicron structures
|
|
|
1983
|
23 |
3 |
p. 604-
1 p.
|
artikel
|
| 77 |
Electrostatic failure in semiconductors
|
|
|
1983
|
23 |
3 |
p. 588-
1 p.
|
artikel
|
| 78 |
EOS/ESD damage failure trait photograph interpretation
|
|
|
1983
|
23 |
3 |
p. 587-
1 p.
|
artikel
|
| 79 |
Erratum
|
|
|
1983
|
23 |
3 |
p. 605-
1 p.
|
artikel
|
| 80 |
Eschatology, infinite series, and reliability
|
|
|
1983
|
23 |
3 |
p. 587-
1 p.
|
artikel
|
| 81 |
Estimation of reliability for a series stress-strength system
|
|
|
1983
|
23 |
3 |
p. 591-
1 p.
|
artikel
|
| 82 |
Estimation under reliability growth assuming Gamma failure models
|
|
|
1983
|
23 |
3 |
p. 592-
1 p.
|
artikel
|
| 83 |
Etchback method for SEM investigation of metal step coverage of IC devices
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 84 |
Evolution and accomplishments of VLSI yield management at IBM
|
|
|
1983
|
23 |
3 |
p. 598-
1 p.
|
artikel
|
| 85 |
Expected number of failures caused by protective systems
|
|
|
1983
|
23 |
3 |
p. 592-
1 p.
|
artikel
|
| 86 |
Experimental reliability investigations in telecommunication engineering
|
|
|
1983
|
23 |
3 |
p. 593-
1 p.
|
artikel
|
| 87 |
Failure mechanism in MOS gates resulting from particulate contamination
|
|
|
1983
|
23 |
3 |
p. 589-
1 p.
|
artikel
|
| 88 |
Feature size control in IC manufacturing
|
|
|
1983
|
23 |
3 |
p. 596-
1 p.
|
artikel
|
| 89 |
Floating redundancy in digital systems
|
Anderson, P.G.
|
|
1983
|
23 |
3 |
p. 519-529
11 p.
|
artikel
|
| 90 |
Future application of microelectronics in automation engineering
|
|
|
1983
|
23 |
3 |
p. 595-
1 p.
|
artikel
|
| 91 |
Hard-disk based development systems with multiprocessor emulation
|
|
|
1983
|
23 |
3 |
p. 600-
1 p.
|
artikel
|
| 92 |
Hot electron diffusion in fine line semiconductor devices
|
|
|
1983
|
23 |
3 |
p. 601-
1 p.
|
artikel
|
| 93 |
Hybrid economics—a specialist manufacturer's view
|
|
|
1983
|
23 |
3 |
p. 603-
1 p.
|
artikel
|
| 94 |
Hybrid microelectronic interconnections
|
|
|
1983
|
23 |
3 |
p. 602-
1 p.
|
artikel
|
| 95 |
I challenge your beliefs about reliability. Part I: Risky Beliefs
|
|
|
1983
|
23 |
3 |
p. 587-
1 p.
|
artikel
|
| 96 |
In-circuit testing of LSI-based PCBs
|
|
|
1983
|
23 |
3 |
p. 598-
1 p.
|
artikel
|
| 97 |
Increase I/O-handling options with a software serial I/O port
|
|
|
1983
|
23 |
3 |
p. 598-
1 p.
|
artikel
|
| 98 |
Influence of oxide characteristics on the reliability of bipolar products
|
|
|
1983
|
23 |
3 |
p. 589-
1 p.
|
artikel
|
| 99 |
Influence on LSI package wireability of via availability and wiring track accessibility
|
|
|
1983
|
23 |
3 |
p. 596-597
2 p.
|
artikel
|
| 100 |
In situ IR observation of electromigration induced damage in heavily doped polycrystalline silicon resistors
|
|
|
1983
|
23 |
3 |
p. 589-
1 p.
|
artikel
|
| 101 |
Investigating reliability attributes of silicon photovoltaic cells: an overview
|
|
|
1983
|
23 |
3 |
p. 589-
1 p.
|
artikel
|
| 102 |
Ion projection microlithography
|
|
|
1983
|
23 |
3 |
p. 603-
1 p.
