| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
AC Conductivity and Diffuse Reflectance Studiesof Ag-TiO2 Nanoparticles
|
Abdul Gafoor, A.K.
|
|
2012
|
41 |
9 |
p. 2387-2392
|
artikel
|
| 2 |
Active Layer Thickness Effects on the On-State Currentand Pulse Measurement at Room Temperature on Deposited Zinc Oxide Thin-Film Transistors
|
Basu, Sarbani
|
|
2012
|
41 |
9 |
p. 2362-2368
|
artikel
|
| 3 |
An Analytical Approach to Determine the Pressure Distribution During Chemical Mechanical Polishing
|
Ludwig, Christian
|
|
2012
|
41 |
9 |
p. 2606-2612
|
artikel
|
| 4 |
An Investigation of Electrical Contacts for HigherManganese Silicide
|
Shi, Xinghua
|
|
2012
|
41 |
9 |
p. 2331-2337
|
artikel
|
| 5 |
Anodized Macroporous Silicon Anode for Integrationof Lithium-Ion Batteries on Chips
|
Sun, Xida
|
|
2012
|
41 |
9 |
p. 2369-2375
|
artikel
|
| 6 |
Creep–Fatigue Crack Growth Behavior of Pb-Containingand Pb-Free Solders at Room and Elevated Temperatures
|
Fakpan, Kittichai
|
|
2012
|
41 |
9 |
p. 2463-2469
|
artikel
|
| 7 |
Direct Electrosynthesis and Characterization of a New Soluble Polythiophene Derivative Containing Carboxyl Groups in Boron Trifluoride Diethyl Etherate
|
He, Yu
|
|
2012
|
41 |
9 |
p. 2411-2418
|
artikel
|
| 8 |
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication
|
Heryanto, A.
|
|
2012
|
41 |
9 |
p. 2533-2542
|
artikel
|
| 9 |
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints
|
Han, Y. D.
|
|
2012
|
41 |
9 |
p. 2478-2486
|
artikel
|
| 10 |
Effect of Prebonding Anneal on the Microstructure Evolution and Cu–Cu Diffusion Bonding Quality for Three-Dimensional Integration
|
Peng, L.
|
|
2012
|
41 |
9 |
p. 2567-2572
|
artikel
|
| 11 |
Effect of Target Density on Microstructural, Electrical,and Optical Properties of Indium Tin Oxide Thin Films
|
Zhu, Guisheng
|
|
2012
|
41 |
9 |
p. 2376-2379
|
artikel
|
| 12 |
Effect of the Surface Morphology of Seed and Mask Layers on InP Grown on Si by Epitaxial Lateral Overgrowth
|
Junesand, Carl
|
|
2012
|
41 |
9 |
p. 2345-2349
|
artikel
|
| 13 |
Effects of Au and Pd Additions on Joint Strength, Electrical Resistivity, and Ion-Migration Tolerance in Low-Temperature Sintering Bonding Using Ag2O Paste
|
Ito, Takeyasu
|
|
2012
|
41 |
9 |
p. 2573-2579
|
artikel
|
| 14 |
Electrical and Dielectric Properties of Exfoliated Graphite/Polyimide Composite Films with Low Percolation Threshold
|
Yu, Li
|
|
2012
|
41 |
9 |
p. 2439-2446
|
artikel
|
| 15 |
Electrical and Optical Investigations on Tungsten-Incorporated CdO Thin Films
|
Dakhel, A.A.
|
|
2012
|
41 |
9 |
p. 2405-2410
|
artikel
|
| 16 |
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
|
Chu, Ming-Hui
|
|
2012
|
41 |
9 |
p. 2502-2507
|
artikel
|
| 17 |
Energy Relaxation Rates in AlInN/AlN/GaN Heterostructures
|
Tiras, E.
|
|
2012
|
41 |
9 |
p. 2350-2361
|
artikel
|
| 18 |
Enhancement of the Bondability and Die-Shear Force of Chip–Flex Substrate Assemblies by Depositing a Nickel Layer on the Flex Substrate
|
Chuang, Cheng-Li
|
|
2012
|
41 |
9 |
p. 2621-2630
|
artikel
|
| 19 |
Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation
|
Han, Sungwon
|
|
2012
|
41 |
9 |
p. 2508-2518
|
artikel
|
| 20 |
Failure Causes of a Polymer Resettable CircuitProtection Device
|
Cheng, Shunfeng
|
|
2012
|
41 |
9 |
p. 2419-2430
|
artikel
|
| 21 |
Fracture Behavior of Sn-3.5Ag-0.7Cu and Pure Sn Solders as a Function of Applied Strain Rate
|
Yazzie, K.E.
