| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Analyses on the large size PBGA packaging reliability under random vibrations for space applications
|
Kim, Yeong K.
|
|
|
109 |
C |
p.
|
artikel
|
| 2 |
Analysis of signal attenuation in global shutter CMOS image sensor
|
Xu, Jiangtao
|
|
|
109 |
C |
p.
|
artikel
|
| 3 |
A simulation-based methodology for aiding advanced driver assistance systems hazard analysis and risk assessment
|
Sini, Jacopo
|
|
|
109 |
C |
p.
|
artikel
|
| 4 |
Bending reliability of transparent electrode of printed invisible silver-grid/PEDOT:PSS on flexible epoxy film substrate for powder electroluminescent device
|
Ohsawa, Masato
|
|
|
109 |
C |
p.
|
artikel
|
| 5 |
BTI saturation and universal relaxation in SiC power MOSFETs
|
Sánchez, Luis
|
|
|
109 |
C |
p.
|
artikel
|
| 6 |
Development of a cycle counting algorithm with temporal parameters
|
Twomey, James M.
|
|
|
109 |
C |
p.
|
artikel
|
| 7 |
Editorial Board
|
|
|
|
109 |
C |
p.
|
artikel
|
| 8 |
Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules
|
Hagberg, Juha
|
|
|
109 |
C |
p.
|
artikel
|
| 9 |
Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life
|
Chen, Deng Yun
|
|
|
109 |
C |
p.
|
artikel
|
| 10 |
FlexGripPlus: An improved GPGPU model to support reliability analysis
|
Condia, Josie E. Rodriguez
|
|
|
109 |
C |
p.
|
artikel
|
| 11 |
Fretting characteristics and environmental reliability of contacts with gold-plated PCB sample and different metal probe
|
Lin, Xueyan
|
|
|
109 |
C |
p.
|
artikel
|
| 12 |
Lap shear test for solder materials: Local stress states and their effect on deformation and damage
|
Siroky, Georg
|
|
|
109 |
C |
p.
|
artikel
|
| 13 |
MEMS gyroscope fault detection and elimination for an underwater robot using the combination of smooth switching and dynamic redundancy method
|
Mirzaei, Mojtaba
|
|
|
109 |
C |
p.
|
artikel
|
| 14 |
Mitigating single-event multiple transients in a combinational circuit based on standard cells
|
Zhao, Wen
|
|
|
109 |
C |
p.
|
artikel
|
| 15 |
Physics of failure of die-attach joints in IGBTs under accelerated aging: Evolution of micro-defects in lead-free solder alloys
|
Yongle, Huang
|
|
|
109 |
C |
p.
|
artikel
|
| 16 |
Prevention of copper corrosion on post-FIB wet stained sample using UV charge-neutralization method
|
Lee, Sharon
|
|
|
109 |
C |
p.
|
artikel
|
| 17 |
Radiation response of zirconium silicate P-MOS capacitor
|
Lok, Ramazan
|
|
|
109 |
C |
p.
|
artikel
|
| 18 |
Sensitivity improvement of ultrasonic beam induced resistance change (SOBIRCH) method with ultrasound resonance inside mold resin
|
Matsui, Takuto
|
|
|
109 |
C |
p.
|
artikel
|
| 19 |
Spectral efficiency of lutetium aluminum garnet (Lu3Al5O12:Ce) with microelectronic optical sensors
|
Michail, C.
|
|
|
109 |
C |
p.
|
artikel
|
| 20 |
Statistical analysis on the mechanical and micro-structural characteristics of thermosonic CuAl interconnection
|
Yau, Chua Kok
|
|
|
109 |
C |
p.
|
artikel
|
| 21 |
TCAD simulation of hot-carrier stress degradation in split-gate n-channel STI-LDMOS transistors
|
Giuliano, Federico
|
|
|
109 |
C |
p.
|
artikel
|
| 22 |
The degradation study for QFP interconnection structure based on PCMD health index and Darveaux model
|
Longteng, Li
|
|
|
109 |
C |
p.
|
artikel
|
| 23 |
The two-phase flow simulation and experimental research on the formation of solder voids in power module
|
Wang, Zheng-Duo
|
|
|
109 |
C |
p.
|
artikel
|
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