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Journal description
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Details for article 2 of 12 found articles
| Title: |
Comparison of fatigue life prediction methods for solder joints under random vibration loading |
| Author: |
Xia, Jiang Yang, Lin Liu, Qunxing Peng, Qi Cheng, LanXian Li, GuoYuan |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 95 (2019) nr. C pages 58-64 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 12 found articles
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