| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag
|
Kim, Jung-Mo
|
|
2007
|
37 |
3 |
p. 324-330
|
artikel
|
| 2 |
Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders
|
Chen, T.
|
|
2007
|
37 |
3 |
p. 347-354
|
artikel
|
| 3 |
Effect of Bi on the Interfacial Reaction between Sn-3.7Ag-xBi Solders and Cu
|
He, M.
|
|
2007
|
37 |
3 |
p. 288-299
|
artikel
|
| 4 |
Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys
|
Pei, Min
|
|
2007
|
37 |
3 |
p. 331-338
|
artikel
|
| 5 |
Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder
|
Yao, Yao
|
|
2007
|
37 |
3 |
p. 339-346
|
artikel
|
| 6 |
Epitaxial Growth and Surface Roughness Control of Ferromagnetic Thin Films on Si by Sputter Deposition
|
Yang, Jianhua Joshua
|
|
2007
|
37 |
3 |
p. 355-360
|
artikel
|
| 7 |
Experimental Study of Au-Pt-Sn Phase Equilibria and Thermodynamic Assessment of the Au-Pt and Au-Pt-Sn Systems
|
Grolier, Vincent
|
|
2007
|
37 |
3 |
p. 264-278
|
artikel
|
| 8 |
Fabrication of Strained-Si/Strained-Ge Heterostructures on Insulator
|
Gomez, Leonardo
|
|
2007
|
37 |
3 |
p. 240-244
|
artikel
|
| 9 |
Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders
|
Takaku, Yoshikazu
|
|
2007
|
37 |
3 |
p. 314-323
|
artikel
|
| 10 |
Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints
|
He, Min
|
|
2007
|
37 |
3 |
p. 300-306
|
artikel
|
| 11 |
Silicidation of Ni(Yb) Film on Si(001)
|
Luo, Jia
|
|
2007
|
37 |
3 |
p. 245-248
|
artikel
|
| 12 |
Space Charge and Carrier Trapping Effects on the Transient Photocurrents of Organic Materials Using the Time-of-Flight Technique
|
Cusumano, P.
|
|
2007
|
37 |
3 |
p. 231-239
|
artikel
|
| 13 |
Stress-Induced Grain Boundary Migration in Polycrystalline Copper
|
Bloomfield, Max O.
|
|
2007
|
37 |
3 |
p. 249-263
|
artikel
|
| 14 |
The Effect of Hydrogen on the Fracture Properties of 0.8(Na1/2Bi1/2)TiO3-0.2(K1/2Bi1/2)TiO3 Ferroelectric Ceramics
|
Zhang, H.
|
|
2007
|
37 |
3 |
p. 368-372
|
artikel
|
| 15 |
Thermodynamic Assessment of Phase Equilibria in the Sn-Ag-Ni System with Key Experimental Verification
|
Gao, F.
|
|
2007
|
37 |
3 |
p. 279-287
|
artikel
|
| 16 |
Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability
|
Lin, Xiaoqin
|
|
2007
|
37 |
3 |
p. 307-313
|
artikel
|
| 17 |
Wet Etching Study of La0.67(Sr0.5Ca0.5)0.33MnO3 Films on Silicon Substrates
|
Kim, Joo-Hyung
|
|
2007
|
37 |
3 |
p. 361-367
|
artikel
|
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