| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A metallurgical assessment of SnPbAg solder for GaAs power devices
|
Parsey, J. M.
|
|
1999
|
51 |
3 |
p. 28-31
|
article
|
| 2 |
Characterizing and monitoring thin-film processes with spectroscopic ellipsometry
|
Srivatsa, Arun R.
|
|
1999
|
51 |
3 |
p. 34-36
|
article
|
| 3 |
Consultants directory classified
|
|
|
1999
|
51 |
3 |
p. 44-47
|
article
|
| 4 |
Educators lead increases in 1998 U.S. Engineering salaries
|
Beazley, Tammy M.
|
|
1999
|
51 |
3 |
p. 10-11
|
article
|
| 5 |
In the final analysis
|
|
|
1999
|
51 |
3 |
p. 1
|
article
|
| 6 |
Materials challenges in interconnection: Trade-offs for rapid deployment
|
Frutschy, Kris
|
|
1999
|
51 |
3 |
p. 19-21
|
article
|
| 7 |
Materials issues in area-array microelectronic packaging
|
Frear, D. R.
|
|
1999
|
51 |
3 |
p. 22-27
|
article
|
| 8 |
Meetings calendar
|
|
|
1999
|
51 |
3 |
p. 41-43
|
article
|
| 9 |
Metallurgical issues in microelectronics
|
Parsey, John M.
|
|
1999
|
51 |
3 |
p. 14
|
article
|
| 10 |
Metallurgical techniques for more reliable integrated circuits
|
Kang, S. H.
|
|
1999
|
51 |
3 |
p. 16-18
|
article
|
| 11 |
News & update
|
|
|
1999
|
51 |
3 |
p. 2-8
|
article
|
| 12 |
NIST web site provides program information and much more
|
Beazley, Tammy M.
|
|
1999
|
51 |
3 |
p. 48
|
article
|
| 13 |
Nondestructive evaluation techniques in semiconductor wafer fabrication
|
Srivatsa, Arun R.
|
|
1999
|
51 |
3 |
p. 33
|
article
|
| 14 |
The impact of metals on society part VI: The new world
|
Smith, R. L.
|
|
1999
|
51 |
3 |
p. 12-13
|
article
|
| 15 |
The impact of metals on society part VI: The new world
|
Smith, R. L.
|
|
|
51 |
3 |
p. 12-13
|
article
|
| 16 |
TMS foundation news
|
|
|
1999
|
51 |
3 |
p. 15
|
article
|
| 17 |
Using CD-SEM metrology in the manufacture of semiconductors
|
McIntosh, John
|
|
1999
|
51 |
3 |
p. 38-39
|
article
|
Journal description