| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Challenges of the emerging microsystems industry
|
Ohlckers, Per
|
|
|
29 |
9 |
p. 587-600
|
artikel
|
| 2 |
CMOS-compatible smart temperature sensors
|
Bianchi, R.A.
|
|
|
29 |
9 |
p. 627-636
|
artikel
|
| 3 |
Editorial introduction
|
Henini, M.
|
|
|
29 |
9 |
p. 577-578
|
artikel
|
| 4 |
Fabrication and characterization of electrostatically driven silicon microbeams
|
Attia, P.
|
|
|
29 |
9 |
p. 641-644
|
artikel
|
| 5 |
III–V micromachined devices for microsystems
|
Leclercq, J.L.
|
|
|
29 |
9 |
p. 613-619
|
artikel
|
| 6 |
Micro actuators and their applications
|
Fujita, Hiroyuki
|
|
|
29 |
9 |
p. 637-640
|
artikel
|
| 7 |
Monolithic integration of the digitized pressure sensor and the micromechanical switch for the application of a pressure transponder
|
Chun, Kukjin
|
|
|
29 |
9 |
p. 621-626
|
artikel
|
| 8 |
Patents alert
|
|
|
|
29 |
9 |
p. 659-668
|
artikel
|
| 9 |
Possible application of micromachine technology for nanometer lithography
|
Wada, Y.
|
|
|
29 |
9 |
p. 601-611
|
artikel
|
| 10 |
REBECA-3D: the thermal conductive solver for microelectronics
|
Fradin, J.P.
|
|
|
29 |
9 |
p. 651-656
|
artikel
|
| 11 |
Some issues for microsystem packaging in plastic and 3D
|
Morrissey, A.
|
|
|
29 |
9 |
p. 645-650
|
artikel
|
| 12 |
Technology for the high-volume manufacturing of integrated surface-micromachined accelerometer products
|
Chau, Kevin H.-L.
|
|
|
29 |
9 |
p. 579-586
|
artikel
|
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