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Journal description
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Details for article 30 of 73 found articles
| Title: |
1 f Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment |
| Author: |
Vandamme, L.K.J. Perichaud, M.G. Noguera, E. Danto, Y. Behner, U. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 39 (1999) nr. 6-7 pages 6 p. |
| Year: |
1999 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 30 of 73 found articles
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