| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A ceramic capacitor substrate for high speed switching VLSI chips
|
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|
|
16 |
4 |
p. 40-41
|
artikel
|
| 2 |
A CMOS process for VLSI instrumentation
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16 |
4 |
p. 44
|
artikel
|
| 3 |
Advances in VLSI plasma etching
|
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16 |
4 |
p. 43
|
artikel
|
| 4 |
An integrated LSI design aids system
|
Martin, G.
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|
16 |
4 |
p. 38
|
artikel
|
| 5 |
A novel approach for higher yield in thick-film resistors
|
Matkari, A.K.
|
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|
16 |
4 |
p. 42
|
artikel
|
| 6 |
Answer to the comment by Dzekov Tomislav and Arsov Goce in Microelectronics Journal Vol. 15 No 3 by B. L. Dokić (See page 32)
|
Dokić, Branko L.
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16 |
4 |
p. 30-31
|
artikel
|
| 7 |
A review of self-scanned image sensors
|
Beynon, J.D.E.
|
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|
16 |
4 |
p. 39
|
artikel
|
| 8 |
A submicron CMOS/SOS process for VLSI
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|
16 |
4 |
p. 42-43
|
artikel
|
| 9 |
A thick film conductive microline fabrication technique
|
Singh, Awatar
|
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|
16 |
4 |
p. 17-21
|
artikel
|
| 10 |
Bonding refractory sputtering targets
|
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|
16 |
4 |
p. 43
|
artikel
|
| 11 |
Comments on ‘Influence of series and parallel transistors on DC characteristics of CMOS logic circuits’
|
Tomislav, Dzekov
|
|
|
16 |
4 |
p. 32-33
|
artikel
|
| 12 |
Comparison of new technologies for VLSI: possibilities and limitations
|
Nishi, Yoshio
|
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|
16 |
4 |
p. 39
|
artikel
|
| 13 |
Controlled anisotropic etching of polysilicon
|
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|
16 |
4 |
p. 43
|
artikel
|
| 14 |
Copper impurity levels in silicon
|
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16 |
4 |
p. 41
|
artikel
|
| 15 |
DKG 160 photomask inspection equipment localizes defects in IC patterns
|
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|
16 |
4 |
p. 44
|
artikel
|
| 16 |
Editorial
|
Butcher, John
|
|
|
16 |
4 |
p. 3-4
|
artikel
|
| 17 |
Evaluating the MIL-STD-883B alternate die visual screen for LSI
|
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|
16 |
4 |
p. 41
|
artikel
|
| 18 |
Forthcoming events
|
|
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|
16 |
4 |
p. 46-48
|
artikel
|
| 19 |
How a new generation of microprocessors supports modular programming in high-level languages
|
Hartman, Alfred C.
|
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|
16 |
4 |
p. 39
|
artikel
|
| 20 |
Ideal projection lithography using a multilayer resist process
|
|
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|
16 |
4 |
p. 42
|
artikel
|
| 21 |
Ion distribution near a mask edge with arbitrary shape for VLSI IC applications
|
Lutsch, A.G.K.
|
|
|
16 |
4 |
p. 5-16
|
artikel
|
| 22 |
Isolation tecniques for very large scale integration
|
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|
16 |
4 |
p. 41
|
artikel
|
| 23 |
Laser processing cuts wider swath
|
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|
16 |
4 |
p. 44
|
artikel
|
| 24 |
Linewidth measurement on IC masks by diffraction from grating test patterns
|
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|
16 |
4 |
p. 44
|
artikel
|
| 25 |
Mechanical technology and quality assurance as applied to a video recorder drive mechanism
|
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16 |
4 |
p. 44
|
artikel
|
| 26 |
Metal migrations outside the package during accelerated life tests
|
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|
16 |
4 |
p. 43
|
artikel
|
| 27 |
Metrology in mask manufacturing
|
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|
16 |
4 |
p. 43
|
artikel
|
| 28 |
Multi-chamber dry etching system
|
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|
16 |
4 |
p. 43
|
artikel
|
| 29 |
Multi-chip module test and diagnostic methodology
|
|
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|
16 |
4 |
p. 44
|
artikel
|
| 30 |
New generation semiconductor C. W. laser packages with full herimeticity, integral power monitoring and direct fibre optic launching
|
Ashton, J.E.U.
|
|
|
16 |
4 |
p. 39-40
|
artikel
|
| 31 |
New thick film multilayer interconnection technology using a Nd-YAG laser
|
|
|
|
16 |
4 |
p. 40
|
artikel
|
| 32 |
[No title]
|
Arrowsmith, T.
|
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|
16 |
4 |
p. 35
|
artikel
|
| 33 |
[No title]
|
Arrowsmith, T.
|
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|
16 |
4 |
p. 35
|
artikel
|
| 34 |
[No title]
|
Wilson, Kenneth F.
|
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|
16 |
4 |
p. 36
|
artikel
|
| 35 |
Novel insensitive minimal-grounded-element dual-polarity ratio-type function generation
|
Nandi, R.
|
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|
16 |
4 |
p. 25-28
|
artikel
|
| 36 |
Packaging reliability—how to define and measure it
|
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|
16 |
4 |
p. 41-42
|
artikel
|
| 37 |
Pin-fet receivers for 1.3 micron fibre optic systems
|
Burges, J.W.
|
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|
16 |
4 |
p. 40
|
artikel
|
| 38 |
Power semiconductor packaging
|
|
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|
16 |
4 |
p. 44
|
artikel
|
| 39 |
Semiconductor processing
|
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|
16 |
4 |
p. 43
|
artikel
|
| 40 |
Significant features of solder connections to gold-plated thin films
|
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|
16 |
4 |
p. 40
|
artikel
|
| 41 |
Silver migration in thick film conductors and chip attachment resins
|
Coleman, M.V.
|
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|
16 |
4 |
p. 42
|
artikel
|
| 42 |
Some considerations for peripheral circuits for bubble memory
|
Okada, M.
|
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|
16 |
4 |
p. 39
|
artikel
|
| 43 |
Specific contact resistance and noise in contacts on thin layers
|
|
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|
16 |
4 |
p. 44
|
artikel
|
| 44 |
The chemistry and stability of ruthenium-based resistors
|
|
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|
16 |
4 |
p. 41
|
artikel
|
| 45 |
The contiguous disk technology for high density bubble memories
|
Jouve, H.
|
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|
16 |
4 |
p. 38-39
|
artikel
|
| 46 |
The development of fibre optic systems for industrial applications
|
Harper, D.W.
|
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|
16 |
4 |
p. 40
|
artikel
|
| 47 |
Thermal-wave microscopy
|
|
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|
16 |
4 |
p. 42
|
artikel
|
| 48 |
The role of transport in very small devices for VLSI
|
Ferry, D.K.
|
|
|
16 |
4 |
p. 38
|
artikel
|
| 49 |
The silicon process balancing act for VLSI
|
|
|
|
16 |
4 |
p. 43
|
artikel
|
| 50 |
The use of molybdenum in semiconductor devices
|
|
|
|
16 |
4 |
p. 41
|
artikel
|
| 51 |
Thick film materials and reliability
|
|
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|
16 |
4 |
p. 40
|
artikel
|
| 52 |
Trends in metallization materials
|
|
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|
16 |
4 |
p. 41
|
artikel
|
| 53 |
Use of PVC for front surface protection of wafers during electrolytic gold backing
|
Nieuwoudt, Michèl K.
|
|
|
16 |
4 |
p. 22-23
|
artikel
|
| 54 |
Wafer steppers: considering the issues
|
|
|
|
16 |
4 |
p. 42
|
artikel
|
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