| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
An efficient equivalent static methodology for simulating electronic packages subjected to resonant vibrations
|
Gharaibeh, Mohammad A.
|
|
|
145 |
C |
p.
|
artikel
|
| 2 |
A novel p-GaN HEMT with AlInN/AlN/GaN double heterostructure and InAlGaN back-barrier
|
Garg, Tanvika
|
|
|
145 |
C |
p.
|
artikel
|
| 3 |
Design and manufacturing of aspherical GaAs-SILs for a versatile optical semiconductor failure analysis system
|
Arata, Ikuo
|
|
|
145 |
C |
p.
|
artikel
|
| 4 |
Dynamic on-resistance stability of SiC and GaN power devices during high-frequency (100–300 kHz) hard switching and zero voltage switching operations
|
Huang, Zhen-Hong
|
|
|
145 |
C |
p.
|
artikel
|
| 5 |
Editorial Board
|
|
|
|
145 |
C |
p.
|
artikel
|
| 6 |
Enhanced solder fatigue life of chip resistor by optimizing solder shape
|
Ha, Jonghwan
|
|
|
145 |
C |
p.
|
artikel
|
| 7 |
Impact of device-to-device interference in nanosheet field-effect transistors
|
Lee, Khwang-Sun
|
|
|
145 |
C |
p.
|
artikel
|
| 8 |
Impact of hole trap-detrap mechanism on X-ray irradiation induced threshold voltage shift of radiation-hardened GAA TFET device
|
Kumar, Pankaj
|
|
|
145 |
C |
p.
|
artikel
|
| 9 |
Lifetime prediction for press pack IGBT device by considering fretting wear failure
|
Yao, Ran
|
|
|
145 |
C |
p.
|
artikel
|
| 10 |
Low-temperature reliability enhancement of system-in-package with silicon-based resistors and its electrothermal analysis
|
Wang, Lu
|
|
|
145 |
C |
p.
|
artikel
|
| 11 |
Modelling and analysis of contactless sensor for TSV fault based on resonant inductive coupling
|
Liu, X.Y.
|
|
|
145 |
C |
p.
|
artikel
|
| 12 |
Physics of failure based lifetime modelling for sintered silver die attach in power electronics: Accelerated stress testing by isothermal bending and thermal shock in comparison
|
Heilmann, Jens
|
|
|
145 |
C |
p.
|
artikel
|
| 13 |
Remaining useful life prediction of lithium-ion batteries based on KS agglomeration function integrating multi-expert knowledge
|
Zhigang, Lv
|
|
|
145 |
C |
p.
|
artikel
|
| 14 |
Review of condition monitoring methods for capacitors used in power converters
|
Nathan, Leema Prasila Arokia
|
|
|
145 |
C |
p.
|
artikel
|
| 15 |
Scaling-friendly approaches to minimize the magnitude and asymmetry of wafer warpage during 3-D NAND fabrication
|
Okudur, Oguzhan Orkut
|
|
|
145 |
C |
p.
|
artikel
|
| 16 |
Stout hourglass – The ideal shape for robust solder joints
|
Wong, E.H.
|
|
|
145 |
C |
p.
|
artikel
|
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