|
artikel
|
| 103 |
Leadframe materials for packaging semiconductors
|
|
|
1983
|
23 |
3 |
p. 598-
1 p.
|
artikel
|
| 104 |
Linearly correlated intermittent failures
|
|
|
1983
|
23 |
3 |
p. 591-
1 p.
|
artikel
|
| 105 |
Living in a 64K world
|
|
|
1983
|
23 |
3 |
p. 598-599
2 p.
|
artikel
|
| 106 |
Logic-compatible MOSFETs simplify high-power interfacing
|
|
|
1983
|
23 |
3 |
p. 595-
1 p.
|
artikel
|
| 107 |
Low frequency planar plasma etching of polycide structures in an SF6 glow discharge
|
|
|
1983
|
23 |
3 |
p. 601-
1 p.
|
artikel
|
| 108 |
Mechanical technology and quality assurance as applied to a video recorder drive mechanism
|
|
|
1983
|
23 |
3 |
p. 594-595
2 p.
|
artikel
|
| 109 |
Metal migration (Ag, Cu, Pb) in encapsulated modules and time-to-fail model as a function of the environment and package properties
|
|
|
1983
|
23 |
3 |
p. 589-
1 p.
|
artikel
|
| 110 |
Metrology in mask manufacturing
|
|
|
1983
|
23 |
3 |
p. 597-598
2 p.
|
artikel
|
| 111 |
Miniature beryllia circuits—a new technology for microwave power amplifiers
|
|
|
1983
|
23 |
3 |
p. 597-
1 p.
|
artikel
|
| 112 |
Minority carrier diffusion length in LPE In x Ga 1−x P:N layers (x < 0.01)
|
|
|
1983
|
23 |
3 |
p. 601-
1 p.
|
artikel
|
| 113 |
New methodologies and tools speed factory and field repair
|
|
|
1983
|
23 |
3 |
p. 593-
1 p.
|
artikel
|
| 114 |
New practical Bayes estimators for the 2-parameter Weibull distribution
|
|
|
1983
|
23 |
3 |
p. 592-
1 p.
|
artikel
|
| 115 |
Non-homogeneous electrical transport through silicon-on-sapphire thin films: evidence of the internal stress influence
|
|
|
1983
|
23 |
3 |
p. 601-
1 p.
|
artikel
|
| 116 |
Nonparametric estimation and goodness-of-fit testing of hypotheses for distributions in accelerated life testing
|
|
|
1983
|
23 |
3 |
p. 594-
1 p.
|
artikel
|
| 117 |
Nonparametric estimation and inference for reliability
|
|
|
1983
|
23 |
3 |
p. 594-
1 p.
|
artikel
|
| 118 |
On a two-unit standby redundant system with two types of failures and preventive maintenance
|
Mahmoud, M.I.
|
|
1983
|
23 |
3 |
p. 481-484
4 p.
|
artikel
|
| 119 |
On profit considerations of a maintained system with minor repair
|
Gupta, M.C.
|
|
1983
|
23 |
3 |
p. 437-439
3 p.
|
artikel
|
| 120 |
On the determination of all tie sets and minimal cut sets between any two nodes of a graph through Petri nets
|
Hura, G.S.
|
|
1983
|
23 |
3 |
p. 471-475
5 p.
|
artikel
|
| 121 |
On the optimality of k-out-of-n:G systems
|
|
|
1983
|
23 |
3 |
p. 593-
1 p.
|
artikel
|
| 122 |
On the structure of the laser irradiated Si(111)−(1 × 1) surface
|
|
|
1983
|
23 |
3 |
p. 603-604
2 p.
|
artikel
|
| 123 |
Optimization of indium-lead alloys for controlled collapse chip connection application
|
|
|
1983
|
23 |
3 |
p. 597-
1 p.
|
artikel
|
| 124 |
Oxygen incorporation and precipitation in Czochralski-grown silicon
|
|
|
1983
|
23 |
3 |
p. 600-
1 p.
|
artikel
|
| 125 |
Parallel/series dependency and equivalence in generalized Markov's chains
|
Lombardi, Fabrizio
|
|
1983
|
23 |
3 |
p. 501-507
7 p.
