| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A high Q micromachined single crystal silicon bulk mode resonator with pre-etched cavity
|
Wu, Guoqiang
|
|
2011
|
18 |
1 |
p. 25-30
|
artikel
|
| 2 |
A lateral RF MEMS capacitive switch utilizing parylene as dielectric
|
He, Xunjun
|
|
2011
|
18 |
1 |
p. 77-85
|
artikel
|
| 3 |
Bi2Te3-Sb2Te3 on polymeric substrate for X-ray detectors based on the seebeck effect
|
Rocha, J. G.
|
|
2011
|
18 |
1 |
p. 1-8
|
artikel
|
| 4 |
Capacitive humidity sensors based on a newly designed interdigitated electrode structure
|
Kim, Ji-Hong
|
|
2011
|
18 |
1 |
p. 31-35
|
artikel
|
| 5 |
Design, fabrication and testing of a high performance silicon piezoresistive Z-axis accelerometer with proof mass-edge-aligned-flexures
|
Sankar, A. Ravi
|
|
2011
|
18 |
1 |
p. 9-23
|
artikel
|
| 6 |
Device level studies of adaptive optics sliding components in microprojectors
|
Hunt, James
|
|
2011
|
18 |
1 |
p. 137-148
|
artikel
|
| 7 |
Effects of electrophoresis and electroosmotic flow on ion enrichment in micro-nanofluidic preconcentrator
|
Wang, Jun-yao
|
|
2011
|
18 |
1 |
p. 97-102
|
artikel
|
| 8 |
Experimental study of the flow-structure interactions in an air- or helium-filled hard disk drive geometry
|
Kil, S. W.
|
|
2011
|
18 |
1 |
p. 43-56
|
artikel
|
| 9 |
Hollow metallic microneedles fabricated by combining bulk silicon micromachining and UV–LIGA technology
|
Yan, Xiao-Xiao
|
|
2011
|
18 |
1 |
p. 37-42
|
artikel
|
| 10 |
Laser micro-welding of aluminum and copper with and without tin foil alloy
|
Hailat, Mohammad M.
|
|
2011
|
18 |
1 |
p. 103-112
|
artikel
|
| 11 |
Numerical investigation on a laser based localised joining with a glass frit intermediate layer
|
Wu, Qiang
|
|
2011
|
18 |
1 |
p. 87-95
|
artikel
|
| 12 |
Numerical study of the flow-structure interactions in an air- or helium-filled simulated hard disk drive
|
Kil, Sae Woong
|
|
2011
|
18 |
1 |
p. 57-75
|
artikel
|
| 13 |
Study of residual stress-induced deformation of multilayer cantilever for maskless microplasma etching
|
Wen, Li
|
|
2011
|
18 |
1 |
p. 113-118
|
artikel
|
| 14 |
The design and micromachining of an electromagnetic MEMS flapping-wing micro air vehicle
|
Meng, Kun
|
|
2011
|
18 |
1 |
p. 127-136
|
artikel
|
| 15 |
Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiP
|
Tang, Jiajie
|
|
2011
|
18 |
1 |
p. 119-126
|
artikel
|
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