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Journal description
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Details for article 18 of 33 found articles
| Title: |
Mechanism to improve the reliability of copper wire bonding with palladium-coating of the wire |
| Author: |
Qin, Wentao Anderson, Tom Chang, George |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 99 (2019) nr. C pages 239-244 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 18 of 33 found articles
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