| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comparison of MOS processes for VLSI Part I
|
|
|
|
18 |
5 |
p. 61
|
artikel
|
| 2 |
A comprehensive sequence for the electron beam exposure system
|
|
|
|
18 |
5 |
p. 63
|
artikel
|
| 3 |
Ammonium persulfate as a stripping and cleaning oxidant
|
|
|
|
18 |
5 |
p. 62
|
artikel
|
| 4 |
An approach to ensure stability of precision laser trimmed thick film resistors
|
|
|
|
18 |
5 |
p. 64
|
artikel
|
| 5 |
A novel memory device for VLSI E2PROM
|
|
|
|
18 |
5 |
p. 60
|
artikel
|
| 6 |
A simulative approach to electron conduction is thickfilm resistors
|
|
|
|
18 |
5 |
p. 64
|
artikel
|
| 7 |
Bipolar device packaging-electrical, thermal, and mechanical stress considerations
|
|
|
|
18 |
5 |
p. 61
|
artikel
|
| 8 |
Bipolar gate array delivers fast signal processing
|
|
|
|
18 |
5 |
p. 60
|
artikel
|
| 9 |
Book review
|
Shute, Malcolm
|
|
|
18 |
5 |
p. 45
|
artikel
|
| 10 |
Ceramic on metal substrates produced by plasma spraying for thick film technology
|
|
|
|
18 |
5 |
p. 62
|
artikel
|
| 11 |
Compatibility in microcomputers
|
|
|
|
18 |
5 |
p. 59
|
artikel
|
| 12 |
Computer power to the people: computer resource centres or home terminals? Two scenarios
|
|
|
|
18 |
5 |
p. 61
|
artikel
|
| 13 |
Computers put you in the picture
|
|
|
|
18 |
5 |
p. 59
|
artikel
|
| 14 |
Current noise is thick and thin film resistors
|
|
|
|
18 |
5 |
p. 64
|
artikel
|
| 15 |
CV characteristics of MOS capacitors with two top capacitive contacts
|
McGillivray, I.G.
|
|
|
18 |
5 |
p. 25-27
|
artikel
|
| 16 |
Data processing caught in the act
|
|
|
|
18 |
5 |
p. 60
|
artikel
|
| 17 |
Design for testability—a survey
|
|
|
|
18 |
5 |
p. 63
|
artikel
|
| 18 |
Design system for semicustom VLSI circuits
|
|
|
|
18 |
5 |
p. 61
|
artikel
|
| 19 |
Design systems for VLSI circuits
|
|
|
|
18 |
5 |
p. 47
|
artikel
|
| 20 |
Developments in crystal growth from high-temperature solutions
|
|
|
|
18 |
5 |
p. 62
|
artikel
|
| 21 |
Editorial
|
Butcher, John B.
|
|
|
18 |
5 |
p. 3
|
artikel
|
| 22 |
Electrical properties of Si−SiO2 structures treated in helium plasma
|
Kassabov, J.
|
|
|
18 |
5 |
p. 5-12
|
artikel
|
| 23 |
Evaluation of Du Pont copper-compatible resistor system
|
|
|
|
18 |
5 |
p. 64
|
artikel
|
| 24 |
Failures induced by electromigration in ECL 100k devices
|
|
|
|
18 |
5 |
p. 62
|
artikel
|
| 25 |
Fast CMOS logic bids for TTL sockets in most systems
|
|
|
|
18 |
5 |
p. 60
|
artikel
|
| 26 |
Fifth generation computing promises optimistic outlook for 1990's
|
|
|
|
18 |
5 |
p. 59
|
artikel
|
| 27 |
Forthcoming events
|
|
|
|
18 |
5 |
p. 58
|
artikel
|
| 28 |
Handbook of Microelectronics Packaging and Interconnection Technologies
|
Pitt, Keith
|
|
|
18 |
5 |
p. 45-46
|
artikel
|
| 29 |
Impact of custom VLSI technology
|
|
|
|
18 |
5 |
p. 60
|
artikel
|
| 30 |
Improved planar isolation with buried-channel MOS-FETs
|
|
|
|
18 |
5 |
p. 61
|
artikel
|
| 31 |
Interactive authoring system on a small personal computer
|
|
|
|
18 |
5 |
p. 60
|
artikel
|
| 32 |
Investigation of thick film technology for microwave applications
|
Stennes, M.J.
|
|
|
18 |
5 |
p. 29-35
|
artikel
|
| 33 |
It's still fast times for a hot industry
|
|
|
|
18 |
5 |
p. 61
|
artikel
|
| 34 |
Metal migrations outside the package during accelerated life tests
|
|
|
|
18 |
5 |
p. 63
|
artikel
|
| 35 |
Methodologies for full custom VLSI design
|
|
|
|
18 |
5 |
p. 61
|
artikel
|
| 36 |
Modular approach to CMOS technology tailors process to application
|
|
|
|
18 |
5 |
p. 60
|
artikel
|
| 37 |
On discrete hazard functions
|
|
|
|
18 |
5 |
p. 63
|
artikel
|
| 38 |
Parliamentary report
|
|
|
|
18 |
5 |
p. 49-51
|
artikel
|
| 39 |
Personal computer graphics standards
|
|
|
|
18 |
5 |
p. 59
|
artikel
|
| 40 |
Removal processes for damage and contamination after CF4/40%H2 reactive ion etching of silicon
|
Singh, Awatar
|
|
|
18 |
5 |
p. 13-24
|
artikel
|
| 41 |
Research and Development
|
|
|
|
18 |
5 |
p. 52-57
|
artikel
|
| 42 |
Roop
|
|
|
|
18 |
5 |
p. 60
|
artikel
|
| 43 |
Second generation' silicon compilers
|
Dlay, S.S.
|
|
|
18 |
5 |
p. 37-44
|
artikel
|
| 44 |
Self-consistent theory of diagonal and off-diagonal disorder in the screened impurity band of doped semiconductors
|
|
|
|
18 |
5 |
p. 62
|
artikel
|
| 45 |
Semiconductor processing
|
|
|
|
18 |
5 |
p. 63
|
artikel
|
| 46 |
Solder pastes for microelectronics
|
|
|
|
18 |
5 |
p. 62
|
artikel
|
| 47 |
Status and prospects for gallium arsenide technology
|
|
|
|
18 |
5 |
p. 60
|
artikel
|
| 48 |
The ageing behaviour of commercial thick-film resistors
|
|
|
|
18 |
5 |
p. 63-64
|
artikel
|
| 49 |
The bubble is surfacing
|
|
|
|
18 |
5 |
p. 59
|
artikel
|
| 50 |
The integrated office: its present and future
|
|
|
|
18 |
5 |
p. 59-60
|
artikel
|
| 51 |
Thermal Design of Electronic Circuit Boards and Packages
|
Pitt, Keith
|
|
|
18 |
5 |
p. 46
|
artikel
|
| 52 |
The role of inorganic materials in dry-processed resist technology
|
|
|
|
18 |
5 |
p. 62
|
artikel
|
| 53 |
Transition to one micro technology: Part 2
|
|
|
|
18 |
5 |
p. 61
|
artikel
|
| 54 |
Using micros to manage production
|
|
|
|
18 |
5 |
p. 60
|
artikel
|
| 55 |
ZRM 20—an electron-beam mask and wafer measuring and inspection system
|
|
|
|
18 |
5 |
p. 63
|
artikel
|
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