| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A mixed-effects model of two-phase degradation process for reliability assessment and RUL prediction
|
Wang, Hongyu
|
|
|
107 |
C |
p.
|
artikel
|
| 2 |
Analysis of OFF-state dynamic avalanche instability in silicon-on-insulator lateral IGBTs at low temperature
|
Zhang, Long
|
|
|
107 |
C |
p.
|
artikel
|
| 3 |
Analysis of the vulnerability of MEMS tuning fork gyroscope during the gun launch
|
Lian, Jiangkai
|
|
|
107 |
C |
p.
|
artikel
|
| 4 |
Analysis on the damage and recovery of typhoon disaster based on UAV orthograph
|
Wu, Ke-Shou
|
|
|
107 |
C |
p.
|
artikel
|
| 5 |
Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints
|
Kong, Xiangxia
|
|
|
107 |
C |
p.
|
artikel
|
| 6 |
Comparative study on NBTI kinetics in Si p-FinFETs with B2H6-based and SiH4-based atomic layer deposition tungsten (ALD W) filling metal
|
Zhou, Longda
|
|
|
107 |
C |
p.
|
artikel
|
| 7 |
Dynamic optical beam induced current variation mapping: A fault isolation technique
|
Thor, M.H.
|
|
|
107 |
C |
p.
|
artikel
|
| 8 |
Editorial Board
|
|
|
|
107 |
C |
p.
|
artikel
|
| 9 |
Effect of Co content on the microstructure, spreadability, conductivity and corrosion resistance of Sn-0.7Cu alloy
|
Fan, Jianglei
|
|
|
107 |
C |
p.
|
artikel
|
| 10 |
Effect of electron radiation on small-signal parameters of NMOS devices at mm-wave frequencies
|
Habeenzu, Brilliant
|
|
|
107 |
C |
p.
|
artikel
|
| 11 |
Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material
|
Jansen, K.M.B.
|
|
|
107 |
C |
p.
|
artikel
|
| 12 |
Electrical duality design for the radon-222 decay chain
|
Ahmadi, Mohammad
|
|
|
107 |
C |
p.
|
artikel
|
| 13 |
Evaluation of ISO 26262 and IEC 61508 metrics for transient faults of a multi-processor system-on-chip through radiation testing
|
Ballan, Oscar
|
|
|
107 |
C |
p.
|
artikel
|
| 14 |
Fault protection for a SiC MOSFET based on gate voltage subjected to short circuit type II
|
Liao, Xinglin
|
|
|
107 |
C |
p.
|
artikel
|
| 15 |
Growth of intermetallic compounds in solder joints based on strongly coupled thermo–mechano–electro–diffusional theory
|
Zhipeng, Zhao
|
|
|
107 |
C |
p.
|
artikel
|
| 16 |
Mechanical stability of airgaps in nano-interconnects
|
Vanstreels, K.
|
|
|
107 |
C |
p.
|
artikel
|
| 17 |
Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure
|
Wang, Wenjie
|
|
|
107 |
C |
p.
|
artikel
|
| 18 |
Proton-induced single-event effects on 28 nm Kintex-7 FPGA
|
Wang, Zibo
|
|
|
107 |
C |
p.
|
artikel
|
| 19 |
Reliability hazard characterization of wafer-level spatial metrology parameters based on LOF-KNN method
|
Zhang, Jinli
|
|
|
107 |
C |
p.
|
artikel
|
| 20 |
Remaining useful life (RUL) estimation of electronic solder joints in rugged environment under random vibration
|
Muhammad, Noor
|
|
|
107 |
C |
p.
|
artikel
|
| 21 |
RETRACTED: A Review on Modeling and Analysis of Accelerated Degradation Data for Reliability Assessment
|
Pang, Zhenan
|
|
|
107 |
C |
p.
|
artikel
|
| 22 |
Retraction notice to “A review on modeling and analysis of accelerated degradation data for reliability assessment” [Microelectron. Reliab. 107 April (2020) 113602]
|
Pang, Zhenan
|
|
|
107 |
C |
p.
|
artikel
|
| 23 |
Self-heating aware EM reliability prediction of advanced CMOS technology by kinetic Monte Carlo method
|
Cai, Linlin
|
|
|
107 |
C |
p.
|
artikel
|
| 24 |
SiO2-SiO2 die-to-wafer direct bonding interface weakening
|
Tabata, Toshiyuki
|
|
|
107 |
C |
p.
|
artikel
|
| 25 |
Soft error hardening enhancement analysis of NBTI tolerant Schmitt trigger circuit
|
Shah, Ambika Prasad
|
|
|
107 |
C |
p.
|
artikel
|
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