| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A bitstream readback-based automatic functional test and diagnosis method for Xilinx FPGAs
|
Ruan, Aiwu
|
|
2014
|
54 |
8 |
p. 1627-1635
9 p.
|
artikel
|
| 2 |
Accelerated life time testing and optical degradation of remote phosphor plates
|
Yazdan Mehr, M.
|
|
2014
|
54 |
8 |
p. 1544-1548
5 p.
|
artikel
|
| 3 |
Analysis of flicker and thermal noise in p-channel Underlap DG FinFET
|
Swain, Sanjit Kumar
|
|
2014
|
54 |
8 |
p. 1549-1554
6 p.
|
artikel
|
| 4 |
A shapeshifting evolvable hardware mechanism based on reconfigurable memFETs crossbar architecture
|
Martin-Martinez, J.
|
|
2014
|
54 |
8 |
p. 1500-1510
11 p.
|
artikel
|
| 5 |
Characterization of flip chip bonded structure with Cu ABL power bumps
|
Ma, Junsung
|
|
2014
|
54 |
8 |
p. 1598-1602
5 p.
|
artikel
|
| 6 |
Estimation of the degradation rate of multi-crystalline silicon photovoltaic module under thermal cycling stress
|
Park, Nochang
|
|
2014
|
54 |
8 |
p. 1562-1566
5 p.
|
artikel
|
| 7 |
Fault-tolerant TMR and DMR circuits with latchup protection switches
|
Petrović, V.
|
|
2014
|
54 |
8 |
p. 1613-1626
14 p.
|
artikel
|
| 8 |
HKMG CMOS technology qualification: The PBTI reliability challenge
|
Ioannou, Dimitris P.
|
|
2014
|
54 |
8 |
p. 1489-1499
11 p.
|
artikel
|
| 9 |
Impact strength of Sn–3.0Ag–0.5Cu solder bumps during isothermal aging
|
Wang, JianXin
|
|
2014
|
54 |
8 |
p. 1583-1591
9 p.
|
artikel
|
| 10 |
Inside front cover - Editorial board
|
|
|
2014
|
54 |
8 |
p. IFC-
1 p.
|
artikel
|
| 11 |
Insulated Cu wire free air ball characterization
|
Leong, HungYang
|
|
2014
|
54 |
8 |
p. 1567-1574
8 p.
|
artikel
|
| 12 |
Microstructure and elevated-temperature shear strength of Zn–4Al–3Mg–xSn high-temperature lead-free solders
|
Mahmudi, R.
|
|
2014
|
54 |
8 |
p. 1592-1597
6 p.
|
artikel
|
| 13 |
Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging
|
Hu, Xiaowu
|
|
2014
|
54 |
8 |
p. 1575-1582
8 p.
|
artikel
|
| 14 |
OFF-state degradation and correlated gate dielectric breakdown in high voltage drain extended transistors: A review
|
Varghese, D.
|
|
2014
|
54 |
8 |
p. 1477-1488
12 p.
|
artikel
|
| 15 |
Real-time soft-error rate measurements: A review
|
Autran, J.L.
|
|
2014
|
54 |
8 |
p. 1455-1476
22 p.
|
artikel
|
| 16 |
Recent fluid–structure interaction modeling challenges in IC encapsulation – A review
|
Khor, C.Y.
|
|
2014
|
54 |
8 |
p. 1511-1526
16 p.
|
artikel
|
| 17 |
Temperature dependent model for threshold voltage and subthreshold slope of strained-Si channel MOSFETs with a polysilicon gate
|
Biswas, Abhijit
|
|
2014
|
54 |
8 |
p. 1527-1533
7 p.
|
artikel
|
| 18 |
The coupling effects of temperature, electric current and stress on the adhesion and electrical properties of COG assembly
|
Gao, Hong
|
|
2014
|
54 |
8 |
p. 1603-1612
10 p.
|
artikel
|
| 19 |
Thermal analysis and design of a 75-W hybrid-type DC–DC converter for space applications
|
Kim, Namsu
|
|
2014
|
54 |
8 |
p. 1555-1561
7 p.
|
artikel
|
| 20 |
Thermal analysis of dual piezoelectric fans for cooling multi-LED packages
|
Sufian, S.F.
|
|
2014
|
54 |
8 |
p. 1534-1543
10 p.
|
artikel
|
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