| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A full-field warpage characterization measurement method coupled with infrared information
|
Zeng, Baoshan
|
|
|
149 |
C |
p.
|
artikel
|
| 2 |
A HCI self-healing circuit of a bandgap reference circuit with curvature compensation
|
Zhang, Jun-an
|
|
|
149 |
C |
p.
|
artikel
|
| 3 |
Analysis of component current stresses of grid-forming converters for two-phase three-wire isolated AC power grids
|
de Oliveira, J.H.
|
|
|
149 |
C |
p.
|
artikel
|
| 4 |
A novel stepped AlGaN hybrid buffer GaN HEMT for power electronics applications
|
Garg, Tanvika
|
|
|
149 |
C |
p.
|
artikel
|
| 5 |
Comprehensive investigation on different ions of geostationary orbit induced single event burnout in GaN HEMT power devices
|
Wu, Wangran
|
|
|
149 |
C |
p.
|
artikel
|
| 6 |
Editorial Board
|
|
|
|
149 |
C |
p.
|
artikel
|
| 7 |
Efficient protection of polar decoders against Single Event Upsets (SEUs) on user memories
|
Tian, Dong
|
|
|
149 |
C |
p.
|
artikel
|
| 8 |
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature
|
Wei, Xin
|
|
|
149 |
C |
p.
|
artikel
|
| 9 |
Hang features of microcontroller exposed to pulsed ionizing radiation
|
Pilipenko, Anatoly Sergeevich
|
|
|
149 |
C |
p.
|
artikel
|
| 10 |
Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
|
Zhao, Shuaijie
|
|
|
149 |
C |
p.
|
artikel
|
| 11 |
Mechanical stress state consideration for enhanced electromigration life prediction in aluminum wire bonds
|
Vinson, Whit
|
|
|
149 |
C |
p.
|
artikel
|
| 12 |
Multi-physics coupling analysis of high-power IGBT module bonding wires fault considering stray inductance of main circuit
|
Wang, Yue
|
|
|
149 |
C |
p.
|
artikel
|
| 13 |
Simulation study on single-event burnout in field-plated Ga2O3 MOSFETs
|
Yu, Cheng-hao
|
|
|
149 |
C |
p.
|
artikel
|
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