nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Acoustic emission initiated by penetrating ions
|
Adlien≐, D. |
|
1985 |
6 |
1-2 |
p. 435-438 4 p. |
artikel |
2 |
A high current ion implanter machine
|
Matsuda, K. |
|
1985 |
6 |
1-2 |
p. 35-38 4 p. |
artikel |
3 |
A high-energy, high-current ion implantation system
|
Rose, Peter H. |
|
1985 |
6 |
1-2 |
p. 27-34 8 p. |
artikel |
4 |
A high throughput metal ion implanter end station
|
Armini, A.J. |
|
1985 |
6 |
1-2 |
p. 214-218 5 p. |
artikel |
5 |
A history of commercial implantation
|
Rose, Peter H. |
|
1985 |
6 |
1-2 |
p. 1-8 8 p. |
artikel |
6 |
Air-enhanced contact cooling of wafers
|
Sieradzki, Manny |
|
1985 |
6 |
1-2 |
p. 237-242 6 p. |
artikel |
7 |
A new machine for film formation by ion and vapour deposition
|
Andoh, Y. |
|
1985 |
6 |
1-2 |
p. 111-115 5 p. |
artikel |
8 |
A new 2 MV single-ended ion accelerator for ion implantation
|
Cleff, B. |
|
1985 |
6 |
1-2 |
p. 46-50 5 p. |
artikel |
9 |
An ion source with plasma generator
|
Yabe, E. |
|
1985 |
6 |
1-2 |
p. 119-122 4 p. |
artikel |
10 |
A non-mass-analyzed solar cell ion implanter
|
Armini, A.J. |
|
1985 |
6 |
1-2 |
p. 94-99 6 p. |
artikel |
11 |
A reactive ion beam etching and coating system
|
Zhang, Yuchun |
|
1985 |
6 |
1-2 |
p. 447-451 5 p. |
artikel |
12 |
Argon ion implantation gettering of large area p-n junctions and schottky diodes
|
Lacquet, B.M. |
|
1985 |
6 |
1-2 |
p. 372-375 4 p. |
artikel |
13 |
A technique for optimizing the dose uniformity of a magnetic scanning high current implanter
|
Ehrlich, Charles |
|
1985 |
6 |
1-2 |
p. 228-236 9 p. |
artikel |
14 |
Automatic cassette to cassette radiant impulse processor
|
Sheets, Ronald E. |
|
1985 |
6 |
1-2 |
p. 219-223 5 p. |
artikel |
15 |
A versatile target chamber in an ion implanter for metallurgical research
|
Lazzari, G. |
|
1985 |
6 |
1-2 |
p. 210-213 4 p. |
artikel |
16 |
Characteristics of a liquid metal ion source
|
Zhou, F. |
|
1985 |
6 |
1-2 |
p. 143-145 3 p. |
artikel |
17 |
Computer automation of high current ion implanters
|
Woodard, Ollie |
|
1985 |
6 |
1-2 |
p. 146-153 8 p. |
artikel |
18 |
Computor control of maskless ion implanter with AuSiBe LM ion source for III–V compound semiconductors
|
Miyauchi, Eizo |
|
1985 |
6 |
1-2 |
p. 183-189 7 p. |
artikel |
19 |
Concept, operation and performance of the veeco VHC-120 high current ion implanter
|
Scaife, William |
|
1985 |
6 |
1-2 |
p. 39-45 7 p. |
artikel |
20 |
Current status of ion implantation equipment and techniques for semiconductor IC fabrication
|
Current, Michael I. |
|
1985 |
6 |
1-2 |
p. 9-15 7 p. |
artikel |
21 |
CV Uniformity measurements
|
Deming, R.O. |
|
1985 |
6 |
1-2 |
p. 349-356 8 p. |
artikel |
22 |
Design considerations of MeV implanters
|
Rathmell, Robert D. |
|
1985 |
6 |
1-2 |
p. 56-62 7 p. |
artikel |
23 |
Diagnostics in industrial equipment
|
Delforge, A. |
|
1985 |
6 |
1-2 |
p. 155-159 5 p. |
artikel |
24 |
Editorial Board
|
|
|
1985 |
6 |
1-2 |
p. ii- 1 p. |
artikel |
25 |
Effect of resist patterning on gate oxide integrity in source/drain implant
|
Tong, Rebecca |
|
1985 |
6 |
1-2 |
p. 376-381 6 p. |
artikel |
26 |
Electron beam annealing for phosphorous and arsenic implantation
|
Zheng, Lirong |
|
1985 |
6 |
1-2 |
p. 321-324 4 p. |
artikel |
27 |
Extraction of information on a continuous ion beam from beam-induced shot noise
|
Szajnowski, W.J. |
|
1985 |
6 |
1-2 |
p. 176-182 7 p. |
artikel |
28 |
Film deposition and buried layer formation by mass-analyzed ion beams
|
Yamada, I. |
|
1985 |
6 |
1-2 |
p. 439-446 8 p. |
artikel |
29 |
Formation of distant recombination centers in silicon by ion implantation