|
artikel
|
| 126 |
Particle size analysis techniques for metal powders and frits used in thick-film pastes
|
|
|
1983
|
23 |
3 |
p. 602-
1 p.
|
artikel
|
| 127 |
Patterns in listings of failure-rate and MTTF values and listings of other data
|
|
|
1983
|
23 |
3 |
p. 590-591
2 p.
|
artikel
|
| 128 |
Pellicles—a means to increase die yield
|
|
|
1983
|
23 |
3 |
p. 595-
1 p.
|
artikel
|
| 129 |
Phoenix 1—a low cost development system
|
|
|
1983
|
23 |
3 |
p. 600-
1 p.
|
artikel
|
| 130 |
Photomask and reticle repair: equipment and techniques
|
|
|
1983
|
23 |
3 |
p. 596-
1 p.
|
artikel
|
| 131 |
Photomask inspection: an array of instrumentation
|
|
|
1983
|
23 |
3 |
p. 596-
1 p.
|
artikel
|
| 132 |
Photovoltaic array reliability optimization
|
|
|
1983
|
23 |
3 |
p. 588-
1 p.
|
artikel
|
| 133 |
Photovoltaic module reliability improvement through application testing and failure analysis
|
|
|
1983
|
23 |
3 |
p. 587-588
2 p.
|
artikel
|
| 134 |
Physical design of a custom 16-bit microprocessor
|
|
|
1983
|
23 |
3 |
p. 596-
1 p.
|
artikel
|
| 135 |
Positive wafer temperature control to increase dry etch throughput and yield
|
|
|
1983
|
23 |
3 |
p. 596-
1 p.
|
artikel
|
| 136 |
Power semiconductor packaging
|
|
|
1983
|
23 |
3 |
p. 598-
1 p.
|
artikel
|
| 137 |
Precision temperature profiling in highly accelerated VLSI life test
|
|
|
1983
|
23 |
3 |
p. 593-
1 p.
|
artikel
|
| 138 |
Probabilistic delay evaluation in combinational digital circuits by petri nets
|
Corsi, Francesco
|
|
1983
|
23 |
3 |
p. 541-553
13 p.
|
artikel
|
| 139 |
Problems of electric contacts under the aspect of microelectronics
|
|
|
1983
|
23 |
3 |
p. 591-
1 p.
|
artikel
|
| 140 |
Process control of the chlorobenzene single-step liftoff process with a diazo-type resist
|
|
|
1983
|
23 |
3 |
p. 598-
1 p.
|
artikel
|
| 141 |
Process monitoring and evaluation
|
|
|
1983
|
23 |
3 |
p. 595-
1 p.
|
artikel
|
| 142 |
Product liability—challenger to quality
|
|
|
1983
|
23 |
3 |
p. 587-
1 p.
|
artikel
|
| 143 |
Publications, notices, calls for papers, etc.
|
|
|
1983
|
23 |
3 |
p. 411-412
2 p.
|
artikel
|
| 144 |
Quadrilateral-star transformation: an aid for reliability evaluation of large complex systems
|
|
|
1983
|
23 |
3 |
p. 595-
1 p.
|
artikel
|
| 145 |
Qualification, testing and preliminary treatment of integrated circuits
|
|
|
1983
|
23 |
3 |
p. 589-
1 p.
|
artikel
|
| 146 |
Quality and reliability assurance systems in IBM semiconductor manufacturing
|
|
|
1983
|
23 |
3 |
p. 589-
1 p.
|
artikel
|
| 147 |
Quantitative evaluation of nuclear reactor protective equipment using Markov approach
|
|
|
1983
|
23 |
3 |
p. 594-
1 p.
|
artikel
|
| 148 |
Redundant microcomputer-controlled 3-stage Clos network for system-availability enhancement
|
|
|
1983
|
23 |
3 |
p. 592-
1 p.
|
artikel
|
| 149 |
Reliability dimensions for communication networks and their determination by calculation
|
|
|
1983
|
23 |
3 |
p. 590-
1 p.
|
artikel
|
| 150 |
Reliability growth and Duane learning curves
|
|
|
1983
|
23 |
3 |
p. 587-
1 p.
|
artikel
|
| 151 |
Reliability hazards of silver-aluminum substrate bonds in MOS devices
|
|
|
1983
|
23 |
3 |
p. 589-
1 p.
