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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 15 of 15 found articles
| Title: |
Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiP |
| Author: |
Tang, Jiajie Ding, Xiaoyun Geng, Fei Sun, Xiaowei Luo, Le |
| Appeared in: |
Microsystem technologies |
| Paging: | Volume 18 (2011) nr. 1 pages 119-126 |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Springer-Verlag, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 15 found articles
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