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Journal description
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Details for article 17 of 33 found articles
| Title: |
Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA) |
| Author: |
Manoharan, Subramani Patel, Chandradip Dunford, Steven Beshears, John McCluskey, Patrick |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 99 (2019) nr. C pages 137-151 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 33 found articles
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