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Details for article 30 of 35 found articles
| Title: |
Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink(s) |
| Author: |
Takács, G. Szabó, P.G. Bognár, Gy. |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 46 (2015) nr. 12PA pages 6 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 30 of 35 found articles
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