nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Advanced failure detection techniques in deep submicron CMOS integrated circuits
|
Rubio, Antonio |
|
1999 |
39 |
6-7 |
p. 909-918 10 p. |
artikel |
2 |
Ageing of laser crystallized and unhydrogenated polysilicon thin film transistors
|
Rahala, A. |
|
1999 |
39 |
6-7 |
p. 851-855 5 p. |
artikel |
3 |
A new AFM-based tool for testing dielectric quality and reliability on a nanometer scale
|
Olbrich, Alexander |
|
1999 |
39 |
6-7 |
p. 941-946 6 p. |
artikel |
4 |
A new bifunctional topography and current probe for scanning force microscope testing of integrated circuits
|
Bae, S. |
|
1999 |
39 |
6-7 |
p. 975-980 6 p. |
artikel |
5 |
A simpler method for life-testing laser diodes
|
Vanzi, M. |
|
1999 |
39 |
6-7 |
p. 1067-1071 5 p. |
artikel |
6 |
Assessment of worst case dielectric failure rate based on statistical samples with pure intrinsic failure distributions
|
Kerber, Martin |
|
1999 |
39 |
6-7 |
p. 755-758 4 p. |
artikel |
7 |
A stochastic approach to failure analysis in electromigration phenomena
|
Pennetta, C. |
|
1999 |
39 |
6-7 |
p. 857-862 6 p. |
artikel |
8 |
A universal reliability prediction model for SMD integrated circuits based on field failures
|
Kervarrec, G. |
|
1999 |
39 |
6-7 |
p. 765-771 7 p. |
artikel |
9 |
Author index
|
|
|
1999 |
39 |
6-7 |
p. I-II nvt p. |
artikel |
10 |
Cathodoluminescence from hot electron stressed InP HEMTs
|
Cova, Paolo |
|
1999 |
39 |
6-7 |
p. 1073-1078 6 p. |
artikel |
11 |
Contact resistance anomalies of vias before breakdown in accelerated current life tests
|
Gölz, W.L.F. |
|
1999 |
39 |
6-7 |
p. 1109-1112 4 p. |
artikel |
12 |
Cross-section analysis of electric devices by scanning capacitance microscope
|
Takasaki, Yoichi |
|
1999 |
39 |
6-7 |
p. 987-990 4 p. |
artikel |
13 |
Damage analysis in smart-power technology electrostatic discharge (ESD) protection devices
|
Pogany, D. |
|
1999 |
39 |
6-7 |
p. 1143-1148 6 p. |
artikel |
14 |
Defect localization using voltage contrast IDDQ testing
|
Perdu, Philippe |
|
1999 |
39 |
6-7 |
p. 1021-1026 6 p. |
artikel |
15 |
Degradation of AlGaAs GaAs power HFET's under on-state and off-state breakdown conditions
|
Dieci, D. |
|
1999 |
39 |
6-7 |
p. 1055-1060 6 p. |
artikel |
16 |
Depassivation of latent plasma damage in pMOS devices
|
Pantisano, L. |
|
1999 |
39 |
6-7 |
p. 827-832 6 p. |
artikel |
17 |
Device reliability and robust power converter development
|
Keskar, N. |
|
1999 |
39 |
6-7 |
p. 1121-1130 10 p. |
artikel |
18 |
2D physical simulation of degradation on transistors induced by FIB exposure of dielectric passivation
|
Benbrik, J. |
|
1999 |
39 |
6-7 |
p. 1027-1031 5 p. |
artikel |
19 |
Editorial
|
Labat, Nathalie |
|
1999 |
39 |
6-7 |
p. ix-x nvt p. |
artikel |
20 |
Effects of RF life-test on LF electrical parameters of GaAs power MESFETs
|
Saysset-Malbert, N. |
|
1999 |
39 |
6-7 |
p. 1061-1066 6 p. |
artikel |
21 |
Electron Beam Testing of FPGA Circuits
|
Desplats, R. |
|
1999 |
39 |
6-7 |
p. 963-968 6 p. |
artikel |
22 |
Enhancing IC repairs by combining laser direct-writing of Cu and FIB techniques
|
Remes, J. |
|
1999 |
39 |
6-7 |
p. 997-1001 5 p. |
artikel |
23 |
Evaluation of P-HEMT MMIC technology PH25 for space applications
|
Huguet, P. |
|
1999 |
39 |
6-7 |
p. 1049-1054 6 p. |
artikel |
24 |
Extended SPICE-like model accounting for layout effects on snapback phenomenon during ESD events
|
Salome, P. |
|
1999 |
39 |
6-7 |
p. 833-838 6 p. |
artikel |
25 |
Extraction and evolution of Fowler-Nordheim tunneling parameters of thin gate oxides under EEPROM-like dynamic degradation
|
Croci, S. |
|
1999 |
39 |
6-7 |
p. 879-884 6 p. |
artikel |
26 |
Failure analysis method by using different wavelengths lasers and its application
|
Ito, Seigo |
|
1999 |
39 |
6-7 |
p. 1015-1020 6 p. |
artikel |
27 |
Fault localisation in ICs by goniometric laser probing of thermal induced surface waves
|
Dilhaire, S. |
|
1999 |
39 |
6-7 |