|
Giedrys, T. |
|
1985 |
6 |
1-2 |
p. 427-429 3 p. |
artikel |
30 |
High conductivity, shallow doping in silicon by ion implantation and furnace annealing
|
Wu, S. |
|
1985 |
6 |
1-2 |
p. 330-335 6 p. |
artikel |
31 |
High energy ion implantation
|
Ziegler, J.F. |
|
1985 |
6 |
1-2 |
p. 270-282 13 p. |
artikel |
32 |
High energy ion implantation for C-MOS isolation n-wells technology: Problems related to the use of multicharged phosphorous ions in an industrial context
|
Spinelli, P. |
|
1985 |
6 |
1-2 |
p. 283-286 4 p. |
artikel |
33 |
Hydrogen analysis as a function of depth for hydrogenous films and polymers by proton recoil detection
|
Ingram, D.C. |
|
1985 |
6 |
1-2 |
p. 430-434 5 p. |
artikel |
34 |
Implementation of an automatic setup for ion beam implanters
|
Splinter, P. |
|
1985 |
6 |
1-2 |
p. 160-169 10 p. |
artikel |
35 |
Improved facilities for ion beam surface analysis at the University of Surrey
|
Mynard, J.E. |
|
1985 |
6 |
1-2 |
p. 264-269 6 p. |
artikel |
36 |
Instrumentation for neutralization of wafer charging
|
Cheng, J.C. |
|
1985 |
6 |
1-2 |
p. 243-249 7 p. |
artikel |
37 |
International committee
|
|
|
1985 |
6 |
1-2 |
p. ix- 1 p. |
artikel |
38 |
Ion beam system for implanting industrial products of various shapes
|
Denholm, A.S. |
|
1985 |
6 |
1-2 |
p. 88-93 6 p. |
artikel |
39 |
Ion implantation electron flooding requirements from a user's perspective
|
Bakeman Jr, Paul E. |
|
1985 |
6 |
1-2 |
p. 399-404 6 p. |
artikel |
40 |
Ion implant round robin
|
Current, M.I. |
|
1985 |
6 |
1-2 |
p. 418-426 9 p. |
artikel |
41 |
Liquid metal ion sources for FIB microfabrication systems — recent advances
|
Prewett, P.D. |
|
1985 |
6 |
1-2 |
p. 135-142 8 p. |
artikel |
42 |
Manufacturing technology program to develop a production ion implantation facility for processing bearings and tools
|
Smidt, F.A. |
|
1985 |
6 |
1-2 |
p. 70-77 8 p. |
artikel |
43 |
MeV Si implantation in GaAs
|
Thompson, Phillip E. |
|
1985 |
6 |
1-2 |
p. 287-291 5 p. |
artikel |
44 |
Multiple-beam ion implantation setup for large scale treatment of semiconductors
|
Muller, J.C. |
|
1985 |
6 |
1-2 |
p. 394-398 5 p. |
artikel |
45 |
1 MV rotating-disc type high voltage generator for application to an implanter
|
Isoya, A. |
|
1985 |
6 |
1-2 |
p. 250-257 8 p. |
artikel |
46 |
Optical reflectometry of radiation damage in ion-implanted silicon
|
Swart, P.L. |
|
1985 |
6 |
1-2 |
p. 365-371 7 p. |
artikel |
47 |
Oxygen implanter for simox
|
Guerra, M. |
|
1985 |
6 |
1-2 |
p. 63-69 7 p. |
artikel |
48 |
Particle generation in medium current implanters
|
Weisenberger, Wesley H. |
|
1985 |
6 |
1-2 |
p. 190-195 6 p. |
artikel |
49 |
Particles and particle transport in ion implanters
|
Douglas-Hamilton, D.H. |
|
1985 |
6 |
1-2 |
p. 196-201 6 p. |
artikel |
50 |
Particulate performance of a wafer handler for serial process ion implantation
|
Pollock, J. |
|
1985 |
6 |
1-2 |
p. 202-209 8 p. |
artikel |
51 |
Performance characteristics of the extrion 160-10 ion implantation system
|
Liebert, Reuel |
|
1985 |
6 |
1-2 |
p. 16-26 11 p. |
artikel |
52 |
Planar channeling effects in Si(100)
|
Current, Michael I. |
|
1985 |
6 |
1-2 |
p. 336-348 13 p. |
artikel |
53 |
Preface
|
Brown, Bob |
|
1985 |
6 |
1-2 |
p. vii-viii nvt p. |
artikel |
54 |
Progress report on the 400 keV research implanter at the University of Surrey
|
Mynard, J.E. |
|
1985 |
6 |
1-2 |
p. 100-105 6 p. |
artikel |
55 |
Rapid annealing using the water-wall arc lamp
|
Gelpey, Jeffrey C. |
|
1985 |
6 |
1-2 |
p. 316-320 5 p. |
artikel |
56 |
Rapid thermal processing — where has it been? Where is it going?
