| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A highly reliable and low-overhead quadruple-node-upset tolerant latch design
|
Xu, Hui
|
|
|
157 |
C |
p.
|
artikel
|
| 2 |
A low power TNU-resilient hardened latch design
|
Huang, Zhengfeng
|
|
|
157 |
C |
p.
|
artikel
|
| 3 |
An investigation into the thermal surface contact resistance, fin width and temperature on negative bias temperature instability during self-heating
|
Liu, Yan
|
|
|
157 |
C |
p.
|
artikel
|
| 4 |
Application of 2D Walsh-Hadamard transform in SRAM upset bitmaps processing
|
Pilipenko, A.S.
|
|
|
157 |
C |
p.
|
artikel
|
| 5 |
A survey on LED Prognostics and Health Management and uncertainty reduction
|
Rocchetta, Roberto
|
|
|
157 |
C |
p.
|
artikel
|
| 6 |
Comparative study: AutoDPR-SEM for enhancing CNN reliability in SRAM-based FPGAs through autonomous reconfiguration
|
Tian, Haonan
|
|
|
157 |
C |
p.
|
artikel
|
| 7 |
Development of eutectic gallium-indium-based transparent conductive electrodes on flexible substrates for touch sensor integration
|
Kim, Hongseok
|
|
|
157 |
C |
p.
|
artikel
|
| 8 |
Editorial Board
|
|
|
|
157 |
C |
p.
|
artikel
|
| 9 |
Effect of Co on microstructure evolution and thermal fatigue stability of lead-free solder alloys of SACBSN series
|
Wang, Zhendong
|
|
|
157 |
C |
p.
|
artikel
|
| 10 |
Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package
|
Depiver, Joshua A.
|
|
|
157 |
C |
p.
|
artikel
|
| 11 |
Failure analysis of heavy ion-irradiated silicon carbide junction barrier Schottky diodes
|
Cao, Shuang
|
|
|
157 |
C |
p.
|
artikel
|
| 12 |
Improvement of VRT immunity using low 10-boron word line in recent DRAM
|
Jang, Dongkyu
|
|
|
157 |
C |
p.
|
artikel
|
| 13 |
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin
|
Inamdar, A.
|
|
|
157 |
C |
p.
|
artikel
|
| 14 |
Numerical simulation approach for consideration of ageing effects in PCB substrates by modifying viscoelastic materials properties
|
van Dijk, Marius
|
|
|
157 |
C |
p.
|
artikel
|
| 15 |
SiC Super-Junction MOSFET robustness assessment and method to improve avalanche capability
|
Chen, De-Xin
|
|
|
157 |
C |
p.
|
artikel
|
| 16 |
Techniques for detecting and masking faults in semantic segmentation applications
|
Burel, Stéphane
|
|
|
157 |
C |
p.
|
artikel
|
| 17 |
Theoretical and simulation-based assessment of electrically doped junctionless TFET with metal-strip and hetero-material considering interface trap charges
|
Chandan, Bandi Venkata
|
|
|
157 |
C |
p.
|
artikel
|
| 18 |
Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics
|
Wan, Guoshun
|
|
|
157 |
C |
p.
|
artikel
|
Tijdschrift beschrijving