| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Application of electroplating in MEMS-micromachining exemplified by a microrelay
|
Becker, M.
|
|
2001
|
7 |
4 |
p. 196-202
|
artikel
|
| 2 |
Dicing challenges in microelectronics and micro electro-mechanical systems (MEMS)
|
Gatzen, H. H.
|
|
2001
|
7 |
4 |
p. 151-154
|
artikel
|
| 3 |
Fatigue of directly wafer-bonded silicon under static and cyclic loading
|
Bagdahn, J.
|
|
2001
|
7 |
4 |
p. 175-182
|
artikel
|
| 4 |
Highly parallel mass fabrication and assembly of microdevices
|
Ehrfeld, W.
|
|
2001
|
7 |
4 |
p. 145-150
|
artikel
|
| 5 |
Integration of micro-mechatronics in automotive applications
|
Ansorge, F.
|
|
2001
|
7 |
4 |
p. 188-190
|
artikel
|
| 6 |
Internal stresses and lifetime evaluation of PECVD isolating layers
|
Dommann, A.
|
|
2001
|
7 |
4 |
p. 161-164
|
artikel
|
| 7 |
Micro materials modeling in MINIMOS-NT
|
Palankovski, V.
|
|
2001
|
7 |
4 |
p. 183-187
|
artikel
|
| 8 |
Micromechanical three-axial tactile force sensor for micromaterial characterisation
|
Bütefisch, S.
|
|
2001
|
7 |
4 |
p. 171-174
|
artikel
|
| 9 |
Micro-metalforming with silicon dies
|
Böhm, J.
|
|
2001
|
7 |
4 |
p. 191-195
|
artikel
|
| 10 |
Plastic reshaping of silicon microstructures: process, characterization and application
|
Gärtner, E.
|
|
2001
|
7 |
4 |
p. 155-160
|
artikel
|
| 11 |
Preface
|
,
|
|
2001
|
7 |
4 |
p. 137
|
artikel
|
| 12 |
Sensors and smart electronics in harsh environment applications
|
Fahrner, W. R.
|
|
2001
|
7 |
4 |
p. 138-144
|
artikel
|
| 13 |
Shape memory microactuators
|
Büttgenbach, S.
|
|
2001
|
7 |
4 |
p. 165-170
|
artikel
|
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