|
artikel
|
| 152 |
Reliability impact of solar electric generation upon electric utility systems
|
|
|
1983
|
23 |
3 |
p. 590-
1 p.
|
artikel
|
| 153 |
Reliability inspection of electronic components from the point of view of the users
|
|
|
1983
|
23 |
3 |
p. 588-
1 p.
|
artikel
|
| 154 |
Reliability of flip chip solder bump joints
|
|
|
1983
|
23 |
3 |
p. 588-
1 p.
|
artikel
|
| 155 |
Reliability of LED's; are the accelerated ageing tests reliable
|
|
|
1983
|
23 |
3 |
p. 588-
1 p.
|
artikel
|
| 156 |
Reliability optimization—a case study
|
|
|
1983
|
23 |
3 |
p. 594-
1 p.
|
artikel
|
| 157 |
Reliability-related inferences for a Gamma distribution
|
|
|
1983
|
23 |
3 |
p. 592-
1 p.
|
artikel
|
| 158 |
Reliability terminology and formulae for photovoltaic power systems
|
|
|
1983
|
23 |
3 |
p. 590-
1 p.
|
artikel
|
| 159 |
Representation of distributions having monotone or bathtubshaped failure rates
|
|
|
1983
|
23 |
3 |
p. 593-
1 p.
|
artikel
|
| 160 |
Select precision IC op amps for optimum design performance
|
|
|
1983
|
23 |
3 |
p. 596-
1 p.
|
artikel
|
| 161 |
Semiconductor final test logistics and product dispositioning systems
|
|
|
1983
|
23 |
3 |
p. 600-
1 p.
|
artikel
|
| 162 |
Sequential probability ratio tests for the shape parameter of a nonhomogeneous Poisson process
|
|
|
1983
|
23 |
3 |
p. 593-
1 p.
|
artikel
|
| 163 |
Simplification of Boolean functions through petri nets
|
Hura, G.S.
|
|
1983
|
23 |
3 |
p. 467-470
4 p.
|
artikel
|
| 164 |
Simplify hard-disk interfaces with a VLSI controller
|
|
|
1983
|
23 |
3 |
p. 595-
1 p.
|
artikel
|
| 165 |
Single wafer plasma etching. 2. SiO2: etching mechanisms and characteristics
|
|
|
1983
|
23 |
3 |
p. 601-602
2 p.
|
artikel
|
| 166 |
Skip-lot destructive sampling with Bayesian inference
|
|
|
1983
|
23 |
3 |
p. 595-
1 p.
|
artikel
|
| 167 |
Some aspects of placement optimization of thermal significant components in thick film high-power hybrid integrated circuits
|
Kramek, Jan P.
|
|
1983
|
23 |
3 |
p. 421-436
16 p.
|
artikel
|
| 168 |
Some properties of distributions useful in the study of rare events
|
|
|
1983
|
23 |
3 |
p. 594-
1 p.
|
artikel
|
| 169 |
Statistical methods in accelerated testing of electronic capacitors lifetime
|
|
|
1983
|
23 |
3 |
p. 590-
1 p.
|
artikel
|
| 170 |
Stochastic behavior of a two-unit repairable system subject to two types of failure and inspection
|
Subramanyam Naidu, R.
|
|
1983
|
23 |
3 |
p. 445-447
3 p.
|
artikel
|
| 171 |
Technical data package for procurement
|
Reiche, Hans
|
|
1983
|
23 |
3 |
p. 509-518
10 p.
|
artikel
|
| 172 |
Testing for MOS IC failure modes
|
|
|
1983
|
23 |
3 |
p. 588-
1 p.
|
artikel
|
| 173 |
The ageing behaviour of commercial thick-film resistors
|
|
|
1983
|
23 |
3 |
p. 602-
1 p.
|
artikel
|
| 174 |
The detection of microcontaminants in semiconductor process fluids using an acoustic technology
|
|
|
1983
|
23 |
3 |
p. 600-
1 p.
|
artikel
|
| 175 |
The effect of ion implanter design upon implant uniformity
|
|
|
1983
|
23 |
3 |
p. 603-
1 p.