|
Russo, Carl |
|
1985 |
6 |
1-2 |
p. 298-306 9 p. |
artikel |
57 |
Repetitively pulsed metal ion beams for ion implantation
|
Adler, R.J. |
|
1985 |
6 |
1-2 |
p. 123-128 6 p. |
artikel |
58 |
RIKEN 200 KV high current implanter for metal surface modification
|
Iwaki, Masaya |
|
1985 |
6 |
1-2 |
p. 51-55 5 p. |
artikel |
59 |
Sb implantation for bipolar buried layers using SbF5 in a cold-cathode implantation system
|
Oleszek, G.M. |
|
1985 |
6 |
1-2 |
p. 389-393 5 p. |
artikel |
60 |
SECS communication for ion implanters
|
Parisi, N. |
|
1985 |
6 |
1-2 |
p. 170-175 6 p. |
artikel |
61 |
Sheet resistivity of silicon wafers implanted with a high current machine
|
Steeples, K. |
|
1985 |
6 |
1-2 |
p. 412-417 6 p. |
artikel |
62 |
Silicon on insulator structures formed by the implantation of high doses of reactive ions
|
Hemment, P.L.F. |
|
1985 |
6 |
1-2 |
p. 292-297 6 p. |
artikel |
63 |
Simple hollow cathode ion source
|
Tonegawa, A. |
|
1985 |
6 |
1-2 |
p. 129-132 4 p. |
artikel |
64 |
Some practical aspects of ion implantation for wear reduction
|
Wittkower, A. |
|
1985 |
6 |
1-2 |
p. 78-87 10 p. |
artikel |
65 |
Source for doubly charged ions
|
Le Roux, H.F. |
|
1985 |
6 |
1-2 |
p. 133-134 2 p. |
artikel |
66 |
The Narodny ion accelerator as an injector for a small cyclotron
|
Derenchuk, V. |
|
1985 |
6 |
1-2 |
p. 106-110 5 p. |
artikel |
67 |
The use of four-point probe sheet resistance measurements for characterizing low dose ion implantation
|
Smith, Alan K. |
|
1985 |
6 |
1-2 |
p. 382-388 7 p. |
artikel |
68 |
Three-stage acceleration system for high energy implanter
|
Pedersen, B.O. |
|
1985 |
6 |
1-2 |
p. 258-263 6 p. |
artikel |
69 |
Transient annealing for the production of n+ contact layers in GaAs
|
Sealy, B.J. |
|
1985 |
6 |
1-2 |
p. 325-329 5 p. |
artikel |
70 |
Transient annealing of ion implanted semiconductor materials
|
Wilson, S.R. |
|
1985 |
6 |
1-2 |
p. 307-315 9 p. |
artikel |
71 |
Uniform implantation with electrostatic scanning using a target repositioning technique
|
Turner, N. |
|
1985 |
6 |
1-2 |
p. 224-227 4 p. |
artikel |
72 |
Uniform large area beam scanning with a freeman source
|
Kanter, Michael |
|
1985 |
6 |
1-2 |
p. 116-118 3 p. |
artikel |
73 |
Wafer charging and beam interactions in ion implantation
|
Mack, M.E. |
|
1985 |
6 |
1-2 |
p. 405-411 7 p. |
artikel |
74 |
Wafer orientation for wayflow end stations
|
Brown, R.L. |
|
1985 |
6 |
1-2 |
p. 357-364 8 p. |
artikel |