| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Advancing the thermal stability of 3D ICs using logi-thermal simulation
|
Nagy, Gergely
|
|
|
46 |
12PA |
p. 1114-1120
|
artikel
|
| 2 |
A multilevel memristor–CMOS memory cell as a ReRAM
|
Rabbani, Payam
|
|
|
46 |
12PA |
p. 1283-1290
|
artikel
|
| 3 |
Analysis and design of a two-stage amplifier with enhanced performance
|
Mesri, Alireza
|
|
|
46 |
12PA |
p. 1304-1312
|
artikel
|
| 4 |
Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations
|
Elger, Gordon
|
|
|
46 |
12PA |
p. 1230-1238
|
artikel
|
| 5 |
A role-changeable fault-tolerant management strategy towards resilient NoC-based manycore systems
|
Wu, Zixu
|
|
|
46 |
12PA |
p. 1371-1379
|
artikel
|
| 6 |
A self-control technique for high efficiency class-E CMOS power amplifier
|
Dehqan, A.R.
|
|
|
46 |
12PA |
p. 1258-1262
|
artikel
|
| 7 |
A sub-mW pulse-based 5-bit flash ADC with a time-domain fully-digital reference ladder
|
Katic, Nikola
|
|
|
46 |
12PA |
p. 1343-1350
|
artikel
|
| 8 |
A 1-V feed-forward incremental modulator simulation based on gain-boost inverter for image sensors in 65-nm CMOS
|
Xu, Jiangtao
|
|
|
46 |
12PA |
p. 1325-1332
|
artikel
|
| 9 |
Characterization of phase change material systems using a thermal test device
|
Jordà, Xavier
|
|
|
46 |
12PA |
p. 1195-1201
|
artikel
|
| 10 |
Comparison of Green׳s function solutions for different heat conduction models in electronic nanostructures
|
Janicki, Marcin
|
|
|
46 |
12PA |
p. 1162-1166
|
artikel
|
| 11 |
Design of low power and high read stability 8T-SRAM memory based on the modified Gate Diffusion Input (m-GDI) in 32nm CNTFET technology
|
Abiri, Ebrahim
|
|
|
46 |
12PA |
p. 1351-1363
|
artikel
|
| 12 |
Dual-stage, Time-over-Threshold based prototype readout ASIC for silicon microstrip sensors
|
Kasinski, Krzysztof
|
|
|
46 |
12PA |
p. 1248-1257
|
artikel
|
| 13 |
Editorial board
|
|
|
|
46 |
12PA |
p. iii
|
artikel
|
| 14 |
Elimination of the effect of bottom-plate capacitors in C-2C DAC using a layout technique
|
Khorami, Ata
|
|
|
46 |
12PA |
p. 1275-1282
|
artikel
|
| 15 |
Experimental investigations on the offset correction of transient cooling curves of light emitting diodes based on JESD51-14 and simple semi-empirical approximations
|
Daiminger, Franz
|
|
|
46 |
12PA |
p. 1208-1215
|
artikel
|
| 16 |
Heat and mass transfer reduced order modeling approach of droplet microreactor based Lab-on-a-Chip devices
|
Németh, Márton
|
|
|
46 |
12PA |
p. 1152-1161
|
artikel
|
| 17 |
Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit
|
Melamed, Samson
|
|
|
46 |
12PA |
p. 1106-1113
|
artikel
|
| 18 |
Improved crosstalk noise modeling of MWCNT interconnects using FDTD technique
|
Kumar, Vobulapuram Ramesh
|
|
|
46 |
12PA |
p. 1263-1268
|
artikel
|
| 19 |
Joule heated metallic microwire devices for sub-microsecond T-jump experiments
|
Quintero, Carlos M.
|
|
|
46 |
12PA |
p. 1167-1174
|
artikel
|
| 20 |
Library based macro-modeling methodology for Through Silicon Via (TSV) arbitrary arrays
|
Ali, Karim
|
|
|
46 |
12PA |
p. 1291-1303
|
artikel
|
| 21 |
Low power, high speed carbon nanotube FET based level shifters for multi-V DD Systems-On-Chips
|
Pasupathy, K.R.
|
|
|
46 |
12PA |
p. 1269-1274
|
artikel
|
| 22 |
Low power SRAM design for 14nm GAA Si-nanowire technology
|
Kaushal, Gaurav
|
|
|
46 |
12PA |
p. 1239-1247
|
artikel
|
| 23 |
Multi-domain compact modeling of LEDs: An overview of models and experimental data
|
Poppe, András
|
|
|
46 |
12PA |
p. 1138-1151
|
artikel
|
| 24 |
Performance investigation of thermally enhanced polymer composite materials for microelectronics cooling
|
Eveloy, Valérie
|
|
|
46 |
12PA |
p. 1216-1224
|
artikel
|
| 25 |
Power and thermal constraints of modern system-on-a-chip computer
|
Rotem, Efraim
|
|
|
46 |
12PA |
p. 1225-1229
|
artikel
|
| 26 |
Robust and energy-efficient carbon nanotube FET-based MVL gates: A novel design approach
|
Sharifi, Fazel
|
|
|
46 |
12PA |
p. 1333-1342
|
artikel
|
| 27 |
Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction
|
Codecasa, Lorenzo
|
|
|
46 |
12PA |
p. 1129-1137
|
artikel
|
| 28 |
Thermal-electronic logic circuits: Scaling down
|
Mizsei, János
|
|
|
46 |
12PA |
p. 1175-1178
|
artikel
|
| 29 |
Thermal investigations of integrated circuits and systems, THERMINIC’14
|
Rencz, Marta
|
|
|
46 |
12PA |
p. 1105
|
artikel
|
| 30 |
Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink(s)
|
Takács, G.
|
|
|
46 |
12PA |
p. 1202-1207
|
artikel
|
| 31 |
Thermal transient measurement of insulated gate devices using the thermal properties of the channel resistance and parasitic elements
|
Farkas, Gabor
|
|
|
46 |
12PA |
p. 1185-1194
|
artikel
|
| 32 |
Towards electro-thermo-mechanical simulation of integrated circuits in standard CAD environment
|
Garci, Maroua
|
|
|
46 |
12PA |
p. 1121-1128
|
artikel
|
| 33 |
True random number generation using CMOS Boolean chaotic oscillator
|
Park, Myunghwan
|
|
|
46 |
12PA |
p. 1364-1370
|
artikel
|
| 34 |
Using a Monte-Carlo model to identify best filler arrangement in thermally conductive materials
|
Descamps, P.
|
|
|
46 |
12PA |
p. 1179-1184
|
artikel
|
| 35 |
Variability modeling in near-threshold CMOS digital circuits
|
Slimani, M.
|
|
|
46 |
12PA |
p. 1313-1324
|
artikel
|
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