p. 919-923 5 p. |
artikel |
28 |
FIB voltage contrast measurement for enhanced circuit repairs
|
Desplats, Romain |
|
1999 |
39 |
6-7 |
p. 1003-1008 6 p. |
artikel |
29 |
FLIP-chip and “backside” techniques
|
Barton, D.L. |
|
1999 |
39 |
6-7 |
p. 721-730 10 p. |
artikel |
30 |
1 f Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment
|
Vandamme, L.K.J. |
|
1999 |
39 |
6-7 |
p. 1089-1094 6 p. |
artikel |
31 |
Front- and backside investigations of thermal and electronic properties of semiconducting devices
|
Fiege, G.B.M. |
|
1999 |
39 |
6-7 |
p. 937-940 4 p. |
artikel |
32 |
Gold removal in failure analysis of GaAs-based laser diodes
|
Vanzi, M. |
|
1999 |
39 |
6-7 |
p. 1043-1047 5 p. |
artikel |
33 |
HBM and TLP ESD robustness in smart-power protection structures
|
Santirosia, S. |
|
1999 |
39 |
6-7 |
p. 839-844 6 p. |
artikel |
34 |
Hot-hole-induced interface states build-up on deep-submicrometer LDD nMOSFETs
|
Rafí, J.M. |
|
1999 |
39 |
6-7 |
p. 869-874 6 p. |
artikel |
35 |
Impact of FEM simulation on reliability improvement of packaging
|
Weide, Kirsten |
|
1999 |
39 |
6-7 |
p. 1079-1088 10 p. |
artikel |
36 |
Improved SRAM failure diagnosis for process monitoring via current signature analysis
|
Schienle, M. |
|
1999 |
39 |
6-7 |
p. 1009-1014 6 p. |
artikel |
37 |
Influence of pulsed DC current stress on electromigration results in AlCu interconnections; analysis of thermal and healing effects
|
Arnaud, L. |
|
1999 |
39 |
6-7 |
p. 773-784 12 p. |
artikel |
38 |
Junction parameters for silicon devices characterization
|
de la Bardonnie, M. |
|
1999 |
39 |
6-7 |
p. 751-753 3 p. |
artikel |
39 |
Laser beam backside probing of CMOS integrated circuits
|
Kasapi, Steven |
|
1999 |
39 |
6-7 |
p. 957-961 5 p. |
artikel |
40 |
Laser interferometric method for ns-time scale thermal mapping of Smart Power ESD protection devices during ESD stress
|
Fürböck, C. |
|
1999 |
39 |
6-7 |
p. 925-930 6 p. |
artikel |
41 |
Leakage current variation during two different modes of electrical stressing in undoped hydrogenated n-channel polysilicon thin film transistors (TFTs)
|
Farmakis, F.V. |
|
1999 |
39 |
6-7 |
p. 885-889 5 p. |
artikel |
42 |
Lifetime extrapolation for IGBT modules under realistic operation conditions
|
Ciappa, M. |
|
1999 |
39 |
6-7 |
p. 1131-1136 6 p. |
artikel |
43 |
Localization of defects in die-attach assembly by continuous wavelet transform using scanning acoustic microscopy
|
Bechou, L. |
|
1999 |
39 |
6-7 |
p. 1095-1101 7 p. |
artikel |
44 |
Long term reliability testing of HV-IGBT modules in worst case traction operation
|
Fratelli, L. |
|
1999 |
39 |
6-7 |
p. 1137-1142 6 p. |
artikel |
45 |
Mercury-probe characterisation of soft breakdown: effect of oxide thickness and measurement set-up
|
Cacciato, A. |
|
1999 |
39 |
6-7 |
p. 903-907 5 p. |
artikel |
46 |
Model for the oxide thickness dependence of SILC generation based on anode hole injection process
|
Jahan, C. |
|
1999 |
39 |
6-7 |
p. 791-795 5 p. |
artikel |
47 |
Model-independent determination of the degradation dynamics of thin SiO2 films
|
Rodríguez, R. |
|
1999 |
39 |
6-7 |
p. 891-895 5 p. |
artikel |
48 |
Modelling hot-carrier degradation of LDD NMOSFETs by using a high-resolution measurement technique
|
Dreesen, R. |
|
1999 |
39 |
6-7 |
p. 785-790 6 p. |
artikel |
49 |
Modelling of the temperature and electric field dependence of substrate/gate current SILC with an elastic resonant trap assisted tunnelling mechanism
|
iess, P. |
|
1999 |
39 |
6-7 |
p. 803-807 5 p. |
artikel |
50 |
New latchup mechanism in complementary bipolar power ICs triggered by backside die attach Glue
|
van der Pol, J.A. |
|
1999 |
39 |
6-7 |
p. 863-868 6 p. |
artikel |
51 |
New rapid method for lifetime determination of gate oxide validated with bipolar/CMOS/DMOS technology
|
Gagnard, X. |
|
1999 |
39 |
6-7 |
p. 759-763 5 p. |
artikel |
52 |
New tools for yield improvement in integrated circuit manufacturing: can they be applied to reliability?
