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Journal description
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Details for article 114 of 136 found articles
| Title: |
Reliability aspects of copper metallization and interconnect technology for power devices |
| Author: |
Hille, Frank Roth, Roman Schäffer, Carsten Schulze, Holger Heuck, Nicolas Bolowski, Daniel Guth, Karsten Ciliox, Alexander Rott, Karina Umbach, Frank Kerber, Martin |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 64 (2016) nr. C pages 10 p. |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 114 of 136 found articles
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