| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A flexible polyimide cable for implantable neural probe arrays
|
Cheng, Ming-Yuan
|
|
2012
|
19 |
8 |
p. 1111-1118
|
artikel
|
| 2 |
A MEMS sandwich differential capacitive silicon-on-insulator accelerometer
|
Zhang, Yangxi
|
|
2013
|
19 |
8 |
p. 1249-1254
|
artikel
|
| 3 |
Analytical modeling and simulation of a 2-DOF drive and 1-DOF sense gyro-accelerometer
|
Verma, Payal
|
|
2013
|
19 |
8 |
p. 1239-1248
|
artikel
|
| 4 |
Anti-smudge screening apparatus for electronic touch screens
|
Bhushan, Bharat
|
|
2013
|
19 |
8 |
p. 1261-1263
|
artikel
|
| 5 |
Challenges in fabrication and testing of piezoelectric MEMS with a particular focus on energy harvesters
|
Rezaei, Mehdi
|
|
2012
|
19 |
8 |
p. 1195-1219
|
artikel
|
| 6 |
Continuously tunable terahertz metamaterial employing a thermal actuator
|
Li, Xiuhan
|
|
2012
|
19 |
8 |
p. 1145-1151
|
artikel
|
| 7 |
Design and modeling of a new robust multi-mass coupled-resonator family with dynamic motion amplification
|
Erismis, M. A.
|
|
2012
|
19 |
8 |
p. 1105-1110
|
artikel
|
| 8 |
Design and simulation of a high-performance Z-axis SOI-MEMS accelerometer
|
Sharaf, Abdelhameed
|
|
2012
|
19 |
8 |
p. 1153-1163
|
artikel
|
| 9 |
Development and discussion of asymmetric magnetic soft mode electromagnetic imprinting process technology
|
Weng, Yung-Chun
|
|
2012
|
19 |
8 |
p. 1177-1184
|
artikel
|
| 10 |
Effects of package on the performance of MEMS piezoresistive accelerometers
|
Li, Ping
|
|
2012
|
19 |
8 |
p. 1137-1144
|
artikel
|
| 11 |
Electrical performance analysis and characterization of two port piezoelectric resonators
|
Qiu, H. C.
|
|
2012
|
19 |
8 |
p. 1131-1136
|
artikel
|
| 12 |
Experimental research on resist filling behavior in microimprint lithography by using defocusing digital particle image velocimetry
|
Jun, Du
|
|
2012
|
19 |
8 |
p. 1229-1238
|
artikel
|
| 13 |
Fabrication of an hermetically packaged silicon resonator on LTCC substrate
|
Toan, Nguyen Van
|
|
2012
|
19 |
8 |
p. 1165-1175
|
artikel
|
| 14 |
Fabrication of microstructures on different materials by diode-pumped solid state laser writing for microfluidics applications
|
Chen, Qiuling
|
|
2012
|
19 |
8 |
p. 1185-1194
|
artikel
|
| 15 |
Hydrogen sensing characteristics of vertical type hydrogen sensors based on porous 3C-SiC with catalyst materials
|
Kim, K.-S.
|
|
2012
|
19 |
8 |
p. 1221-1227
|
artikel
|
| 16 |
Low temperature transient liquid phase bonding of Au/Sn and Cu/Sn electroplated material systems for MEMS wafer-level packaging
|
Marauska, S.
|
|
2012
|
19 |
8 |
p. 1119-1130
|
artikel
|
| 17 |
Surface acoustic wave based sensors employing ionic liquid for hydrogen sulfide gas detection
|
Murakawa, Yoshinobu
|
|
2013
|
19 |
8 |
p. 1255-1259
|
artikel
|
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