|
|
2012
|
41 |
9 |
p. 2519-2526
|
artikel
|
| 22 |
Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints
|
Chen, Cai
|
|
2012
|
41 |
9 |
p. 2487-2494
|
artikel
|
| 23 |
High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Jointsfor Electronics Applications
|
Shnawah, Dhafer Abdulameer
|
|
2012
|
41 |
9 |
p. 2631-2658
|
artikel
|
| 24 |
HTS and PCT Reliability of Chips and Flex Substrates Assembled Using a Thermosonic Flip-Chip Bonding Process
|
Chuang, Cheng-Li
|
|
2012
|
41 |
9 |
p. 2588-2598
|
artikel
|
| 25 |
Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test
|
Li, Jue
|
|
2012
|
41 |
9 |
p. 2613-2620
|
artikel
|
| 26 |
Interfacial Reaction of Molten Sn on a Strained CuElectroplated Layer
|
Pan, Hsiao-An
|
|
2012
|
41 |
9 |
p. 2470-2477
|
artikel
|
| 27 |
Interfacial Reactions in SnxZn1−x(Liquid)/Ni(Solid)Couples at 873 K
|
Yuan, Yuan
|
|
2012
|
41 |
9 |
p. 2495-2501
|
artikel
|
| 28 |
Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion Bonding
|
Liu, H.
|
|
2012
|
41 |
9 |
p. 2453-2462
|
artikel
|
| 29 |
Measurement of Thermal Conductivity Using Steady-State Isothermal Conditions and Validation by Comparison with Thermoelectric Device Performance
|
Taylor, Patrick J.
|
|
2012
|
41 |
9 |
p. 2307-2312
|
artikel
|
| 30 |
Ohmic Curing of Printed Silver Conductive Traces
|
Roberson, D.A.
|
|
2012
|
41 |
9 |
p. 2553-2566
|
artikel
|
| 31 |
Performance of Isotropic and Anisotropic Heat Spreaders
|
Chung, D.D.L.
|
|
2012
|
41 |
9 |
p. 2580-2587
|
artikel
|
| 32 |
Phosphorus Doping Effect in a Zinc Oxide Channel Layer to Improve the Performance of Oxide Thin-Film Transistors
|
Han, Dong-Suk
|
|
2012
|
41 |
9 |
p. 2380-2386
|
artikel
|
| 33 |
Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature
|
Cui, Hui-wang
|
|
2012
|
41 |
9 |
p. 2599-2605
|
artikel
|
| 34 |
Preparation and Characterization of New Sr5−xLaxNb4−xTi1+xO17 Microwave Dielectric Ceramics
|
Iqbal, Yaseen
|
|
2012
|
41 |
9 |
p. 2393-2398
|
artikel
|
| 35 |
Preparation and Transport Properties of Bi2O2Se Single Crystals
|
Drasar, C.
|
|
2012
|
41 |
9 |
p. 2317-2321
|
artikel
|
| 36 |
Retraction Note: Single-Phase β-Zn4Sb3 Prepared by a Mechanical Grinding Method
|
Okamura, Chinatsu
|
|
2012
|
41 |
9 |
p. 2659
|
artikel
|
| 37 |
Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste
|
Wang, Tao
|
|
2012
|
41 |
9 |
p. 2543-2552
|
artikel
|
| 38 |
Size-Quantization Semimetal–Semiconductor Transitionin Bi0.98Sb0.02 Nanowires: Thermoelectric Properties
|
Nikolaeva, A.A.
|
|
2012
|
41 |
9 |
p. 2313-2316
|
artikel
|
| 39 |
Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications
|
Ho, Li-Ngee
|
|
2012
|
41 |
9 |
p. 2527-2532
|
artikel
|
| 40 |
Switching Phenomena of Amorphous Ga5Ge15Te80 Chalcogenide Thin Films for Phase-Change Memories
|
Sakr, G.B.
|
|
2012
|
41 |
9 |
p. 2399-2404
|
artikel
|
| 41 |
Synthesis, Characterization, and Electroluminescent Properties of Pyridinylene Vinylene-Modified Phenylene Vinylene Copolymers
|
Tang, Rupei
|
|
2012
|
41 |
9 |
p. 2447-2452
|
artikel
|
| 42 |
Thermal Conductivity of InAs/GaSb Type II Superlattice
|
Zhou, Chuanle
|
|
2012
|
41 |
9 |
p. 2322-2325
|
artikel
|
| 43 |
Thermoelectric and Magnetic Properties of Ca0.98RE0.02MnO3−δ (RE = Sm, Gd, and Dy)
|
Bhaskar, Ankam
|
|
2012
|
41 |
9 |
p. 2338-2344
|
artikel
|
| 44 |
Thermoelectric Figure of Merit Enhancement in Bi2Te3-Coated Bi Composites
|
Lan, T. W.
|
|
2012
|
41 |
9 |
p. 2326-2330
|
artikel
|
| 45 |
Thermoelectric Performance Enhancementof Poly(3,4-ethylenedioxythiophene):Poly(styrenesulfonate) Composite Films by Addition of Dimethyl Sulfoxide and Urea
|
Kong, Fangfang
|
|
2012
|
41 |
9 |
p. 2431-2438
|
artikel
|
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