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                             13 results found
no title author magazine year volume issue page(s) type
1 Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys Hidaka, N.
2009
38 5 p. 670-677
article
2 Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na2SO4 Solutions Jung, Ja-Young
2009
38 5 p. 691-699
article
3 Evolution of Luminescence from Doped Gallium Phosphide over 40 Years Pyshkin, Sergei
2009
38 5 p. 640-646
article
4 High-Temperature Capacitor Materials Based on Modified BaTiO3 Yuan, Y.
2009
38 5 p. 706-710
article
5 In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal Lum, I.
2009
38 5 p. 647-654
article
6 Interdiffusion and Growth of the Superconductor Nb3Sn in Nb/Cu(Sn) Diffusion Couples Kumar, A.K.
2009
38 5 p. 700-705
article
7 Lead-Free Bumping Using an Alternating Electromagnetic Field Xu, Hongbo
2009
38 5 p. 663-669
article
8 Low-Dimensional Waveguide Grating Fabrication in GaN with Use of SiCl4/Cl2/Ar-Based Inductively Coupled Plasma Dry Etching Dylewicz, R.
2009
38 5 p. 635-639
article
9 Microwave Dielectric Properties of ZnO-2TiO2-Nb2O5 Ceramics with BaCu (B2O5) Addition Zhou, Huanfu
2009
38 5 p. 711-716
article
10 Peltier Effect on Sn/Co Interfacial Reactions Wang, Chao-hong
2009
38 5 p. 655-662
article
11 The Potential of the Perturbed Angular Correlation Technique in Characterizing Semiconductors Dogra, Rakesh
2009
38 5 p. 623-634
article
12 Thermomechanical Stress and Strain in Solder Joints During Electromigration Zhang, J.S.
2009
38 5 p. 678-684
article
13 Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package Jee, Y. K.
2009
38 5 p. 685-690
article
                             13 results found
 
 Koninklijke Bibliotheek - National Library of the Netherlands