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35 results found

no	title	author	magazine	year	volume	issue	page(s)	type
1	Advancing the thermal stability of 3D ICs using logi-thermal simulation	Nagy, Gergely			46	12PA	p. 1114-1120	article
2	A multilevel memristor–CMOS memory cell as a ReRAM	Rabbani, Payam			46	12PA	p. 1283-1290	article
3	Analysis and design of a two-stage amplifier with enhanced performance	Mesri, Alireza			46	12PA	p. 1304-1312	article
4	Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations	Elger, Gordon			46	12PA	p. 1230-1238	article
5	A role-changeable fault-tolerant management strategy towards resilient NoC-based manycore systems	Wu, Zixu			46	12PA	p. 1371-1379	article
6	A self-control technique for high efficiency class-E CMOS power amplifier	Dehqan, A.R.			46	12PA	p. 1258-1262	article
7	A sub-mW pulse-based 5-bit flash ADC with a time-domain fully-digital reference ladder	Katic, Nikola			46	12PA	p. 1343-1350	article
8	A 1-V feed-forward incremental modulator simulation based on gain-boost inverter for image sensors in 65-nm CMOS	Xu, Jiangtao			46	12PA	p. 1325-1332	article
9	Characterization of phase change material systems using a thermal test device	Jordà, Xavier			46	12PA	p. 1195-1201	article
10	Comparison of Green׳s function solutions for different heat conduction models in electronic nanostructures	Janicki, Marcin			46	12PA	p. 1162-1166	article
11	Design of low power and high read stability 8T-SRAM memory based on the modified Gate Diffusion Input (m-GDI) in 32nm CNTFET technology	Abiri, Ebrahim			46	12PA	p. 1351-1363	article
12	Dual-stage, Time-over-Threshold based prototype readout ASIC for silicon microstrip sensors	Kasinski, Krzysztof			46	12PA	p. 1248-1257	article
13	Editorial board				46	12PA	p. iii	article
14	Elimination of the effect of bottom-plate capacitors in C-2C DAC using a layout technique	Khorami, Ata			46	12PA	p. 1275-1282	article
15	Experimental investigations on the offset correction of transient cooling curves of light emitting diodes based on JESD51-14 and simple semi-empirical approximations	Daiminger, Franz			46	12PA	p. 1208-1215	article
16	Heat and mass transfer reduced order modeling approach of droplet microreactor based Lab-on-a-Chip devices	Németh, Márton			46	12PA	p. 1152-1161	article
17	Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit	Melamed, Samson			46	12PA	p. 1106-1113	article
18	Improved crosstalk noise modeling of MWCNT interconnects using FDTD technique	Kumar, Vobulapuram Ramesh			46	12PA	p. 1263-1268	article
19	Joule heated metallic microwire devices for sub-microsecond T-jump experiments	Quintero, Carlos M.			46	12PA	p. 1167-1174	article
20	Library based macro-modeling methodology for Through Silicon Via (TSV) arbitrary arrays	Ali, Karim			46	12PA	p. 1291-1303	article
21	Low power, high speed carbon nanotube FET based level shifters for multi-V DD Systems-On-Chips	Pasupathy, K.R.			46	12PA	p. 1269-1274	article
22	Low power SRAM design for 14nm GAA Si-nanowire technology	Kaushal, Gaurav			46	12PA	p. 1239-1247	article
23	Multi-domain compact modeling of LEDs: An overview of models and experimental data	Poppe, András			46	12PA	p. 1138-1151	article
24	Performance investigation of thermally enhanced polymer composite materials for microelectronics cooling	Eveloy, Valérie			46	12PA	p. 1216-1224	article
25	Power and thermal constraints of modern system-on-a-chip computer	Rotem, Efraim			46	12PA	p. 1225-1229	article
26	Robust and energy-efficient carbon nanotube FET-based MVL gates: A novel design approach	Sharifi, Fazel			46	12PA	p. 1333-1342	article
27	Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction	Codecasa, Lorenzo			46	12PA	p. 1129-1137	article
28	Thermal-electronic logic circuits: Scaling down	Mizsei, János			46	12PA	p. 1175-1178	article
29	Thermal investigations of integrated circuits and systems, THERMINIC’14	Rencz, Marta			46	12PA	p. 1105	article
30	Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink(s)	Takács, G.			46	12PA	p. 1202-1207	article
31	Thermal transient measurement of insulated gate devices using the thermal properties of the channel resistance and parasitic elements	Farkas, Gabor			46	12PA	p. 1185-1194	article
32	Towards electro-thermo-mechanical simulation of integrated circuits in standard CAD environment	Garci, Maroua			46	12PA	p. 1121-1128	article
33	True random number generation using CMOS Boolean chaotic oscillator	Park, Myunghwan			46	12PA	p. 1364-1370	article
34	Using a Monte-Carlo model to identify best filler arrangement in thermally conductive materials	Descamps, P.			46	12PA	p. 1179-1184	article
35	Variability modeling in near-threshold CMOS digital circuits	Slimani, M.			46	12PA	p. 1313-1324	article

35 results found

Koninklijke Bibliotheek - National Library of the Netherlands