| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys
|
Hidaka, N.
|
|
2009
|
38 |
5 |
p. 670-677
|
artikel
|
| 2 |
Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na2SO4 Solutions
|
Jung, Ja-Young
|
|
2009
|
38 |
5 |
p. 691-699
|
artikel
|
| 3 |
Evolution of Luminescence from Doped Gallium Phosphide over 40 Years
|
Pyshkin, Sergei
|
|
2009
|
38 |
5 |
p. 640-646
|
artikel
|
| 4 |
High-Temperature Capacitor Materials Based on Modified BaTiO3
|
Yuan, Y.
|
|
2009
|
38 |
5 |
p. 706-710
|
artikel
|
| 5 |
In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal
|
Lum, I.
|
|
2009
|
38 |
5 |
p. 647-654
|
artikel
|
| 6 |
Interdiffusion and Growth of the Superconductor Nb3Sn in Nb/Cu(Sn) Diffusion Couples
|
Kumar, A.K.
|
|
2009
|
38 |
5 |
p. 700-705
|
artikel
|
| 7 |
Lead-Free Bumping Using an Alternating Electromagnetic Field
|
Xu, Hongbo
|
|
2009
|
38 |
5 |
p. 663-669
|
artikel
|
| 8 |
Low-Dimensional Waveguide Grating Fabrication in GaN with Use of SiCl4/Cl2/Ar-Based Inductively Coupled Plasma Dry Etching
|
Dylewicz, R.
|
|
2009
|
38 |
5 |
p. 635-639
|
artikel
|
| 9 |
Microwave Dielectric Properties of ZnO-2TiO2-Nb2O5 Ceramics with BaCu (B2O5) Addition
|
Zhou, Huanfu
|
|
2009
|
38 |
5 |
p. 711-716
|
artikel
|
| 10 |
Peltier Effect on Sn/Co Interfacial Reactions
|
Wang, Chao-hong
|
|
2009
|
38 |
5 |
p. 655-662
|
artikel
|
| 11 |
The Potential of the Perturbed Angular Correlation Technique in Characterizing Semiconductors
|
Dogra, Rakesh
|
|
2009
|
38 |
5 |
p. 623-634
|
artikel
|
| 12 |
Thermomechanical Stress and Strain in Solder Joints During Electromigration
|
Zhang, J.S.
|
|
2009
|
38 |
5 |
p. 678-684
|
artikel
|
| 13 |
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package
|
Jee, Y. K.
|
|
2009
|
38 |
5 |
p. 685-690
|
artikel
|
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