|
McDonald, Chris J |
|
1999 |
39 |
6-7 |
p. 731-739 9 p. |
artikel |
53 |
Optical method for the measurement of the thermomechanical behaviour of electronic devices
|
Dilhaire, S. |
|
1999 |
39 |
6-7 |
p. 981-985 5 p. |
artikel |
54 |
Physical limits and lifetime limitations of semiconductor devices at high temperatures
|
Wondrak, W. |
|
1999 |
39 |
6-7 |
p. 1113-1120 8 p. |
artikel |
55 |
Physics of degradation in GaAs-based heterojunction bipolar transistors
|
Henderson, T. |
|
1999 |
39 |
6-7 |
p. 1033-1042 10 p. |
artikel |
56 |
Power cycling on press-pack IGBTs: measurements and thermomechanical simulation
|
Cova, Paolo |
|
1999 |
39 |
6-7 |
p. 1165-1170 6 p. |
artikel |
57 |
Quality and mechanical reliability assessment of wafer-bonded micromechanical components
|
Petzold, M. |
|
1999 |
39 |
6-7 |
p. 1103-1108 6 p. |
artikel |
58 |
Quantitative high frequency-electric force microscope testing of monolithic microwave integrated circuits at 20 GHz
|
Wittpahl, V. |
|
1999 |
39 |
6-7 |
p. 951-956 6 p. |
artikel |
59 |
Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules
|
Hamidi, A. |
|
1999 |
39 |
6-7 |
p. 1153-1158 6 p. |
artikel |
60 |
Reliability improvement of EEPROM by using WSi2 polycide gate
|
Ogier-Monnier, K. |
|
1999 |
39 |
6-7 |
p. 897-901 5 p. |
artikel |
61 |
Reliability of AlN substrates and their solder joints in IGBT power modules
|
Mitic, G. |
|
1999 |
39 |
6-7 |
p. 1159-1164 6 p. |
artikel |
62 |
Reliability versus yield and die location in advanced VLSI
|
Riordan, W.C. |
|
1999 |
39 |
6-7 |
p. 741-749 9 p. |
artikel |
63 |
Study of stress induced leakage current by using high resolution measurements
|
De Salvo, B. |
|
1999 |
39 |
6-7 |
p. 797-802 6 p. |
artikel |
64 |
Sub-surface analyses of defects in integrated devices by scanning probe acoustic microscopy
|
Cramer, R.M. |
|
1999 |
39 |
6-7 |
p. 947-950 4 p. |
artikel |
65 |
Temperature acceleration of breakdown and quasi-breakdown phenomena in ultra-thin oxides
|
Bruyère, S. |
|
1999 |
39 |
6-7 |
p. 815-820 6 p. |
artikel |
66 |
Temperature dependence of hot carrier induced MOSFET degradation at low gate bias
|
Hong, Sung H. |
|
1999 |
39 |
6-7 |
p. 809-814 6 p. |
artikel |
67 |
Thermal characterization of power devices by scanning thermal microscopy techniques
|
Fiege, G.B.M. |
|
1999 |
39 |
6-7 |
p. 1149-1152 4 p. |
artikel |
68 |
TIVA and SEI developments for enhanced front and backside interconnection failure analysis
|
Cole Jr., E.I. |
|
1999 |
39 |
6-7 |
p. 991-996 6 p. |
artikel |
69 |
Transient induced latch-up triggered by very fast pulses
|
Bonfert, D. |
|
1999 |
39 |
6-7 |
p. 875-878 4 p. |
artikel |
70 |
Trapping mechanisms in negative bias temperature stressed p-MOSFETs
|
Schlünder, Christian |
|
1999 |
39 |
6-7 |
p. 821-826 6 p. |
artikel |
71 |
Validation of radiation hardened designs by pulsed laser testing and SPICE analysis
|
Pouget, V. |
|
1999 |
39 |
6-7 |
p. 931-935 5 p. |
artikel |
72 |
Voltage contrast measurements on sub-micrometer structures with an electric force microscope based test system
|
Behnke, U. |
|
1999 |
39 |
6-7 |
p. 969-974 6 p. |
artikel |
73 |
Wafer mapping of ESD performance
|
Reiner, Joachim C. |
|
1999 |
39 |
6-7 |
p. 845-850 6 p. |
artikel |