| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A flip-chip LIGA assembly technique via electroplating
|
Pan, L.-W.
|
|
2001
|
7 |
1 |
p. 40-43
|
artikel
|
| 2 |
Assembly of hybrid integrated micro-optical modules using passive alignment with LIGA mounting elements and adhesive bonding techniques
|
Gerlach, A.
|
|
2001
|
7 |
1 |
p. 27-31
|
artikel
|
| 3 |
Consumption-related development in microelectroforming
|
Issaev, N. N.
|
|
2001
|
7 |
1 |
p. 44-46
|
artikel
|
| 4 |
Equations of exposure time and X-ray mask absorber thickness in the LIGA process
|
Gil, K. H.
|
|
2001
|
7 |
1 |
p. 1-5
|
artikel
|
| 5 |
Fabrication method of spacers with high aspect ratio – Used in a field emission display (FED)
|
Park, S.
|
|
2001
|
7 |
1 |
p. 32-35
|
artikel
|
| 6 |
Gas permeability of adhesives and their application for hermetic packaging of microcomponents
|
Gerlach, A.
|
|
2001
|
7 |
1 |
p. 17-22
|
artikel
|
| 7 |
Laser bending of etched silicon microstructures
|
Gärtner, E.
|
|
2001
|
7 |
1 |
p. 23-26
|
artikel
|
| 8 |
Microcomposite electroforming for LIGA technology
|
Chou, M.-C.
|
|
2001
|
7 |
1 |
p. 36-39
|
artikel
|
| 9 |
Non-adhesive direct bonding of tiny parts by means of ultraprecision trapezoid microgrooves
|
Takeuchi, Y.
|
|
2001
|
7 |
1 |
p. 6-10
|
artikel
|
| 10 |
SU-8 as resist material for deep X-ray lithography
|
Cremers, C.
|
|
2001
|
7 |
1 |
p. 11-16
|
artikel
|
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