| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A comparative study of self-heating effect of nMOSFETs fabricated on SGOI and SGSOAN substrates
|
Liu, Hongxia
|
|
2010
|
50 |
12 |
p. 1942-1950
9 p.
|
article
|
| 2 |
Analysis of electrically conductive silver ink on stretchable substrates under tensile load
|
Merilampi, Sari
|
|
2010
|
50 |
12 |
p. 2001-2011
11 p.
|
article
|
| 3 |
Application of RPN analysis to parameter optimization of passive components
|
Chen, K.S.
|
|
2010
|
50 |
12 |
p. 2012-2019
8 p.
|
article
|
| 4 |
Calendar
|
|
|
2010
|
50 |
12 |
p. I-II
nvt p.
|
article
|
| 5 |
Characteristics degradation of the SiGe HBT under electromagnetic field stress
|
Alaeddine, A.
|
|
2010
|
50 |
12 |
p. 1961-1966
6 p.
|
article
|
| 6 |
Charge trapping and reliability characteristics of ultra-thin HfYO x films on n-GaAs substrates
|
Das, P.S.
|
|
2010
|
50 |
12 |
p. 1924-1930
7 p.
|
article
|
| 7 |
Comparison of electrical stress-induced charge carrier generation/trapping and related degradation of SiO2 and HfO2/SiO2 gate dielectric stacks
|
Samanta, Piyas
|
|
2010
|
50 |
12 |
p. 1907-1914
8 p.
|
article
|
| 8 |
Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles
|
Shi, Yaowu
|
|
2010
|
50 |
12 |
p. 2020-2025
6 p.
|
article
|
| 9 |
Detailed investigation of the effects of La and Al content on the electrical characteristics and reliability properties of La–Al–O gate dielectrics
|
Suzuki, Masamichi
|
|
2010
|
50 |
12 |
p. 1920-1923
4 p.
|
article
|
| 10 |
Dynamic flow measurements of capillary underfill through a bump array in flip chip package
|
Lee, Seok Hwan
|
|
2010
|
50 |
12 |
p. 2078-2083
6 p.
|
article
|
| 11 |
Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads
|
Fouzder, Tama
|
|
2010
|
50 |
12 |
p. 2051-2058
8 p.
|
article
|
| 12 |
Electromechanical controlled phased array dumbbell EBG beam steerer
|
Fu, Jeffrey S.
|
|
2010
|
50 |
12 |
p. 2093-2097
5 p.
|
article
|
| 13 |
Fabrication and enhanced field emission properties of novel silicon nanostructures
|
Ravipati, Srikanth
|
|
2010
|
50 |
12 |
p. 1973-1976
4 p.
|
article
|
| 14 |
Feasible approach for processes integration of CMOS transistor gate/side-wall spacer patterning fabrication
|
Weng, Chun-Jen
|
|
2010
|
50 |
12 |
p. 1951-1960
10 p.
|
article
|
| 15 |
Influence of substrate temperature to prepare (103) oriented AlN films
|
Lee, Maw-Shung
|
|
2010
|
50 |
12 |
p. 1984-1987
4 p.
|
article
|
| 16 |
Inside front cover - Editorial board
|
|
|
2010
|
50 |
12 |
p. IFC-
1 p.
|
article
|
| 17 |
Investigation of the shift of hot spot in lateral diffused LDMOS under ESD conditions
|
Qian, Qinsong
|
|
2010
|
50 |
12 |
p. 1935-1941
7 p.
|
article
|
| 18 |
Investigation on the abnormal resistive switching induced by ultraviolet light exposure based on HfOx film
|
Chang, Kow-Ming
|
|
2010
|
50 |
12 |
p. 1931-1934
4 p.
|
article
|
| 19 |
Laser moiré interferometry for fatigue life prediction of lead-free solders
|
Tunga, Krishna
|
|
2010
|
50 |
12 |
p. 2026-2036
11 p.
|
article
|
| 20 |
n-Al0.15Ga0.85N/p-6H–SiC heterostructure and based bipolar transistor
|
Alivov, Ya.I.
|
|
2010
|
50 |
12 |
p. 2090-2092
3 p.
|
article
|
| 21 |
Numerical study of ductile failure morphology in solder joints under fast loading conditions
|
Shen, Y.-L.
|
|
2010
|
50 |
12 |
p. 2059-2070
12 p.
|
article
|
| 22 |
Observation and mechanism explanation of the parasitic charge pumping current
|
Dai, Mingzhi
|
|
2010
|
50 |
12 |
p. 1915-1919
5 p.
|
article
|
| 23 |
Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load
|
Chiu, Tz-Cheng
|
|
2010
|
50 |
12 |
p. 2037-2050
14 p.
|
article
|
| 24 |
Reliability of aluminum-bearing ohmic contacts to SiC under high current density
|
Downey, Brian P.
|
|
2010
|
50 |
12 |
p. 1967-1972
6 p.
|
article
|
| 25 |
Reliability study of Sn–Ag–Cu–Ce soldered joints in quad flat packages
|
Zhang, Liang
|
|
2010
|
50 |
12 |
p. 2071-2077
7 p.
|
article
|
| 26 |
Study of thinned Si wafer warpage in 3D stacked wafers
|
Kim, Youngrae
|
|
2010
|
50 |
12 |
p. 1988-1993
6 p.
|
article
|
| 27 |
Temperature stability of electro-thermally and piezoelectrically actuated silicon carbide MEMS resonators
|
Wood, G.S.
|
|
2010
|
50 |
12 |
p. 1977-1983
7 p.
|
article
|
| 28 |
Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment
|
Karppinen, J.S.
|
|
2010
|
50 |
12 |
p. 1994-2000
7 p.
|
article
|
| 29 |
1.8V–3GHz CMOS limiting amplifier with efficient frequency compensation
|
Garcia del Pozo, J.M.
|
|
2010
|
50 |
12 |
p. 2084-2089
6 p.
|
article
|
Journal description