| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Abnormal Failure Behavior of Sn-3.5Ag Solder Bumps Under Excessive Electric Current Stressing Conditions
|
Lee, Jang-Hee
|
|
2009
|
38 |
10 |
p. 2194-2200
|
artikel
|
| 2 |
A Numerical Simulation of Nanostructure Formation Utilizing Electromigration
|
Sasagawa, Kazuhiko
|
|
2009
|
38 |
10 |
p. 2201-2206
|
artikel
|
| 3 |
A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques
|
Sivasubramaniam, V.
|
|
2009
|
38 |
10 |
p. 2122-2131
|
artikel
|
| 4 |
Effect of Colloidal Silver on Optical Transmittance Characteristics of Bulk Cadmium Zinc Telluride Crystals
|
Raman, R.
|
|
2009
|
38 |
10 |
p. 2046-2051
|
artikel
|
| 5 |
Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions
|
Zhang, Ning
|
|
2009
|
38 |
10 |
p. 2132-2147
|
artikel
|
| 6 |
Experimental Investigation and Thermodynamic Assessment of Phase Equilibria in the Ag-Au-Sn System
|
Gao, F.
|
|
2009
|
38 |
10 |
p. 2096-2105
|
artikel
|
| 7 |
Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures
|
Wang, Pin J.
|
|
2009
|
38 |
10 |
p. 2106-2111
|
artikel
|
| 8 |
Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water
|
Chang, Hong
|
|
2009
|
38 |
10 |
p. 2170-2178
|
artikel
|
| 9 |
Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag Solder
|
Lee, Hwa-Teng
|
|
2009
|
38 |
10 |
p. 2148-2157
|
artikel
|
| 10 |
In Situ Optical Creep Observation of Joint-Scale Tin–Silver–Copper Solder Shear Samples
|
Herkommer, Dominik
|
|
2009
|
38 |
10 |
p. 2085-2095
|
artikel
|
| 11 |
Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions
|
Lee, Hwa-Teng
|
|
2009
|
38 |
10 |
p. 2112-2121
|
artikel
|
| 12 |
On the Mechanisms Governing Aluminum-Mediated Solid-Phase Epitaxy of Silicon
|
Civale, Yann
|
|
2009
|
38 |
10 |
p. 2052-2062
|
artikel
|
| 13 |
Passivation of Interfacial States for GaAs- and InGaAs/InP-Based Regrown Nanostructures
|
Rathi, M. K.
|
|
2009
|
38 |
10 |
p. 2023-2032
|
artikel
|
| 14 |
Rheological Behavior of Thermal Interface Pastes
|
Lin, Chuangang
|
|
2009
|
38 |
10 |
p. 2069-2084
|
artikel
|
| 15 |
Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints
|
Yin, L.M.
|
|
2009
|
38 |
10 |
p. 2179-2183
|
artikel
|
| 16 |
Study of DC and AC Electromigration Behavior in Eutectic Pb-Sn Solder Joints
|
Wu, W. H.
|
|
2009
|
38 |
10 |
p. 2184-2193
|
artikel
|
| 17 |
Thermal Stability of Ge2Sb2Te5 in Contact with Ti and TiN
|
Venugopal, Vijayaharan A.
|
|
2009
|
38 |
10 |
p. 2063-2068
|
artikel
|
| 18 |
Thermodynamic Assessment of the Au-Co-Sn Ternary System
|
Dong, H. Q.
|
|
2009
|
38 |
10 |
p. 2158-2169
|
artikel
|
| 19 |
Thermodynamic Descriptions for the Cd-Te, Pb-Te, Cd-Pb and Cd-Pb-Te Systems
|
Liu, Yajun
|
|
2009
|
38 |
10 |
p. 2033-2045
|
artikel
|
| 20 |
Water-Induced Degradation in (Bi1/2Na1/2)TiO3 Lead-Free Ceramics
|
Gu, Y. H.
|
|
2009
|
38 |
10 |
p. 2207-2210
|
artikel
|
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