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                             28 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics Wang, Weiqiang
2009
38 6 p. 815-827
artikel
2 Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Properties and Characterization Rajarathinam, Venmathy
2009
38 6 p. 778-786
artikel
3 A Study of Deterministic Positioning of Carbon Nanotubes by Dielectrophoresis Arun, A.
2009
38 6 p. 742-749
artikel
4 Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability Song, Wan Ho
2009
38 6 p. 834-842
artikel
5 Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study Zhou, Wei
2009
38 6 p. 866-872
artikel
6 Effect of Stand-Off Height on Microstructure and Tensile Strength of the Cu/Sn9Zn/Cu Solder Joint Wu, Fengshun
2009
38 6 p. 860-865
artikel
7 Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes Noh, Bo-In
2009
38 6 p. 902-907
artikel
8 Field Emission and Electric Discharge of Nanocrystalline Diamond Films Huang, Bohr-Ran
2009
38 6 p. 750-755
artikel
9 Foreword Capano, Mike
2009
38 6 p. 717
artikel
10 Geometrical Characteristics and Surface Polarity of Inclined Crystallographic Planes of the Wurtzite and Zincblende Structures Masui, Hisashi
2009
38 6 p. 756-760
artikel
11 Growth and Characterization of Carbon Nanopearls on a Si Substrate by CVD Process Houston, S.
2009
38 6 p. 737-741
artikel
12 Growth and Characterization of Zn-Incorporated Copper Oxide Films Engin, M.
2009
38 6 p. 787-796
artikel
13 Growth of Graphene-Like Structures on an Oxidized SiC Surface Lu, Weijie
2009
38 6 p. 731-736
artikel
14 High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies Wong, E.H.
2009
38 6 p. 884-895
artikel
15 Impact of Ti Sputter Target Denitridation on the Crystallographic Orientation of Single Ti Layers and Ti/TiN/AlCu Layer Stacks on Different Oxides Wolansky, D.
2009
38 6 p. 797-801
artikel
16 Improved Gettering Efficiency of Ni from Nickel-Mediated Crystallization Silicon Using Phosphorus-Doped Amorphous Silicon Wang, Bau-Ming
2009
38 6 p. 767-771
artikel
17 Improved Ni Schottky Contacts on n-Type 4H-SiC Using Thermal Processing Oder, T. N.
2009
38 6 p. 772-777
artikel
18 Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates Kim, Seongjun
2009
38 6 p. 873-883
artikel
19 Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board Lin, Chi-pu
2009
38 6 p. 908-914
artikel
20 Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment Kim, Sun Sik
2009
38 6 p. 896-901
artikel
21 Microstructure Evolution and the Constitutive Relations of High-Temperature Solders Schoeller, Harry
2009
38 6 p. 802-809
artikel
22 Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Yang, Ping-Feng
2009
38 6 p. 810-814
artikel
23 Phosphor-Concentration-Dependent Characteristics of White LEDs in Different Current Regulation Modes You, Jiun Pyng
2009
38 6 p. 761-766
artikel
24 Temperature Dependence of Epitaxial Graphene Formation on SiC(0001) Luxmi,
2008
38 6 p. 718-724
artikel
25 Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints Zhang, Q. K.
2009
38 6 p. 852-859
artikel
26 Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C Nousiainen, Olli
2009
38 6 p. 843-851
artikel
27 Thickness Estimation of Epitaxial Graphene on SiC Using Attenuation of Substrate Raman Intensity Shivaraman, Shriram
2009
38 6 p. 725-730
artikel
28 Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders Zhao, N.
2009
38 6 p. 828-833
artikel
                             28 gevonden resultaten
 
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