| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
An efficient thermal model of chiplet heterogeneous integration system for steady-state temperature prediction
|
Wang, Chenghan
|
|
|
146 |
C |
p.
|
article
|
| 2 |
Comphy v3.0—A compact-physics framework for modeling charge trapping related reliability phenomena in MOS devices
|
Waldhoer, Dominic
|
|
|
146 |
C |
p.
|
article
|
| 3 |
Editorial Board
|
|
|
|
146 |
C |
p.
|
article
|
| 4 |
Effect of Bi content and aging on solder joint shear properties considering strain rate
|
Belhadi, Mohamed El Amine
|
|
|
146 |
C |
p.
|
article
|
| 5 |
Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density
|
Zhu, Qing-Sheng
|
|
|
146 |
C |
p.
|
article
|
| 6 |
Effect of slurry flow rates on tungsten removal optimization in chemical mechanical planarization
|
Liau, Leo Chau-Kuang
|
|
|
146 |
C |
p.
|
article
|
| 7 |
Effect of temperature on the low cycle fatigue properties of BGA solder joints
|
Wei, Xin
|
|
|
146 |
C |
p.
|
article
|
| 8 |
Interfacial trap charge and self-heating effect based reliability analysis of a Dual-Drain Vertical Tunnel FET
|
Das, Diganta
|
|
|
146 |
C |
p.
|
article
|
| 9 |
Investigation of CMOS reliability in 28 nm through BTI and HCI extraction
|
Coutet, Julien
|
|
|
146 |
C |
p.
|
article
|
| 10 |
Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process
|
Apalowo, Rilwan Kayode
|
|
|
146 |
C |
p.
|
article
|
| 11 |
Lifetime prediction of electronic devices based on the P-stacking machine learning model
|
Wang, Fei
|
|
|
146 |
C |
p.
|
article
|
| 12 |
Mapping and statistical analysis of filaments locations in amorphous HfO2 ReRAM cells
|
Stellari, Franco
|
|
|
146 |
C |
p.
|
article
|
| 13 |
Optimal performance and cost-effective design of BGA solder joints using a deterministic design optimization (DDO) under real operating conditions
|
Ghenam, Sinda
|
|
|
146 |
C |
p.
|
article
|
| 14 |
SEU performance of Schmitt-trigger-based flip-flops at the 22-nm FD SOI technology node
|
Li, Zongru
|
|
|
146 |
C |
p.
|
article
|
| 15 |
Single event burnout of SiC MOSFET induced by atmospheric neutrons
|
Mo, Lihua
|
|
|
146 |
C |
p.
|
article
|
| 16 |
Testability design of memristive digital circuits based on Knowm memristor
|
Lin, Mi
|
|
|
146 |
C |
p.
|
article
|
| 17 |
The defects of reported TID reinforced structures and the improved structure
|
Liao, Yongbo
|
|
|
146 |
C |
p.
|
article
|
| 18 |
Understanding fault-tolerance vulnerabilities in advanced SoC FPGAs for critical applications
|
Cherezova, Natalia
|
|
|
146 |
C |
p.
|
article
|
Journal description