| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles
|
Morisada, Y.
|
|
2010
|
39 |
8 |
p. 1283-1288
|
article
|
| 2 |
Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders
|
Ogura, Hiroshi
|
|
2010
|
39 |
8 |
p. 1233-1240
|
article
|
| 3 |
Catalyst-Free Direct Vapor-Phase Growth of Hexagonal ZnO Nanowires on α-Al2O3
|
Hullavarad, S. S.
|
|
2010
|
39 |
8 |
p. 1209-1217
|
article
|
| 4 |
Characterization by Internal Photoemission Spectroscopy of Single-Crystal CVD Diamond Schottky Barrier Diodes
|
Majdi, Saman
|
|
2010
|
39 |
8 |
p. 1203-1208
|
article
|
| 5 |
Comparative Study on the Properties of Galvanically Deposited Nano- and Microcrystalline Thin Films of PbSe
|
Mukherjee, Nillohit
|
|
2010
|
39 |
8 |
p. 1177-1185
|
article
|
| 6 |
Coupling Effect of the Interfacial Reaction in Co/Sn/Cu Diffusion Couples
|
Wang, Chao-hong
|
|
2010
|
39 |
8 |
p. 1303-1308
|
article
|
| 7 |
Critical Layer Thickness in Exponentially Graded Heteroepitaxial Layers
|
Sidoti, D.
|
|
2010
|
39 |
8 |
p. 1140-1145
|
article
|
| 8 |
Crystallization of Amorphous Si0.6Ge0.4 Nanoparticles Embedded in SiO2: Crystallinity Versus Compositional Stability
|
Rodríguez, A.
|
|
2010
|
39 |
8 |
p. 1194-1202
|
article
|
| 9 |
Crystallographically Faceted Void Formation in the Matrix of Lead-Free Solder Joints
|
Belyakov, S.
|
|
2010
|
39 |
8 |
p. 1295-1297
|
article
|
| 10 |
Crystallographic Properties of Ge/Si Heterojunctions Fabricated by Wet Wafer Bonding
|
Kanbe, Hiroshi
|
|
2010
|
39 |
8 |
p. 1248-1255
|
article
|
| 11 |
Dielectric and Electrical Conductivity Relaxation in 0.5Li2O-0.5Na2O-2B2O3 Glasses
|
Vaish, Rahul
|
|
2010
|
39 |
8 |
p. 1334-1342
|
article
|
| 12 |
Effective Permittivity Calculation of Composites with Interpenetrating Phases
|
Zeng, Yu
|
|
2010
|
39 |
8 |
p. 1351-1357
|
article
|
| 13 |
Effect of Ag Content on Solidification Cracking Susceptibility of Sn-Ag-Cu Solder Joints
|
Lu, Wei
|
|
2010
|
39 |
8 |
p. 1298-1302
|
article
|
| 14 |
Effects of Current Stressing on Formation and Evolution of Kirkendall Voids at Sn–3.5Ag/Cu Interface
|
Yu, C.
|
|
2010
|
39 |
8 |
p. 1309-1314
|
article
|
| 15 |
Electrical Conductivity of Graphene Composites with In and In-Ga Alloy
|
Sruti, A. Naga
|
|
2010
|
39 |
8 |
p. 1268-1276
|
article
|
| 16 |
Electron–Electron Interactions in Sb-Doped SnO2 Thin Films
|
Serin, Tülay
|
|
2010
|
39 |
8 |
p. 1152-1158
|
article
|
| 17 |
Field Emission from Silicon Implanted with Carbon and Nitrogen Followed by Electron Beam Annealing
|
Carder, D.A.
