nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A mixed-effects model of two-phase degradation process for reliability assessment and RUL prediction
|
Wang, Hongyu |
|
|
107 |
C |
p. |
artikel |
2 |
Analysis of OFF-state dynamic avalanche instability in silicon-on-insulator lateral IGBTs at low temperature
|
Zhang, Long |
|
|
107 |
C |
p. |
artikel |
3 |
Analysis of the vulnerability of MEMS tuning fork gyroscope during the gun launch
|
Lian, Jiangkai |
|
|
107 |
C |
p. |
artikel |
4 |
Analysis on the damage and recovery of typhoon disaster based on UAV orthograph
|
Wu, Ke-Shou |
|
|
107 |
C |
p. |
artikel |
5 |
Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints
|
Kong, Xiangxia |
|
|
107 |
C |
p. |
artikel |
6 |
Comparative study on NBTI kinetics in Si p-FinFETs with B2H6-based and SiH4-based atomic layer deposition tungsten (ALD W) filling metal
|
Zhou, Longda |
|
|
107 |
C |
p. |
artikel |
7 |
Dynamic optical beam induced current variation mapping: A fault isolation technique
|
Thor, M.H. |
|
|
107 |
C |
p. |
artikel |
8 |
Editorial Board
|
|
|
|
107 |
C |
p. |
artikel |
9 |
Effect of Co content on the microstructure, spreadability, conductivity and corrosion resistance of Sn-0.7Cu alloy
|
Fan, Jianglei |
|
|
107 |
C |
p. |
artikel |
10 |
Effect of electron radiation on small-signal parameters of NMOS devices at mm-wave frequencies
|
Habeenzu, Brilliant |
|
|
107 |
C |
p. |
artikel |
11 |
Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material
|
Jansen, K.M.B. |
|
|
107 |
C |
p. |
artikel |
12 |
Electrical duality design for the radon-222 decay chain
|
Ahmadi, Mohammad |
|
|
107 |
C |
p. |
artikel |
13 |
Evaluation of ISO 26262 and IEC 61508 metrics for transient faults of a multi-processor system-on-chip through radiation testing
|
Ballan, Oscar |
|
|
107 |
C |
p. |
artikel |
14 |
Fault protection for a SiC MOSFET based on gate voltage subjected to short circuit type II
|
Liao, Xinglin |
|
|
107 |
C |
p. |
artikel |
15 |
Growth of intermetallic compounds in solder joints based on strongly coupled thermo–mechano–electro–diffusional theory
|
Zhipeng, Zhao |
|
|
107 |
C |
p. |
artikel |
16 |
Mechanical stability of airgaps in nano-interconnects
|
Vanstreels, K. |
|
|
107 |
C |
p. |
artikel |
17 |
Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure
|
Wang, Wenjie |
|
|
107 |
C |
p. |
artikel |
18 |
Proton-induced single-event effects on 28 nm Kintex-7 FPGA
|
Wang, Zibo |
|
|
107 |
C |
p. |
artikel |
19 |
Reliability hazard characterization of wafer-level spatial metrology parameters based on LOF-KNN method
|
Zhang, Jinli |
|
|
107 |
C |
p. |
artikel |
20 |
Remaining useful life (RUL) estimation of electronic solder joints in rugged environment under random vibration
|
Muhammad, Noor |
|
|
107 |
C |
p. |
artikel |
21 |
RETRACTED: A Review on Modeling and Analysis of Accelerated Degradation Data for Reliability Assessment
|
Pang, Zhenan |
|
|
107 |
C |
p. |
artikel |
22 |
Retraction notice to “A review on modeling and analysis of accelerated degradation data for reliability assessment” [Microelectron. Reliab. 107 April (2020) 113602]
|
Pang, Zhenan |
|
|
107 |
C |
p. |
artikel |
23 |
Self-heating aware EM reliability prediction of advanced CMOS technology by kinetic Monte Carlo method
|
Cai, Linlin |
|
|
107 |
C |
p. |
artikel |
24 |
SiO2-SiO2 die-to-wafer direct bonding interface weakening
|
Tabata, Toshiyuki |
|
|
107 |
C |
p. |
artikel |
25 |
Soft error hardening enhancement analysis of NBTI tolerant Schmitt trigger circuit
|
Shah, Ambika Prasad |
|
|
107 |
C |
p. |
artikel |