no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
A comparative study of self-heating effect of nMOSFETs fabricated on SGOI and SGSOAN substrates
|
Liu, Hongxia |
|
2010 |
50 |
12 |
p. 1942-1950 9 p. |
article |
2 |
Analysis of electrically conductive silver ink on stretchable substrates under tensile load
|
Merilampi, Sari |
|
2010 |
50 |
12 |
p. 2001-2011 11 p. |
article |
3 |
Application of RPN analysis to parameter optimization of passive components
|
Chen, K.S. |
|
2010 |
50 |
12 |
p. 2012-2019 8 p. |
article |
4 |
Calendar
|
|
|
2010 |
50 |
12 |
p. I-II nvt p. |
article |
5 |
Characteristics degradation of the SiGe HBT under electromagnetic field stress
|
Alaeddine, A. |
|
2010 |
50 |
12 |
p. 1961-1966 6 p. |
article |
6 |
Charge trapping and reliability characteristics of ultra-thin HfYO x films on n-GaAs substrates
|
Das, P.S. |
|
2010 |
50 |
12 |
p. 1924-1930 7 p. |
article |
7 |
Comparison of electrical stress-induced charge carrier generation/trapping and related degradation of SiO2 and HfO2/SiO2 gate dielectric stacks
|
Samanta, Piyas |
|
2010 |
50 |
12 |
p. 1907-1914 8 p. |
article |
8 |
Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles
|
Shi, Yaowu |
|
2010 |
50 |
12 |
p. 2020-2025 6 p. |
article |
9 |
Detailed investigation of the effects of La and Al content on the electrical characteristics and reliability properties of La–Al–O gate dielectrics
|
Suzuki, Masamichi |
|
2010 |
50 |
12 |
p. 1920-1923 4 p. |
article |
10 |
Dynamic flow measurements of capillary underfill through a bump array in flip chip package
|
Lee, Seok Hwan |
|
2010 |
50 |
12 |
p. 2078-2083 6 p. |
article |
11 |
Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads
|
Fouzder, Tama |
|
2010 |
50 |
12 |
p. 2051-2058 8 p. |
article |
12 |
Electromechanical controlled phased array dumbbell EBG beam steerer
|
Fu, Jeffrey S. |
|
2010 |
50 |
12 |
p. 2093-2097 5 p. |
article |
13 |
Fabrication and enhanced field emission properties of novel silicon nanostructures
|
Ravipati, Srikanth |
|
2010 |
50 |
12 |
p. 1973-1976 4 p. |
article |
14 |
Feasible approach for processes integration of CMOS transistor gate/side-wall spacer patterning fabrication
|
Weng, Chun-Jen |
|
2010 |
50 |
12 |
p. 1951-1960 10 p. |
article |
15 |
Influence of substrate temperature to prepare (103) oriented AlN films
|
Lee, Maw-Shung |
|
2010 |
50 |
12 |
p. 1984-1987 4 p. |
article |
16 |
Inside front cover - Editorial board
|
|
|
2010 |
50 |
12 |
p. IFC- 1 p. |
article |
17 |
Investigation of the shift of hot spot in lateral diffused LDMOS under ESD conditions
|
Qian, Qinsong |
|
2010 |
50 |
12 |
p. 1935-1941 7 p. |
article |
18 |
Investigation on the abnormal resistive switching induced by ultraviolet light exposure based on HfOx film
|
Chang, Kow-Ming |
|
2010 |
50 |
12 |
p. 1931-1934 4 p. |
article |
19 |
Laser moiré interferometry for fatigue life prediction of lead-free solders
|
Tunga, Krishna |
|
2010 |
50 |
12 |
p. 2026-2036 11 p. |
article |
20 |
n-Al0.15Ga0.85N/p-6H–SiC heterostructure and based bipolar transistor
|
Alivov, Ya.I. |
|
2010 |
50 |
12 |
p. 2090-2092 3 p. |
article |
21 |
Numerical study of ductile failure morphology in solder joints under fast loading conditions
|
Shen, Y.-L. |
|
2010 |
50 |
12 |
p. 2059-2070 12 p. |
article |
22 |
Observation and mechanism explanation of the parasitic charge pumping current
|
Dai, Mingzhi |
|
2010 |
50 |
12 |
p. 1915-1919 5 p. |
article |
23 |
Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load
|
Chiu, Tz-Cheng |
|
2010 |
50 |
12 |
p. 2037-2050 14 p. |
article |
24 |
Reliability of aluminum-bearing ohmic contacts to SiC under high current density
|
Downey, Brian P. |
|
2010 |
50 |
12 |
p. 1967-1972 6 p. |
article |
25 |
Reliability study of Sn–Ag–Cu–Ce soldered joints in quad flat packages
|
Zhang, Liang |
|
2010 |
50 |
12 |
p. 2071-2077 7 p. |
article |
26 |
Study of thinned Si wafer warpage in 3D stacked wafers
|
Kim, Youngrae |
|
2010 |
50 |
12 |
p. 1988-1993 6 p. |
article |
27 |
Temperature stability of electro-thermally and piezoelectrically actuated silicon carbide MEMS resonators
|
Wood, G.S. |
|
2010 |
50 |
12 |
p. 1977-1983 7 p. |
article |
28 |
Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment
|
Karppinen, J.S. |
|
2010 |
50 |
12 |
p. 1994-2000 7 p. |
article |
29 |
1.8V–3GHz CMOS limiting amplifier with efficient frequency compensation
|
Garcia del Pozo, J.M. |
|
2010 |
50 |
12 |
p. 2084-2089 6 p. |
article |