| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics
|
Wang, Weiqiang
|
|
2009
|
38 |
6 |
p. 815-827
|
article
|
| 2 |
Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Properties and Characterization
|
Rajarathinam, Venmathy
|
|
2009
|
38 |
6 |
p. 778-786
|
article
|
| 3 |
A Study of Deterministic Positioning of Carbon Nanotubes by Dielectrophoresis
|
Arun, A.
|
|
2009
|
38 |
6 |
p. 742-749
|
article
|
| 4 |
Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability
|
Song, Wan Ho
|
|
2009
|
38 |
6 |
p. 834-842
|
article
|
| 5 |
Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study
|
Zhou, Wei
|
|
2009
|
38 |
6 |
p. 866-872
|
article
|
| 6 |
Effect of Stand-Off Height on Microstructure and Tensile Strength of the Cu/Sn9Zn/Cu Solder Joint
|
Wu, Fengshun
|
|
2009
|
38 |
6 |
p. 860-865
|
article
|
| 7 |
Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes
|
Noh, Bo-In
|
|
2009
|
38 |
6 |
p. 902-907
|
article
|
| 8 |
Field Emission and Electric Discharge of Nanocrystalline Diamond Films
|
Huang, Bohr-Ran
|
|
2009
|
38 |
6 |
p. 750-755
|
article
|
| 9 |
Foreword
|
Capano, Mike
|
|
2009
|
38 |
6 |
p. 717
|
article
|
| 10 |
Geometrical Characteristics and Surface Polarity of Inclined Crystallographic Planes of the Wurtzite and Zincblende Structures
|
Masui, Hisashi
|
|
2009
|
38 |
6 |
p. 756-760
|
article
|
| 11 |
Growth and Characterization of Carbon Nanopearls on a Si Substrate by CVD Process
|
Houston, S.
|
|
2009
|
38 |
6 |
p. 737-741
|
article
|
| 12 |
Growth and Characterization of Zn-Incorporated Copper Oxide Films
|
Engin, M.
|
|
2009
|
38 |
6 |
p. 787-796
|
article
|
| 13 |
Growth of Graphene-Like Structures on an Oxidized SiC Surface
|
Lu, Weijie
|
|
2009
|
38 |
6 |
p. 731-736
|
article
|
| 14 |
High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies
|
Wong, E.H.
|
|
2009
|
38 |
6 |
p. 884-895
|
article
|
| 15 |
Impact of Ti Sputter Target Denitridation on the Crystallographic Orientation of Single Ti Layers and Ti/TiN/AlCu Layer Stacks on Different Oxides
|
Wolansky, D.
|
|
2009
|
38 |
6 |
p. 797-801
|
article
|
| 16 |
Improved Gettering Efficiency of Ni from Nickel-Mediated Crystallization Silicon Using Phosphorus-Doped Amorphous Silicon
|
Wang, Bau-Ming
|
|
2009
|
38 |
6 |
p. 767-771
|
article
|
| 17 |
Improved Ni Schottky Contacts on n-Type 4H-SiC Using Thermal Processing
|
Oder, T. N.
|
|
2009
|
38 |
6 |
p. 772-777
|
article
|
| 18 |
Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates
|
Kim, Seongjun
|
|
2009
|
38 |
6 |
p. 873-883
|
article
|
| 19 |
Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board
|
Lin, Chi-pu
|
|
2009
|
38 |
6 |
p. 908-914
|
article
|
| 20 |
Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment
|
Kim, Sun Sik
|
|
2009
|
38 |
6 |
p. 896-901
|
article
|
| 21 |
Microstructure Evolution and the Constitutive Relations of High-Temperature Solders
|
Schoeller, Harry
|
|
2009
|
38 |
6 |
p. 802-809
|
article
|
| 22 |
Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds
|
Yang, Ping-Feng
|
|
2009
|
38 |
6 |
p. 810-814
|
article
|
| 23 |
Phosphor-Concentration-Dependent Characteristics of White LEDs in Different Current Regulation Modes
|
You, Jiun Pyng
|
|
2009
|
38 |
6 |
p. 761-766
|
article
|
| 24 |
Temperature Dependence of Epitaxial Graphene Formation on SiC(0001)
|
Luxmi,
|
|
2008
|
38 |
6 |
p. 718-724
|
article
|
| 25 |
Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints
|
Zhang, Q. K.
|
|
2009
|
38 |
6 |
p. 852-859
|
article
|
| 26 |
Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C
|
Nousiainen, Olli
|
|
2009
|
38 |
6 |
p. 843-851
|
article
|
| 27 |
Thickness Estimation of Epitaxial Graphene on SiC Using Attenuation of Substrate Raman Intensity
|
Shivaraman, Shriram
|
|
2009
|
38 |
6 |
p. 725-730
|
article
|
| 28 |
Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders
|
Zhao, N.
|
|
2009
|
38 |
6 |
p. 828-833
|
article
|
Journal description