|
|
2010
|
39 |
8 |
p. 1262-1267
|
article
|
| 18 |
High-Temperature Thermoelectric Characterization of III–V Semiconductor Thin Films by Oxide Bonding
|
Bahk, Je-Hyeong
|
|
2010
|
39 |
8 |
p. 1125-1132
|
article
|
| 19 |
Improved Thermoelectric Performance and Mechanical Properties of Nanostructured Melt-Spun β-Zn4Sb3
|
Qi, Dekui
|
|
2010
|
39 |
8 |
p. 1159-1165
|
article
|
| 20 |
Improvement of High-Temperature Performance of Zn-Sn Solder Joint
|
Takahashi, Toshihide
|
|
2010
|
39 |
8 |
p. 1241-1247
|
article
|
| 21 |
Influence of Cadmium Composition on CH4–H2-Based Inductively Coupled Plasma Etching of Hg1−xCdxTe
|
Boulard, F.
|
|
2010
|
39 |
8 |
p. 1256-1261
|
article
|
| 22 |
Interface Formation and Electrical Transport in SnO2:Eu3+/GaAs Heterojunction Deposited by Sol–Gel Dip-Coating and Resistive Evaporation
|
Pineiz, Tatiane F.
|
|
2010
|
39 |
8 |
p. 1170-1176
|
article
|
| 23 |
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
|
Chang, C. C.
|
|
2010
|
39 |
8 |
p. 1289-1294
|
article
|
| 24 |
Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test
|
Nie, Lei
|
|
2010
|
39 |
8 |
p. 1218-1232
|
article
|
| 25 |
Nonvolatile Metal–Oxide–Semiconductor Capacitors with Ru-RuOx Composite Nanodots Embedded in Atomic-Layer-Deposited Al2O3 Films
|
Gou, Hong-Yan
|
|
2010
|
39 |
8 |
p. 1343-1350
|
article
|
| 26 |
Optical Study of Filled Tetrahedral Compounds Li3AlN2 and Li3GaN2
|
Dadsetani, M.
|
|
2010
|
39 |
8 |
p. 1186-1193
|
article
|
| 27 |
Reduced Temperature Coefficient of Capacitance (TCC) of Embedded Capacitor Films (ECFs) for Organic Substrates using SrTiO3 and Multifunctional Epoxy
|
Lee, Sangyong
|
|
2010
|
39 |
8 |
p. 1358-1363
|
article
|
| 28 |
Sources of Epitaxial Growth-Induced Stacking Faults in 4H-SiC
|
Feng, Gan
|
|
2010
|
39 |
8 |
p. 1166-1169
|
article
|
| 29 |
Structural Properties of AlN Grown on Sapphire at Plasma Self-Heating Conditions Using Reactive Magnetron Sputter Deposition
|
Seo, Hui-Chan
|
|
2010
|
39 |
8 |
p. 1146-1151
|
article
|
| 30 |
The Mechanism of Residual Stress Relief for Various Tin Grain Structures
|
Yu, Cheng-Fu
|
|
2010
|
39 |
8 |
p. 1315-1318
|
article
|
| 31 |
Thermodynamic Description of the Te-Tl Binary System Using the Associate Solution Model
|
Gierlotka, Wojciech
|
|
2010
|
39 |
8 |
p. 1319-1325
|
article
|
| 32 |
Thermoelectric Properties of Layer-Antiferromagnet CuCrS2
|
Tewari, Girish C.
|
|
2010
|
39 |
8 |
p. 1133-1139
|
article
|
| 33 |
Ti-O Direct-Current-Sintered Bodies and Their Use for Sputter Deposition of TiO Thin Films: Fabrication and Characterization
|
Tomozawa, Masanari
|
|
2010
|
39 |
8 |
p. 1364-1370
|
article
|
| 34 |
Ti-Rich Barrier Layers Self-Formed on Porous Low-k Layers Using Cu(1 at.% Ti) Alloy Films
|
Ito, Kazuhiro
|
|
2010
|
39 |
8 |
p. 1326-1333
|
article
|
| 35 |
Weakening of the Cu/Cu3Sn(100) Interface by Bi Impurities
|
Pang, X. Y.
|
|
2010
|
39 |
8 |
p. 1277-1282
|
article
|
Journal description