nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics
|
Wang, Weiqiang |
|
2009 |
38 |
6 |
p. 815-827 |
artikel |
2 |
Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Properties and Characterization
|
Rajarathinam, Venmathy |
|
2009 |
38 |
6 |
p. 778-786 |
artikel |
3 |
A Study of Deterministic Positioning of Carbon Nanotubes by Dielectrophoresis
|
Arun, A. |
|
2009 |
38 |
6 |
p. 742-749 |
artikel |
4 |
Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability
|
Song, Wan Ho |
|
2009 |
38 |
6 |
p. 834-842 |
artikel |
5 |
Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study
|
Zhou, Wei |
|
2009 |
38 |
6 |
p. 866-872 |
artikel |
6 |
Effect of Stand-Off Height on Microstructure and Tensile Strength of the Cu/Sn9Zn/Cu Solder Joint
|
Wu, Fengshun |
|
2009 |
38 |
6 |
p. 860-865 |
artikel |
7 |
Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes
|
Noh, Bo-In |
|
2009 |
38 |
6 |
p. 902-907 |
artikel |
8 |
Field Emission and Electric Discharge of Nanocrystalline Diamond Films
|
Huang, Bohr-Ran |
|
2009 |
38 |
6 |
p. 750-755 |
artikel |
9 |
Foreword
|
Capano, Mike |
|
2009 |
38 |
6 |
p. 717 |
artikel |
10 |
Geometrical Characteristics and Surface Polarity of Inclined Crystallographic Planes of the Wurtzite and Zincblende Structures
|
Masui, Hisashi |
|
2009 |
38 |
6 |
p. 756-760 |
artikel |
11 |
Growth and Characterization of Carbon Nanopearls on a Si Substrate by CVD Process
|
Houston, S. |
|
2009 |
38 |
6 |
p. 737-741 |
artikel |
12 |
Growth and Characterization of Zn-Incorporated Copper Oxide Films
|
Engin, M. |
|
2009 |
38 |
6 |
p. 787-796 |
artikel |
13 |
Growth of Graphene-Like Structures on an Oxidized SiC Surface
|
Lu, Weijie |
|
2009 |
38 |
6 |
p. 731-736 |
artikel |
14 |
High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies
|
Wong, E.H. |
|
2009 |
38 |
6 |
p. 884-895 |
artikel |
15 |
Impact of Ti Sputter Target Denitridation on the Crystallographic Orientation of Single Ti Layers and Ti/TiN/AlCu Layer Stacks on Different Oxides
|
Wolansky, D. |
|
2009 |
38 |
6 |
p. 797-801 |
artikel |
16 |
Improved Gettering Efficiency of Ni from Nickel-Mediated Crystallization Silicon Using Phosphorus-Doped Amorphous Silicon
|
Wang, Bau-Ming |
|
2009 |
38 |
6 |
p. 767-771 |
artikel |
17 |
Improved Ni Schottky Contacts on n-Type 4H-SiC Using Thermal Processing
|
Oder, T. N. |
|
2009 |
38 |
6 |
p. 772-777 |
artikel |
18 |
Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates
|
Kim, Seongjun |
|
2009 |
38 |
6 |
p. 873-883 |
artikel |
19 |
Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board
|
Lin, Chi-pu |
|
2009 |
38 |
6 |
p. 908-914 |
artikel |
20 |
Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment
|
Kim, Sun Sik |
|
2009 |
38 |
6 |
p. 896-901 |
artikel |
21 |
Microstructure Evolution and the Constitutive Relations of High-Temperature Solders
|
Schoeller, Harry |
|
2009 |
38 |
6 |
p. 802-809 |
artikel |
22 |
Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds
|
Yang, Ping-Feng |
|
2009 |
38 |
6 |
p. 810-814 |
artikel |
23 |
Phosphor-Concentration-Dependent Characteristics of White LEDs in Different Current Regulation Modes
|
You, Jiun Pyng |
|
2009 |
38 |
6 |
p. 761-766 |
artikel |
24 |
Temperature Dependence of Epitaxial Graphene Formation on SiC(0001)
|
Luxmi, |
|
2008 |
38 |
6 |
p. 718-724 |
artikel |
25 |
Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints
|
Zhang, Q. K. |
|
2009 |
38 |
6 |
p. 852-859 |
artikel |
26 |
Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C
|
Nousiainen, Olli |
|
2009 |
38 |
6 |
p. 843-851 |
artikel |
27 |
Thickness Estimation of Epitaxial Graphene on SiC Using Attenuation of Substrate Raman Intensity
|
Shivaraman, Shriram |
|
2009 |
38 |
6 |
p. 725-730 |
artikel |
28 |
Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders
|
Zhao, N. |
|
2009 |
38 |
6 |
p. 828-833 |
artikel |