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Journal description
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Details for article 13 of 18 found articles
| Title: |
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin |
| Author: |
Inamdar, A. van Soestbergen, M. Mavinkurve, A. van Driel, W.D. Zhang, G.Q. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 157 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
The Author(s) |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 13 of 18 found articles
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