| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Comparison of low-melting lead-free solders in tensile properties with SnPb eutectic solder
|
Ikuo Shohji
|
|
2004
|
15 |
4 |
p. 219-223
5 p.
|
artikel
|
| 2 |
Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder
|
Shohji, Ikuo
|
|
2004
|
15 |
4 |
p. 219-223
|
artikel
|
| 3 |
Effect of anisotropy of tin on thermomechanical behavior of solder joints
|
K. N. Subramanian
|
|
2004
|
15 |
4 |
p. 235-240
6 p.
|
artikel
|
| 4 |
Effect of anisotropy of tin on thermomechanical behavior of solder joints
|
Subramanian, K. N.
|
|
2004
|
15 |
4 |
p. 235-240
|
artikel
|
| 5 |
Evaluation of residual stress in BaTiO3-based Ni-MLCCs with X7R characteristics
|
Dong-Ho Park
|
|
2004
|
15 |
4 |
p. 253-259
7 p.
|
artikel
|
| 6 |
Evaluation of residual stress in BaTiO3-based Ni-MLCCs with X7R characteristics
|
Park, Dong-Ho
|
|
2004
|
15 |
4 |
p. 253-259
|
artikel
|
| 7 |
Ge nanostructures: average and local structure
|
A. V. Kolobov
|
|
2004
|
15 |
4 |
p. 195-203
9 p.
|
artikel
|
| 8 |
Ge nanostructures: average and local structure
|
Kolobov, A. V.
|
|
2004
|
15 |
4 |
p. 195-203
|
artikel
|
| 9 |
Interface structure and electrical properties of PtSi/Si1−xGex diodes based on silicon
|
Meicheng Li
|
|
2004
|
15 |
4 |
p. 247-251
5 p.
|
artikel
|
| 10 |
Interface structure and electrical properties of PtSi/Si1−xGex diodes based on silicon
|
Li, Meicheng
|
|
2004
|
15 |
4 |
p. 247-251
|
artikel
|
| 11 |
Simulated thermal cycling of surface components on FR4 printed wiring boards using standard tinlead solder
|
K. Pitt
|
|
2004
|
15 |
4 |
p. 261-264
4 p.
|
artikel
|
| 12 |
Simulated thermal cycling of surface components on FR4 printed wiring boards using standard tin–lead solder
|
Pitt, K.
|
|
2004
|
15 |
4 |
p. 261-264
|
artikel
|
| 13 |
Sintering condition and PTCR characteristics of porous (Ba,Sr)(Ti,Sb)O3
|
J.-G. Kim
|
|
2004
|
15 |
4 |
p. 241-245
5 p.
|
artikel
|
| 14 |
Sintering condition and PTCR characteristics of porous (Ba,Sr)(Ti,Sb)O3
|
Kim, J.-G.
|
|
2004
|
15 |
4 |
p. 241-245
|
artikel
|
| 15 |
Space-charge-limited current analysis in amorphous InSe thin films
|
K. Yilmaz
|
|
2004
|
15 |
4 |
p. 225-229
5 p.
|
artikel
|
| 16 |
Space-charge-limited current analysis in amorphous InSe thin films
|
Yilmaz, K.
|
|
2004
|
15 |
4 |
p. 225-229
|
artikel
|
| 17 |
Structural and electrical conductivity studies on (M,V)-TiO2 (MAl, Cr, Fe) rutile solid solutions at high temperature
|
M. A. Tena
|
|
2004
|
15 |
4 |
p. 265-270
6 p.
|
artikel
|
| 18 |
Structural and electrical conductivity studies on (M,V)-TiO2 (M=Al, Cr, Fe) rutile solid solutions at high temperature
|
Tena, M. A.
|
|
2004
|
15 |
4 |
p. 265-270
|
artikel
|
| 19 |
Structural, mechanical, hardness indentation measurements of Sn65−x Ag25Sb10Cux solder alloys rapidly solidified from melt at cooling rate 1.1×105 K s−1
|
R. M. Shalaby
|
|
2004
|
15 |
4 |
p. 205-209
5 p.
|
artikel
|
| 20 |
Structural, mechanical, hardness indentation measurements of Sn65−x Ag25Sb10Cux solder alloys rapidly solidified from melt at cooling rate 1.1×105 K s−1
|
Shalaby, R. M.
|
|
2004
|
15 |
4 |
p. 205-209
|
artikel
|
| 21 |
The effect of rapid solidification on the structure, decomposition behavior, electrical and mechanical properties of the SnCd binary alloys
|
Mustafa Kamal
|
|
2004
|
15 |
4 |
p. 211-217
7 p.
|
artikel
|
| 22 |
The effect of rapid solidification on the structure, decomposition behavior, electrical and mechanical properties of the Sn–Cd binary alloys
|
Kamal, Mustafa
|
|
2004
|
15 |
4 |
p. 211-217
|
artikel
|
| 23 |
Yttrium-substituted bismuth titanate (Bi4−xYxTi3O12) thin film for use in non-volatile memories
|
S. W. Kang
|
|
2004
|
15 |
4 |
p. 231-234
4 p.
|
artikel
|
| 24 |
Yttrium-substituted bismuth titanate (Bi4−xYxTi3O12) thin film for use in non-volatile memories
|
Kang, S. W.
|
|
2004
|
15 |
4 |
p. 231-234
|
artikel
|
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