| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates
|
Flanders, D. R.
|
|
1997
|
26 |
7 |
p. 883-887
|
artikel
|
| 2 |
Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders
|
Mavoori, H.
|
|
1997
|
26 |
7 |
p. 783-790
|
artikel
|
| 3 |
Effect of parasitics on electrochemical capacitance-voltage profiling of pseudomorphic high electron mobility transistor structures
|
Jogai, B.
|
|
1997
|
26 |
7 |
p. 863-867
|
artikel
|
| 4 |
Finite element modeling of thermal fatigue and damage of solder joints in a ceramic ball grid array package
|
Hong, Bor Zen
|
|
1997
|
26 |
7 |
p. 814-820
|
artikel
|
| 5 |
Foreword
|
Merchant, Harish D.
|
|
1997
|
26 |
7 |
p. 773
|
artikel
|
| 6 |
Hygrothermal effects upon stress relaxation in a polyimide film
|
Harper, Brian D.
|
|
1997
|
26 |
7 |
p. 798-804
|
artikel
|
| 7 |
Impression recovery of amorphous polymers
|
Yang, Fuqian
|
|
1997
|
26 |
7 |
p. 859-862
|
artikel
|
| 8 |
Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling
|
Zhmurkin, D. V.
|
|
1997
|
26 |
7 |
p. 791-797
|
artikel
|
| 9 |
Material properties of Pb1-xSnxSe epilayers on Si and their correlation with the performance of infrared photodiodes
|
Fach, A.
|
|
1997
|
26 |
7 |
p. 873-877
|
artikel
|
| 10 |
Micro-indentation relaxation measurements in polymer thin films
|
Shinozaki, D. M.
|
|
1997
|
26 |
7 |
p. 852-858
|
artikel
|
| 11 |
Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints
|
Hacke, P. L.
|
|
1997
|
26 |
7 |
p. 774-782
|
artikel
|
| 12 |
Microwave modulated photoluminescence in doped GaAs
|
Inglefield, C. E.
|
|
1997
|
26 |
7 |
p. 878-882
|
artikel
|
| 13 |
Strain relaxation in silicon ion molecular beam epitaxy on silicon (001) substrates during aging
|
Rozenak, P.
|
|
1997
|
26 |
7 |
p. 868-872
|
artikel
|
| 14 |
Stress relaxation and creep in an impression test
|
Li, J. C. M.
|
|
1997
|
26 |
7 |
p. 827-832
|
artikel
|
| 15 |
Stress relaxation and creep in an impression test
|
Li, J. C. M.
|
|
|
26 |
7 |
p. 827-832
|
artikel
|
| 16 |
Stress relaxation and creep of 12 to 35 μm copper foil
|
Merchant, H. D.
|
|
1997
|
26 |
7 |
p. 833-838
|
artikel
|
| 17 |
Stress relaxation in molding compounds
|
Kenner, Vernal H.
|
|
1997
|
26 |
7 |
p. 821-826
|
artikel
|
| 18 |
Tensile, creep, and ABI tests on sn5%sb solder for mechanical property evaluation
|
Murty, K. Linga
|
|
1997
|
26 |
7 |
p. 839-846
|
artikel
|
| 19 |
The short and long term properties of a liquid crystalline polymer at elevated temperatures: Characterization and modeling
|
Saigal, A.
|
|
1997
|
26 |
7 |
p. 847-851
|
artikel
|
| 20 |
Thickness dependent mechanical behavior of submicron aluminum films
|
Kang, Young-Seok
|
|
1997
|
26 |
7 |
p. 805-813
|
artikel
|
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