|
artikel
|
| 176 |
The effect of preventive maintenance on a two-dissimilar unit standby system
|
Mahmoud, M.I.
|
|
1983
|
23 |
3 |
p. 485-488
4 p.
|
artikel
|
| 177 |
The effects of hydrogen ambients on failure mechanisms in CMOS metallization
|
|
|
1983
|
23 |
3 |
p. 589-
1 p.
|
artikel
|
| 178 |
The highly productive step-and-repeat projection lithography
|
|
|
1983
|
23 |
3 |
p. 597-
1 p.
|
artikel
|
| 179 |
The influence of hydrogen gas on the characteristics of amorphous silicon deposited by RF sputtering
|
|
|
1983
|
23 |
3 |
p. 601-
1 p.
|
artikel
|
| 180 |
The mechanism of single-step liftoff with chlorobenzene in a diazo-type resist
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 181 |
Theory of concentration profiling technique for semiconductors with many deep levels
|
|
|
1983
|
23 |
3 |
p. 600-
1 p.
|
artikel
|
| 182 |
The 2653 polynomial generator and checker
|
|
|
1983
|
23 |
3 |
p. 600-
1 p.
|
artikel
|
| 183 |
The problems of selecting a proper microlithographic imaging system
|
|
|
1983
|
23 |
3 |
p. 599-
1 p.
|
artikel
|
| 184 |
The properties of thick-film resistors on dielectrics
|
|
|
1983
|
23 |
3 |
p. 602-
1 p.
|
artikel
|
| 185 |
The proximity effect in electron beam lithography
|
|
|
1983
|
23 |
3 |
p. 604-
1 p.
|
artikel
|
| 186 |
The reactive ion etching of Al-Si-Cu alloy films
|
|
|
1983
|
23 |
3 |
p. 602-
1 p.
|
artikel
|
| 187 |
The reliability of electronic components. Part 7: the reliability of hybrid integrated circuits
|
|
|
1983
|
23 |
3 |
p. 590-
1 p.
|
artikel
|
| 188 |
Thermal analysis helps keep hybrid microcircuits cool
|
|
|
1983
|
23 |
3 |
p. 603-
1 p.
|
artikel
|
| 189 |
Thermal characteristics of a hybrid microcircuit
|
|
|
1983
|
23 |
3 |
p. 603-
1 p.
|
artikel
|
| 190 |
The role of testing in VLS/VHS integrated circuit development
|
|
|
1983
|
23 |
3 |
p. 594-
1 p.
|
artikel
|
| 191 |
The thin-film module as a high-performance semiconductor package
|
|
|
1983
|
23 |
3 |
p. 597-
1 p.
|
artikel
|
| 192 |
Thin-film RAM has radiation hardness with nonvolatility
|
|
|
1983
|
23 |
3 |
p. 603-
1 p.
|
artikel
|
| 193 |
TMS 9995 the power packed microcontroller
|
|
|
1983
|
23 |
3 |
p. 600-
1 p.
|
artikel
|
| 194 |
Vacuum problems in today's integrated circuit manufacturing systems. Part I
|
|
|
1983
|
23 |
3 |
p. 598-
1 p.
|
artikel
|
| 195 |
Vacuum problems in today's integrated circuit manufacturing systems. Part II
|
|
|
1983
|
23 |
3 |
p. 598-
1 p.
|
artikel
|
| 196 |
V-forward stress and V-reverse screen for monitoring and early identification of Schottky reliability
|
|
|
1983
|
23 |
3 |
p. 593-
1 p.
|
artikel
|
| 197 |
VLSI development system spans all phases of IC design
|
|
|
1983
|
23 |
3 |
p. 598-
1 p.
|
artikel
|
| 198 |
Wire bonders: 1982 and beyond
|
|
|
1983
|
23 |
3 |
p. 598-
1 p.
|
artikel
|
| 199 |
X-ray radiographic techniques in failure analysis
|
|
|
1983
|
23 |
3 |
p. 587-
1 p.
|
artikel
|
| 200 |
ZRM 20—an electron-beam mask and wafer measuring and inspection system
|
|
|
1983
|
23 |
3 |
p. 604-
1 p.
|
artikel
|
Tijdschrift beschrijving