| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A breakthrough for temperature and linearity stability from device to circuit-level with 14 nm junctionless SOI FinFET: Advancing K-band LNA performance
|
Khodabakhsh, Amir
|
|
|
152 |
C |
p.
|
article
|
| 2 |
Aluminum addition to Sn-3Ag-0.5Cu-1In-xAl alloy effect on corrosion kinetics in HCl acid solution
|
Obaid, Masoud Giyathaddin
|
|
|
152 |
C |
p.
|
article
|
| 3 |
Analysis of noise behavior and reliability of pocket doped negative capacitance FET under the impact of trap charges and temperature
|
Malvika,
|
|
|
152 |
C |
p.
|
article
|
| 4 |
An efficient radiation hardening SRAM cell to mitigate single and double node upset soft errors
|
Mukku, Pavan Kumar
|
|
|
152 |
C |
p.
|
article
|
| 5 |
Bond-pad damage in ultrasonic wedge bonding
|
Khajehvand, Milad
|
|
|
152 |
C |
p.
|
article
|
| 6 |
Characterization of trap evolution in GaN-based HEMTs under pulsed stress
|
Wen, Qian
|
|
|
152 |
C |
p.
|
article
|
| 7 |
Current imbalance analysis of multichip influenced by parasitic inductance within PP-IEGT
|
Wang, Zhiqiang
|
|
|
152 |
C |
p.
|
article
|
| 8 |
Design of soft error correction flip-flop cells for highly reliable applications
|
Li, Hongchen
|
|
|
152 |
C |
p.
|
article
|
| 9 |
ECS an endeavor towards providing similar cache reliability behavior in different programs
|
Ahmadilivani, Mohammad Hasan
|
|
|
152 |
C |
p.
|
article
|
| 10 |
Editorial Board
|
|
|
|
152 |
C |
p.
|
article
|
| 11 |
Modelling and mitigating oscillation in E-mode GaN HEMT: A simulation-based approach to parasitic inductance optimization
|
Liu, Xinzhi
|
|
|
152 |
C |
p.
|
article
|
| 12 |
Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging
|
Luo, Runding
|
|
|
152 |
C |
p.
|
article
|
| 13 |
Performance degradation and reliability analysis of a MEMS flow sensor with accelerated degradation testing
|
Kang, Qiaoqiao
|
|
|
152 |
C |
p.
|
article
|
| 14 |
Performance enhancement of 1.7 kV MOSFET using PIN-junction gate and integrated heterojunction
|
Wang, Qing-yuan
|
|
|
152 |
C |
p.
|
article
|
| 15 |
Reliability evaluation of thick Ag wire bonding on Ni pad for power devices
|
Wei, Xing
|
|
|
152 |
C |
p.
|
article
|
| 16 |
Solder fatigue life modeling of QFN components based on design of experiments
|
Käß, Markus
|
|
|
152 |
C |
p.
|
article
|
| 17 |
Total ionizing dose and single event effect response of 22 nm ultra-thin body and buried oxide fully depleted silicon-on-insulator technology
|
Yin, Yanan
|
|
|
152 |
C |
p.
|
article
|
| 18 |
Transient simulations and theoretical modeling of near-junction heat conduction in GaN-on-diamond HEMT
|
Shen, Yiyang
|
|
|
152 |
C |
p.
|
article
|
| 19 |
Wavelet-based rapid identification of IGBT switch breakdown in voltage source converter
|
Ghosh, Sankha Subhra
|
|
|
152 |
C |
p.
|
article
|
Journal description