no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys
|
Hidaka, N. |
|
2009 |
38 |
5 |
p. 670-677 |
article |
2 |
Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na2SO4 Solutions
|
Jung, Ja-Young |
|
2009 |
38 |
5 |
p. 691-699 |
article |
3 |
Evolution of Luminescence from Doped Gallium Phosphide over 40 Years
|
Pyshkin, Sergei |
|
2009 |
38 |
5 |
p. 640-646 |
article |
4 |
High-Temperature Capacitor Materials Based on Modified BaTiO3
|
Yuan, Y. |
|
2009 |
38 |
5 |
p. 706-710 |
article |
5 |
In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal
|
Lum, I. |
|
2009 |
38 |
5 |
p. 647-654 |
article |
6 |
Interdiffusion and Growth of the Superconductor Nb3Sn in Nb/Cu(Sn) Diffusion Couples
|
Kumar, A.K. |
|
2009 |
38 |
5 |
p. 700-705 |
article |
7 |
Lead-Free Bumping Using an Alternating Electromagnetic Field
|
Xu, Hongbo |
|
2009 |
38 |
5 |
p. 663-669 |
article |
8 |
Low-Dimensional Waveguide Grating Fabrication in GaN with Use of SiCl4/Cl2/Ar-Based Inductively Coupled Plasma Dry Etching
|
Dylewicz, R. |
|
2009 |
38 |
5 |
p. 635-639 |
article |
9 |
Microwave Dielectric Properties of ZnO-2TiO2-Nb2O5 Ceramics with BaCu (B2O5) Addition
|
Zhou, Huanfu |
|
2009 |
38 |
5 |
p. 711-716 |
article |
10 |
Peltier Effect on Sn/Co Interfacial Reactions
|
Wang, Chao-hong |
|
2009 |
38 |
5 |
p. 655-662 |
article |
11 |
The Potential of the Perturbed Angular Correlation Technique in Characterizing Semiconductors
|
Dogra, Rakesh |
|
2009 |
38 |
5 |
p. 623-634 |
article |
12 |
Thermomechanical Stress and Strain in Solder Joints During Electromigration
|
Zhang, J.S. |
|
2009 |
38 |
5 |
p. 678-684 |
article |
13 |
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package
|
Jee, Y. K. |
|
2009 |
38 |
5 |
p. 685-690 |
article |