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Details for article 1 of 12 found articles
| Title: |
A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes |
| Author: |
Borgesen, P. Wentlent, L. Alghoul, T. Sivasubramony, R. Yadav, M. Thekkut, S. Cuevas, J.L. Then Greene, C. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 95 (2019) nr. C pages 65-73 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 12 found articles
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